JP2575680B2 - Adhesive for metal-clad laminates - Google Patents
Adhesive for metal-clad laminatesInfo
- Publication number
- JP2575680B2 JP2575680B2 JP59287A JP59287A JP2575680B2 JP 2575680 B2 JP2575680 B2 JP 2575680B2 JP 59287 A JP59287 A JP 59287A JP 59287 A JP59287 A JP 59287A JP 2575680 B2 JP2575680 B2 JP 2575680B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- adhesive
- weight
- resin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、半田耐熱性、耐トラッキング性に優れた、
安価な金属張積層板用接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Objects of the Invention] (Industrial application field) The present invention is excellent in solder heat resistance and tracking resistance.
The present invention relates to an inexpensive metal-clad laminate adhesive.
（従来の技術） 金属張積層板に要求される特性には種々あるが、金属
箔と基材とを接着している接着剤の性状に大きく依存し
ている特性として、半田耐熱性とピール強度がある。こ
の特性に適合する接着剤として、従来ポリビニルブチラ
ール樹脂にフェノール樹脂を配合した接着剤が用いられ
てきた。ところが近年、電気機器の高密度実装化に伴っ
て半田耐熱性およびピール強度に加えて、耐トラッキン
グ性に対する要求レベルがより厳しいものになってきて
いるが、この耐トラッキング性も接着剤の性状に大きく
依存している。また、材料の低廉化の要請も近年特に強
くなってきている。(Prior art) There are various characteristics required for a metal-clad laminate, but characteristics that greatly depend on properties of an adhesive bonding a metal foil and a substrate include solder heat resistance and peel strength. There is. Conventionally, as an adhesive suitable for this property, an adhesive obtained by blending a phenol resin with a polyvinyl butyral resin has been used. However, in recent years, in addition to solder heat resistance and peel strength, the required level of tracking resistance has become more stringent with the increase in the density of electrical equipment, but this tracking resistance also depends on the properties of the adhesive. Depends heavily. In recent years, the demand for lower cost of materials has been particularly strong in recent years.
（発明が解決しようとする問題点） しかし、ポリビニルブチラール樹脂にフェノール樹脂
を配合した従来の接着剤は、耐トラッキング特性に対し
て何等の考慮もされたものでなかった。すなわち、従来
の接着剤は半田耐熱性が優れているものの、フェノール
樹脂が悪影響を与えて耐トラッキング性が劣っている。
このことから、フェノール樹脂の配合量を減らして耐ト
ラッキング性の向上を図ると半田耐熱性が低下してしま
い、半田耐熱性と耐トラッキング性は二律背反という傾
向にあった。本発明はこの事情に鑑みてなされたもの
で、半田耐熱性とともに、耐トラッキング性に優れ、か
つピール強度も実用レベルにあるという、安価な金属張
積層板用接着剤を提供しようとするものである。(Problems to be Solved by the Invention) However, the conventional adhesive in which a phenolic resin is blended with a polyvinyl butyral resin has not been given any consideration to the tracking resistance. That is, although the conventional adhesive has excellent solder heat resistance, the phenol resin exerts an adverse effect and is inferior in tracking resistance.
For this reason, when the tracking resistance was improved by reducing the amount of the phenolic resin, the solder heat resistance was lowered, and the solder heat resistance and the tracking resistance tended to trade off. The present invention has been made in view of this situation, and aims to provide an inexpensive metal-clad laminate adhesive that has excellent soldering heat resistance, tracking resistance, and peel strength at a practical level. is there.
［発明の構成］ （問題点を解決するための手段と作用） 本発明者らは、上記の目的を達成しようと鋭意研究を
重ねた結果、後述する組成の接着剤が半田耐熱性、耐ト
ラッキング性に優れ、ピール強度も実用レベルであり、
そしてまた安価であるという接着剤を見いだし、本発明
を完成したものである。すなわち、本発明は、 ポリビニルブチラール樹脂100重量部、メラミン樹脂30
〜300重量部、及びジシクロペンタジエン共重合体５〜1
00重量部、並びに硬化触媒としての酸触媒を前記メラミ
ン樹脂100重量部に対し0.1〜10重量部に配合してなるこ
とを特徴とする金属張積層板用接着剤である。[Constitution of the Invention] (Means and Actions for Solving the Problems) The present inventors have conducted intensive studies to achieve the above object, and as a result, the adhesive having the composition described below has solder heat resistance and tracking resistance. Excellent in peelability, and the peel strength is at a practical level.
The present inventors have found an inexpensive adhesive and completed the present invention. That is, the present invention relates to 100 parts by weight of polyvinyl butyral resin and 30 parts of melamine resin.
