JPS63170482A - Adhesive for metal-clad laminate - Google Patents
Adhesive for metal-clad laminateInfo
- Publication number
- JPS63170482A JPS63170482A JP59287A JP59287A JPS63170482A JP S63170482 A JPS63170482 A JP S63170482A JP 59287 A JP59287 A JP 59287A JP 59287 A JP59287 A JP 59287A JP S63170482 A JPS63170482 A JP S63170482A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- resin
- melamine resin
- polyvinyl butyral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 20
- 239000004640 Melamine resin Substances 0.000 claims abstract description 20
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 17
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 239000003377 acid catalyst Substances 0.000 claims abstract description 8
- 239000003054 catalyst Substances 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 12
- 239000002904 solvent Substances 0.000 abstract description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 abstract description 3
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- -1 methylol groups Chemical group 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 235000013405 beer Nutrition 0.000 description 10
- 239000005011 phenolic resin Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920003270 Cymel® Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、半田耐熱性、耐トラツキング性に浸れた、安
価な金属張積層板用ｆｔ１着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention] (Industrial Application Field) The present invention relates to an inexpensive F1 adhesive for metal-clad laminates that has excellent soldering heat resistance and tracking resistance.
（従来の技術）
金属張積層板に要求される特性には種々あるが、金属箔
と基材とを接着している接着剤の性状に大きく依存して
いる特性として、半田耐熱性とビール強度がある。 こ
の特性に適合する接着剤として、従来ポリビニルブチラ
ール樹脂にフェノール樹脂を配合した接着剤が用いられ
てきｔこ。 ところが近年、電気機器の高密度実装化に
伴って半田耐熱性およびビール強度に加えて、耐トラツ
キング性に対する要求レベルがより厳しいものになって
さているが、この耐トラツキング性も接着剤の性状に大
きく依存している。 また、材料の低廉化の要請も近年
特に強くなってきている。(Prior art) There are various properties required for metal-clad laminates, but the properties that are largely dependent on the properties of the adhesive that bonds the metal foil and the base material are soldering heat resistance and beer strength. There is. Conventionally, as an adhesive that meets this characteristic, an adhesive made by blending a phenol resin with a polyvinyl butyral resin has been used. However, in recent years, with the high-density packaging of electrical equipment, requirements for tracking resistance have become more stringent in addition to solder heat resistance and beer strength, but this tracking resistance also depends on the properties of the adhesive. It depends a lot. In addition, the demand for cheaper materials has become particularly strong in recent years.
（発明が解決しようとする問題点）
しかし、ポリビニルブチラール樹脂にフェノール樹脂を
配合した従来の接着剤は、耐トラツキング特性に対して
何等のと慮もされたものでなかった。 すなわち、従来
の接着剤は半田耐熱性が浸れているものの、フェノール
樹脂が悪影響を与えて耐トラツキング性が劣っている。(Problems to be Solved by the Invention) However, conventional adhesives in which a phenol resin is blended with a polyvinyl butyral resin have not been designed with any consideration given to anti-tracking properties. That is, although conventional adhesives have excellent soldering heat resistance, they have poor tracking resistance due to the adverse effect of the phenol resin.
このことから、フェノール樹脂の配合量を減らして耐
トラツキング性の向上を図ると半Ｅ日耐熱性が低下して
しまい、半田耐熱性と耐トラツキング性は二律背反とい
う傾向にあった。 本発明はこの事情に鑑みてなされた
もので、半田耐熱性とともに、耐トラッキング性に優れ
、かつビール強度も実用レベルにあるという、安価な金
属張積層板用接着剤を提供しようとするものである。From this, if the tracking resistance is improved by reducing the amount of phenol resin blended, the half-E day heat resistance decreases, and the soldering heat resistance and the tracking resistance tend to be antithetical. The present invention was made in view of this situation, and aims to provide an inexpensive adhesive for metal-clad laminates that has excellent solder heat resistance and tracking resistance, and has beer strength at a practical level. be.
［光明の構成］
（問題点を解決するための手段と作用）本発明者らは、
上記の目的を達成しようと鋭意研究を重ねた結果、後述
する組成の接着剤が半田耐熱性、耐トラツキング性に優
れ、ビール強度も実用レベルであり、そしてまた安価で
あるという接活剤を見いだし、本発明を完成したもので
ある。[Composition of the light] (Means and effects for solving the problem) The present inventors,
As a result of extensive research to achieve the above objectives, we discovered an adhesive with the composition described below that has excellent solder heat resistance and tracking resistance, has a practical level of beer strength, and is also inexpensive. , has completed the present invention.
づイｌわち、本発明は、
ポリビニルブチラール樹脂１００重１部、メラミン樹脂
３０〜３００ｆｉｉｆｉ部、及びシンクロペンタジエン
共重合体５〜１００重量部、並びに硬化触媒としての酸
触媒を前記メラミン樹脂１００重量部に対し０．１〜１
０重過部に配合してなることを特徴とする金属張積層板
用接着剤である。That is, the present invention includes 1 part by weight of polyvinyl butyral resin, 30 to 300 parts of melamine resin, 5 to 100 parts by weight of synchropentadiene copolymer, and an acid catalyst as a curing catalyst to 100 parts by weight of the melamine resin. 0.1 to 1 per part
This is an adhesive for metal-clad laminates, characterized in that it is blended in a zero weight part.
本発明の趣旨は、耐トラツキング性を向上させるため、
フェノール樹脂以外の熱硬化性樹脂を検討した結末、メ
ラミン樹脂が有効であり、また、ポリビニルブチラール
樹脂−メラミン樹脂系に酸触媒を適量配合することによ
り半田耐熱性、耐トラツキング性に優れた接着剤が得ら
れることを見いだし、更にポリビニルブチラール樹脂や
メラミン樹脂に比べて安価なシンクロペンタジエン共重
合体を配合することによって耐トラツキング性、十ＩＩ
Ｉ ＷＮ熱性を一部レベルに保持したまま、ビール強度
のよい、かつ安価な金属張積層板用接着剤を１１、ｄよ
うとするものである。The purpose of the present invention is to improve tracking resistance,
After studying thermosetting resins other than phenolic resin, we found that melamine resin is effective, and that by adding an appropriate amount of acid catalyst to the polyvinyl butyral resin-melamine resin system, we have created an adhesive with excellent soldering heat resistance and tracking resistance. It was discovered that the tracking resistance was improved by adding synchropentadiene copolymer, which is cheaper than polyvinyl butyral resin or melamine resin.
The objective is to create an inexpensive adhesive for metal-clad laminates that has good beer strength while maintaining IWN thermal properties at a certain level.
本発明に用いるポリビニルブチラール樹脂としては、特
に制限はなく、従来よりポリビニルブチラール樹脂系接
着剤で用いられているへ分子φタイプのものが望ましい
。 具体的なものとして、例えばＢＸ−１，８Ｘ−５（
積木化学工業社製、商品名）、＃５０００−Ａ、＃６０
００−Ｃ，＃５０００−ＥＰ、＃６０００−ＩＥＰ （
電気化学工業社製）等が挙げられ、これらは単独もしく
は２種以−Ｆの混合系として使用する。There are no particular limitations on the polyvinyl butyral resin used in the present invention, and it is desirable to use a polyvinyl butyral resin of the hemimolecule φ type that has been conventionally used in polyvinyl butyral resin adhesives. For example, BX-1, 8X-5 (
Manufactured by Block Chemical Industry Co., Ltd., product name), #5000-A, #60
00-C, #5000-EP, #6000-IEP (
(manufactured by Denki Kagaku Kogyo Co., Ltd.), and these are used alone or as a mixture of two or more types.