~ 300 parts by weight, and dicyclopentadiene copolymer 5-1
An adhesive for a metal-clad laminate, characterized in that 0.1 part by weight and 100 parts by weight of an acid catalyst as a curing catalyst are blended with respect to 100 parts by weight of the melamine resin.
本発明の趣旨は、耐トラッキング性を向上させるた
め、フェノール樹脂以外の熱硬化性樹脂を検討した結
果、メラミン樹脂が有効であり、また、ポリビニルブチ
ラール樹脂−メラミン樹脂系に酸触媒を適量配合するこ
とにより半田耐熱性、耐トラッキング性に優れた接着剤
が得られることを見いだし、更にポリビニルブチラール
樹脂やメラミン樹脂に比べて安価なジシクロペンタジエ
ン共重合体を配合することによって耐トラッキング性、
半田耐熱性を一定レベルに保持したまま、ピール強度の
よい、かつ安価な金属張積層板用接着剤を得ようするも
のである。シクロペタジエンは、ナフサ分解の際に副生
し、これを利用するために、ジシクロペタジエン共重合
体はポリビニルブチラール樹脂やメラミン樹脂に比べて
安価になる。The purpose of the present invention is to improve the tracking resistance, as a result of examining thermosetting resins other than phenolic resin, melamine resin is effective, and also, an appropriate amount of acid catalyst is blended with polyvinyl butyral resin-melamine resin system. Solder heat resistance, it was found that an adhesive excellent in tracking resistance can be obtained, and further, by adding a cheap dicyclopentadiene copolymer compared to polyvinyl butyral resin and melamine resin, tracking resistance,
It is an object of the present invention to obtain an inexpensive adhesive for metal-clad laminates having good peel strength while maintaining solder heat resistance at a certain level. Cyclopetadiene is by-produced during naphtha decomposition, and the dicyclopetadiene copolymer is inexpensive as compared with polyvinyl butyral resin and melamine resin.
本発明に用いるポリビニルブチラール樹脂としては、
特に制限はなく、従来よりポリビニルブチラール樹脂系
接着剤で用いられている高分子量タイプのものが望まし
い。具体的なものとして、例えばBX−1,BX−５（積水化
学工業社製、商品名）、＃5000−A,＃6000−C,＃5000−
EP,＃6000−EP（電気化学工業社製）等が挙げられ、こ
れらは単独もしくは２種以上の混合系として使用する。As the polyvinyl butyral resin used in the present invention,
There is no particular limitation, and a high molecular weight type adhesive conventionally used for a polyvinyl butyral resin-based adhesive is desirable. As specific examples, for example, BX-1, BX-5 (trade name, manufactured by Sekisui Chemical Co., Ltd.), # 5000-A, # 6000-C, # 5000-
EP, # 6000-EP (manufactured by Denki Kagaku Kogyo Co., Ltd.) and the like are used alone or as a mixture of two or more.
本発明に用いるメラミン樹脂としては、特に限定する
ものではないが、他の成分との相溶性の面から、メチロ
ールメラミン樹脂であって、溶解する溶剤の極性に応じ
てメチロール基の一部もしくは全部をアルキル化したも
のであることが望ましい。具体的なものとしては、例え
ばニカラックMW−32,MW−22,MW−22A,MW−12LF,MW−24,
MW−25,MX−40,MX−45,MX−031,MX−041,MX−042,MX−0
54,MX−703,MX−705,MX−706,MX−708,MS−21,MS−11,M
S−001,MX−002,MX−408,MX−285（三和ケミカル社製、
商品名）、サイメル300,301,303,325,327,350,370,111
6,1130（三井東圧化学工業社製、商品名）、ユーバン20
SB,20SE−60,20HS,21HV,21R,22R,22R−60,120,122,220,
134,135,136,60R,62,96−1,163,164,165,80S,91−55
（三井東圧化学工業社製、商品名）等が挙げられ、これ
らはいずれも単独もしくは２種以上の混合系として使用
される。メラミン樹脂の配合割合は、ポリビニルブチラ
ール樹脂100重量部に対し、メラミン樹脂30〜300重量部
配合させた場合に半田耐熱性、耐トラッキング性、およ
びピール強度に優れている。配合割合が30重量部未満も
しくは300重量部を超えると半田耐熱性、および強度が
低下し好ましくない。The melamine resin used in the present invention is not particularly limited, but from the viewpoint of compatibility with other components, is a methylol melamine resin, and a part or all of the methylol group depending on the polarity of the solvent to be dissolved. Is desirably an alkylated version of Specifically, for example, Nikarac MW-32, MW-22, MW-22A, MW-12LF, MW-24,
MW-25, MX-40, MX-45, MX-031, MX-041, MX-042, MX-0
54, MX-703, MX-705, MX-706, MX-708, MS-21, MS-11, M
S-001, MX-002, MX-408, MX-285 (manufactured by Sanwa Chemical Co., Ltd.