本発明に用いるメラミン樹脂としては、特に限定するも
のではないが、他の成分との相溶性の而から、メチロー
ルメラミン樹脂であって、溶解する溶剤の極性に応じて
メチロール基の一部もしくは全部をアルキル化したもの
であることが望ましい。 具体的なものとしては、例え
ば二カラツクＭＷ−３２，ＭＷ−２２，ＭＷ−２２Ａ、
ＭＷ−１２ＬＦ、ＭＷ−２４，ＭＷ−２５，ＭＸ−４０
゜ＭＸ−４り、ＭＸ−０３１．ＭＸ−０４１．ＭＸ−０
４２，ＭＸ−０５４，ＭＸ−７０３，ＭＸ−７０５、Ｍ
Ｘ−７０６，ＭＸ−７０８，ＭＳ−２１、ＭＳ−１１，
ＭＳ−００１，ＭＸ−００２゜ＭＸ−４０８，ＭＸ−２
８５（三相ケミカル社製、商品名）、サイメル３００，
３０１，３０３゜３２！ｌ）、３２７，３５０，３７０
．１１１６゜１１３０（三井東圧化学工業社製、商品名
）、ニーパン２０８Ｂ、２０ＳＬ−６０，２０Ｈ８゜２
１ＨＶ、２１Ｒ，２２Ｒ，２２Ｒ−６０゜１２０．１２
２，２２０，１３４，１３５゜１３６．６ＯＲ，６２，
９６−１，１６３゜１６４．１６５，８０８．９１−５
５ （三井東圧化学工業社製、商品名）等が挙げられ、
これらはいずれら単独もしくは２種以上の混合系として
使用される。 メラミン樹脂の配合割合は、ポリビニル
ブチラール樹脂１ｏｏａ ｕ部に対し、メラミン樹脂３
０〜３００重Φ部配合させた場合に半田耐熱性、耐トラ
ツキング性、およびビール強度に優れている。 配合割
合が３０重量部未満もしくは３００重吊部を超えると半
田耐熱性、および強度が低下し好ましくない。The melamine resin used in the present invention is not particularly limited, but from the viewpoint of compatibility with other components, methylol melamine resin, which has part or all of the methylol groups depending on the polarity of the solvent in which it is dissolved, is preferred. It is preferable that it be an alkylated product. Specifically, for example, two-carat MW-32, MW-22, MW-22A,
MW-12LF, MW-24, MW-25, MX-40
゜MX-4ri, MX-031. MX-041. MX-0
42, MX-054, MX-703, MX-705, M
X-706, MX-708, MS-21, MS-11,
MS-001, MX-002゜MX-408, MX-2
85 (manufactured by Sanso Chemical Co., Ltd., trade name), Cymel 300,
301,303°32! l), 327, 350, 370
．． 1116゜1130 (manufactured by Mitsui Toatsu Chemical Industry Co., Ltd., trade name), knee pants 208B, 20SL-60, 20H8゜2
1HV, 21R, 22R, 22R-60°120.12
2,220,134,135°136.6OR,62,
96-1,163゜164.165,808.91-5
5 (manufactured by Mitsui Toatsu Chemical Industry Co., Ltd., trade name), etc.
These may be used alone or as a mixture of two or more. The blending ratio of melamine resin is 3 parts of melamine resin to 100 parts of polyvinyl butyral resin.
When blended in an amount of 0 to 300 parts by weight, it has excellent soldering heat resistance, tracking resistance, and beer strength. If the blending ratio is less than 30 parts by weight or more than 300 parts by weight, the soldering heat resistance and strength will decrease, which is not preferable.
本発明に用いる酸触媒としては、メラミン樹脂の硬化触
媒として使用するものであればよく、特に限定されない
。 具体的な酸触媒としては、パラトルエンスルホン酸
、キャタニットＡ（日東化学社製、商品名）、燐酸等が
挙げられ、これらは単独もしくは２種以上混合して使用
する。 酸触媒の添加桁は、メラミン樹脂１００小串部
に対して０．１〜１０ｆｆｌ ｆａ部の範囲内であるこ
とが望ましい。The acid catalyst used in the present invention is not particularly limited as long as it can be used as a curing catalyst for melamine resin. Specific acid catalysts include paratoluenesulfonic acid, Catanite A (manufactured by Nitto Kagaku Co., Ltd., trade name), phosphoric acid, and the like, and these may be used alone or in combination of two or more. The amount of acid catalyst added is preferably within the range of 0.1 to 10 fflfa parts per 100 parts of melamine resin.
０．１ｉ聞部未満では半田耐熱性が劣り、１０重量部を
超えると半田耐熱性Ｊ３よびビール強度が低下しａｌま
しくない。If it is less than 0.1 part by weight, the soldering heat resistance will be poor, and if it exceeds 10 parts by weight, the soldering heat resistance J3 and beer strength will decrease and it will not be alright.
本鋒明に用いるジシクロペンタジーｒン共重合体としで
は、例えばフィントン＃１７００（日本ゼオン社製、商
品名）等が挙げられる。 シンクロペンタジエン共重合
体の配合量は、ポリビニルブチラール樹脂１００ｆｆｌ
１部に対し、シンクロペンタジエン共重合体５〜１０
０重は部の徒囲であることが望ましい。 配合槽が４１
部未満では低廉化の効果が少なく、１００重沿部を超え
ると半田耐熱性ｉＪ３よびビール強度が低トし好ましく
ない。Examples of the dicyclopentadiene copolymer used in this invention include Finton #1700 (manufactured by Nippon Zeon Co., Ltd., trade name). The blending amount of synchropentadiene copolymer is 100ffl of polyvinyl butyral resin.
Synchropentadiene copolymer 5 to 10 parts per part
It is desirable that the 0 weight is within the range of the area. There are 41 mixing tanks
If it is less than 100 parts, the cost reduction effect will be small, and if it exceeds 100 parts, solder heat resistance iJ3 and beer strength will decrease, which is not preferable.
本発明の接着剤の製造には溶剤を用いるが、その溶剤は
樹脂成分および触媒を溶解するものであれば良く、特に
限定されず広く使用することができる。 例えばメチル
アルコール、エチルアルコール、イソプロピルアルコー
ル、ブタノール等のアルコール系溶剤、アセトン、メチ
ルエチルケトン、メチルイソブチルケトン等のケトン系
溶剤、ベンゼン、トルエン、キシレン等の芳香族炭化水
素系溶剤、水などが挙げられ、これらは単独もしくは２
種以上の混合系として使用することができる。 また、
本発明の金属張積層板用接着剤は、上記の成分の他、本
発明の特性を害しない限り他の熱可塑性樹脂、フェノー
ル樹脂を除く熱硬化性樹脂を適量添加配合することがで
きる。 本発明の接着剤は、各成分を溶剤に溶解して極
めて容易に製造することができる。A solvent is used in the production of the adhesive of the present invention, but the solvent is not particularly limited as long as it dissolves the resin component and the catalyst, and can be widely used. Examples include alcohol solvents such as methyl alcohol, ethyl alcohol, isopropyl alcohol, and butanol, ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, aromatic hydrocarbon solvents such as benzene, toluene, and xylene, and water. These can be used alone or in combination
It can be used as a mixed system of more than one species. Also,
In addition to the above-mentioned components, the adhesive for metal-clad laminates of the present invention may contain appropriate amounts of other thermoplastic resins and thermosetting resins other than phenolic resins, as long as they do not impair the characteristics of the present invention. The adhesive of the present invention can be produced extremely easily by dissolving each component in a solvent.
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明はこれらの実施例によって限定されるものではない。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.
以下の実施例および比較例において「部」とはｌ＋重
量部」を意味する。In the following Examples and Comparative Examples, "parts" means 1+parts by weight.
実施例 １
ポリビニルブチラール樹脂ＢＸ−１（ｖ４水化学工業社
製、商品名）５０部、メラミン樹脂サイメル＃３７０（
三井東圧化学社製、商品名、固形分８８％）５７部、シ
ンクロペンタジエン共重合体フィントン＃１７００ （
日本ゼオン社製、商品名） ５０部、およびバラ１−ル
エンスルホンＭ Ｏ，５部を、メチルエチルケトン・ト
ルエン・メタノールの等予混合溶剤に不揮発分が２０％
になるように溶解させ−Ｃ１金属張積層板用接着剤（Ａ
）を得た。Example 1 50 parts of polyvinyl butyral resin BX-1 (manufactured by V4 Mizu Kagaku Kogyo Co., Ltd., trade name), melamine resin Cymel #370 (
Manufactured by Mitsui Toatsu Chemical Co., Ltd., trade name, solid content 88%) 57 parts, synchropentadiene copolymer Finton #1700 (
Nippon Zeon Co., Ltd., trade name) 50 parts and 1-luenesulfone MO, 5 parts were added to a premixed solvent of methyl ethyl ketone, toluene, and methanol with a non-volatile content of 20%.