Product name), Cymel 300,301,303,325,327,350,370,111
6,1130 (manufactured by Mitsui Toatsu Chemicals, trade name), U-Van 20
SB, 20SE-60,20HS, 21HV, 21R, 22R, 22R-60,120,122,220,
134,135,136,60R, 62,96-1,163,164,165,80S, 91-55
(Manufactured by Mitsui Toatsu Chemicals, Inc., trade name) and the like, all of which are used alone or as a mixture of two or more. The mixing ratio of the melamine resin is excellent in solder heat resistance, tracking resistance, and peel strength when 30 to 300 parts by weight of the melamine resin is added to 100 parts by weight of the polyvinyl butyral resin. If the compounding ratio is less than 30 parts by weight or exceeds 300 parts by weight, the solder heat resistance and strength are undesirably reduced.
本発明に用いる酸触媒としては、メラミン樹脂の硬化
触媒として使用するものであればよく、特に限定されな
い。具体的な酸触媒としては、パラトルエンスルホン
酸，芳香族スルホン酸を主成分とするキャタニットＡ
（日東化学社製、商品名），燐酸等が挙げられ、これら
は単独もしくは２種以上混合して使用する。酸触媒の添
加量は、メラミン樹脂100重量部に対して0.1〜100重量
部の範囲内であることが望ましい。0.1重量部未満では
半田耐熱性が劣り、10重量部を超えると半田耐熱性およ
びピール強度が低下し好ましくない。The acid catalyst used in the present invention is not particularly limited as long as it is used as a curing catalyst for a melamine resin. Specific examples of the acid catalyst include Catanit A containing p-toluenesulfonic acid and aromatic sulfonic acid as main components.
(Trade name, manufactured by Nitto Chemical Co., Ltd.), phosphoric acid, and the like. These may be used alone or in combination of two or more. The amount of the acid catalyst added is desirably in the range of 0.1 to 100 parts by weight based on 100 parts by weight of the melamine resin. If it is less than 0.1 part by weight, the solder heat resistance is inferior. If it exceeds 10 parts by weight, the solder heat resistance and the peel strength are undesirably reduced.
本発明に用いるジシクロペンタジエン共重合体として
は、例えばクイントン＃1700（日本ゼオン社製、商品
名）等が挙げられる。ジシクロペンタジエン共重合体の
配合量は、ポリビニルブチラール樹脂100重量部に対
し、ジシクロペンタジエン共重合体５〜100重量部の範
囲であることが望ましい。配合量が５重量部未満では低
廉化の効果が少なく、100重量部を超えると半田耐熱性
およびピール強度が低下し好ましくない。Examples of the dicyclopentadiene copolymer used in the present invention include Quinton # 1700 (trade name, manufactured by Zeon Corporation). The compounding amount of the dicyclopentadiene copolymer is desirably in the range of 5 to 100 parts by weight of the dicyclopentadiene copolymer per 100 parts by weight of the polyvinyl butyral resin. If the amount is less than 5 parts by weight, the effect of cost reduction is small, and if it exceeds 100 parts by weight, solder heat resistance and peel strength are undesirably reduced.
本発明の接着剤の製造には溶剤を用いるが、その溶剤
は樹脂成分および触媒を溶解するものであれば良く、特
に限定されず広く使用することができる。例えばメチル
アルコール，エチルアルコール，イソプロピルアルコー
ル，ブタノール等のアルコール系溶剤、アセトン，メチ
ルエチルケトン，メチルイソブチルケトン等のケトン系
溶剤、ベンゼン，トルエン，キシレン等の芳香族炭化水
素系溶剤、水などが挙げられ、これらは単独もしくは２
種以上の混合系として使用することができる。また、本
発明の金属張積層板用接着剤は、上記の成分の他、本発
明の特性を害しない限り他の熱可塑性樹脂、フェノール
樹脂を除く熱硬化性樹脂を適量添加配合することができ
る。本発明の接着剤は、各成分を溶剤に溶解して極めて
容易に製造することができる。A solvent is used in the production of the adhesive of the present invention, and the solvent may be any one that dissolves the resin component and the catalyst, and is not particularly limited and can be widely used. Examples thereof include alcohol solvents such as methyl alcohol, ethyl alcohol, isopropyl alcohol and butanol, ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone, aromatic hydrocarbon solvents such as benzene, toluene and xylene, and water. These can be used alone or 2
It can be used as a mixture of more than two species. In addition, the adhesive for a metal-clad laminate of the present invention can be added and compounded with an appropriate amount of a thermosetting resin other than the above-mentioned components and other thermoplastic resins and phenolic resins as long as the properties of the present invention are not impaired. . The adhesive of the present invention can be produced very easily by dissolving each component in a solvent.