-C1 metal-clad laminate adhesive (A
) was obtained.
実施例 ２
ポリビニルブチラール樹脂デンカブチラール＃６０００
（電気化半丁［業社製、商品名）６０部、メラミン樹
脂二カラツクＭＳ−００１（三相ケミカル社製、商品名
）６７部、シンクロペンタジエン共重合体フィントン＃
１７００ ＜日本ゼオン社製、商品名） ３０部、およ
びキャタニットＡ（日東化学工業社製、商品名）０．４
部を、メチルエチルケトン・トルエン・メタノールの等
量混合溶剤に不揮発分が２０％になるように溶解して、
金属張積層板用接着剤（Ｂ）を得た。Example 2 Polyvinyl butyral resin Denka Butyral #6000
(Electrification Hancho [manufactured by Gyosha, trade name] 60 parts, melamine resin Nikaratsuku MS-001 (manufactured by Sanso Chemical Co., Ltd., trade name) 67 parts, synchropentadiene copolymer Finton #
1700 <Nippon Zeon Co., Ltd., trade name) 30 parts, and Catanite A (Nitto Kagaku Kogyo Co., Ltd., trade name) 0.4
part was dissolved in a mixed solvent of equal amounts of methyl ethyl ketone, toluene, and methanol so that the nonvolatile content was 20%,
An adhesive (B) for metal-clad laminates was obtained.
実施Ｔｆ／４３
ポリビニルブチラール樹脂ＢＸ−１（積木化学工業社製
、商品名）６０部、メラミン樹脂サイメル＃３２５（三
井東圧化学社製、商品名、固形分８０％） ５０部、シ
ンクロペンタジエン共重合体フィントン＃１７００ （
前出） ５部、およびパラトルエンスルホン酸０．４部
を、メチルエチルケトン・トルエン・メタノールの等四
混合溶剤に不揮発分が２０％になるように溶解して、金
属張積層板用接着剤（Ｃ）を得た。Implementation Tf/43 60 parts of polyvinyl butyral resin BX-1 (manufactured by Block Chemical Industry Co., Ltd., trade name), 50 parts of melamine resin Cymel #325 (manufactured by Mitsui Toatsu Chemical Co., Ltd., trade name, solid content 80%), synchropentadiene Polymer Finton #1700 (
Adhesive for metal-clad laminates (C ) was obtained.
比較例 １
ポリビニルブチラール樹脂ＢＸ−１（前出）５０部、お
よびレゾール型フェノール樹脂５０部を、メチルエチル
ケトン・トルエン・メタノールの等圭混合溶剤に不揮発
分が２０％になるように溶解して、金属張積層板用接着
剤（Ｄ＞を得た。Comparative Example 1 50 parts of polyvinyl butyral resin BX-1 (mentioned above) and 50 parts of resol type phenol resin were dissolved in a mixed solvent of methyl ethyl ketone, toluene, methanol, etc. so that the nonvolatile content was 20%. An adhesive for stretched laminates (D>) was obtained.
比較例 ２
ポリビニルブチールール樹脂［３Ｘ−１（前出） ５０
部、メラミン樹脂サイメル＃３７０（前出）５７部、お
よびパラトルエンスルホンｌ’ｌ Ｏ，５部を、メチル
エチルケトン・トルエン・メタノールの等量混合溶剤に
不揮発分が２０％になるように溶解して、金属へ積層板
用接着剤（Ｅ）を得た。Comparative Example 2 Polyvinyl butyrule resin [3X-1 (mentioned above) 50
1 part, 57 parts of melamine resin Cymel #370 (mentioned above), and 5 parts of paratoluenesulfone l'l O were dissolved in a mixed solvent of equal amounts of methyl ethyl ketone, toluene, and methanol so that the nonvolatile content was 20%. , an adhesive for metal laminates (E) was obtained.
実施例１〜３および比較例１〜２で得られた接着剤Ａ〜
Ｅを用いて、厚さ３５μｍの銅箔に付着固形分３０ｇ
／ＩＩ ２になるように塗布乾燥の模、フェノール樹脂
含浸紙と共に重ね合わせ加熱加圧して銅張積層板をつく
った。 これらの銅張積層板について耐１−ラッキング
性、半田耐熱性、ビール強度を試験したのでその結果を
第１表に示したが、いずれも本発明の顕著な効果が認め
られた。Adhesives A~ obtained in Examples 1-3 and Comparative Examples 1-2
Using E, solid content 30g adhered to 35μm thick copper foil.
A copper-clad laminate was prepared by heating and pressing the coating and drying sample so that the coating was coated and dried so that the coating was coated and dried. These copper-clad laminates were tested for 1-racking resistance, soldering heat resistance, and beer strength, and the results are shown in Table 1, in which the remarkable effects of the present invention were recognized.
第１表
＊１：ＩＥＣ法６００Ｖ
＊２ ：、Ｊ ｌ５−Ｃ−６４８１によって測定＊３
：ＪＩＳ−Ｃ−６４８１によって測定［Ｒ，ｌ！ｌＪの
効果］
以上の説明および第１表から明らかなように、本発明の
金属張積層板用接着剤は、特定の組成で構成され、その
結果半田耐熱性、耐トラツキング性に優れ、かつビール
強度のよい、安価なものであるので、工業上何益なもの
である。Table 1 *1: IEC method 600V *2: Measured by J15-C-6481 *3
: Measured according to JIS-C-6481 [R, l! Effect of lJ] As is clear from the above explanation and Table 1, the adhesive for metal-clad laminates of the present invention has a specific composition, and as a result, it has excellent soldering heat resistance and tracking resistance, and has excellent beer resistance. Since it is strong and inexpensive, it has many industrial benefits.
Claims (1)
樹脂３０〜３００重量部、及びシンクロペンタジエン共
重合体５〜１００重量部、並びに硬化触媒としての酸触
媒を前記メラミン樹脂１００重量部に対し０．１〜１０
重量部に配合してなることを特徴とする金属張積層板用
接着剤。1 100 parts by weight of polyvinyl butyral resin, 30 to 300 parts by weight of melamine resin, 5 to 100 parts by weight of synchropentadiene copolymer, and 0.1 to 10 parts by weight of an acid catalyst as a curing catalyst per 100 parts by weight of the melamine resin.
An adhesive for metal-clad laminates, characterized in that it is formulated in parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59287A JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59287A JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170482A true JPS63170482A (en) | 1988-07-14 |
| JP2575680B2 JP2575680B2 (en) | 1997-01-29 |
Family
ID=11478006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59287A Expired - Lifetime JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575680B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041157A1 (en) * | 1999-12-03 | 2001-06-07 | Bridgestone Corporation | Anisotropically conductive film |
| JP2020519732A (en) * | 2017-06-27 | 2020-07-02 | エルジー・ケム・リミテッド | Adhesive composition, protective film and polarizing plate containing adhesive layer containing the same, and image display device containing the same |
| JP2020531642A (en) * | 2017-12-15 | 2020-11-05 | エルジー・ケム・リミテッド | Adhesive composition |
-
1987
- 1987-01-07 JP JP59287A patent/JP2575680B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041157A1 (en) * | 1999-12-03 | 2001-06-07 | Bridgestone Corporation | Anisotropically conductive film |
| EP1168373A1 (en) * | 1999-12-03 | 2002-01-02 | Bridgestone Corporation | Anisotropically conductive film |
| US6706391B2 (en) | 1999-12-03 | 2004-03-16 | Bridgestone Corporation | Anisotropically electroconductive film |
| EP1168373A4 (en) * | 1999-12-03 | 2004-11-17 | Bridgestone Corp | Anisotropically conductive film |
| EP1612252A2 (en) * | 1999-12-03 | 2006-01-04 | Bridgestone Corporation | Anisotropically electroconductive film |
| EP1612252A3 (en) * | 1999-12-03 | 2006-04-26 | Bridgestone Corporation | Anisotropically electroconductive film |
| JP2020519732A (en) * | 2017-06-27 | 2020-07-02 | エルジー・ケム・リミテッド | Adhesive composition, protective film and polarizing plate containing adhesive layer containing the same, and image display device containing the same |
| JP2020531642A (en) * | 2017-12-15 | 2020-11-05 | エルジー・ケム・リミテッド | Adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2575680B2 (en) | 1997-01-29 |
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