（実施例） 次に本発明を実施例によって具体的に説明するが、本
発明はこれらの実施例によって限定されるものではな
い。以下の実施例および比較例において「部」とは「重
量部」を意味する。(Examples) Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
実施例 １ ポリビニルブチラール樹脂BX−１（積水化学工業社
製、商品名）50部、メラミン樹脂サイメル＃370（三井
東圧化学社製、商品名、固形分88％）57部、ジシクロペ
ンタジエン共重合体クイントン＃1700（日本ゼオン社
製、商品名）50部、およびパラトルエンスルホン酸0.5
部を、メチルエチルケトン・トルエン・メタノールの等
量混合溶剤に不揮発分が20％になるように溶解させて、
金属張積層板用接着剤（Ａ）を得た。Example 1 50 parts of polyvinyl butyral resin BX-1 (manufactured by Sekisui Chemical Co., Ltd., trade name), 57 parts of melamine resin Cymel # 370 (manufactured by Mitsui Toatsu Chemicals, trade name, solid content: 88%), and 57 parts of dicyclopentadiene 50 parts of polymer Quinton # 1700 (trade name, manufactured by Zeon Corporation) and p-toluenesulfonic acid 0.5
Part was dissolved in a mixed solvent of equal amounts of methyl ethyl ketone, toluene, and methanol so that the nonvolatile content was 20%.
An adhesive (A) for a metal-clad laminate was obtained.
実施例 ２ ポリビニルブチラール樹脂デンカブチラール＃6000
（電気化学工業社製、商品名）60部、メラミン樹脂ニカ
ラックMS−001（三和ケミカル社製、商品名）67部、ジ
シクロペンタジエン共重合体クイントン＃1700（日本ゼ
オン社製、商品名）30部、および芳香族スルホン酸を主
成分とするキャタニットＡ（日東化学工業社製、商品
名）0.4部を、メチルエチルケトン・トルエン・メタノ
ールの等量混合溶剤に不揮発分が20％になるように溶解
して、金属張積層板用接着剤（Ｂ）を得た。Example 2 Polyvinyl butyral resin Denka butyral # 6000
60 parts of melamine resin Nikalac MS-001 (manufactured by Sanwa Chemical Co., trade name) 67 parts, dicyclopentadiene copolymer Quinton # 1700 (manufactured by Zeon Corporation, trade name) 30 parts and 0.4 part of Catanit A (manufactured by Nitto Kagaku Kogyo Co., Ltd.) containing aromatic sulfonic acid as a main component in a mixed solvent of an equal amount of methyl ethyl ketone, toluene and methanol so that the nonvolatile content becomes 20%. It melt | dissolved and the adhesive agent (B) for metal-clad laminated boards was obtained.
実施例 ３ ポリビニルブチラール樹脂BX−１（積水化学工業社
製、商品名）60部、メラミン樹脂サイメル＃325（三井
東圧化学社製、商品名、固形分80％）50部、ジシクロペ
ンタジエン共重合体クイントン＃1700（前出）５部、お
よびパラトルエンスルホン酸0.4部を、メチルエチルケ
トン・トルエン・メタノールの等量混合溶剤に不揮発分
が20％になるように溶解して、金属張積層板用接着剤
（Ｃ）を得た。Example 3 60 parts of polyvinyl butyral resin BX-1 (manufactured by Sekisui Chemical Co., Ltd., trade name), 50 parts of melamine resin Cymel # 325 (manufactured by Mitsui Toatsu Chemicals, trade name, solid content 80%), and 50 parts of dicyclopentadiene 5 parts of polymer Quinton # 1700 (described above) and 0.4 parts of paratoluenesulfonic acid are dissolved in a mixed solvent of equal amounts of methyl ethyl ketone, toluene, and methanol so that the nonvolatile content becomes 20%. An adhesive (C) was obtained.
比較例 １ ポリビニルブチラール樹脂BX−１（前出）50部、およ
びレゾール型フェノール樹脂50部を、メチルエチルケト
ン・トルエン・メタノールの等量混合溶剤に不揮発分が
20％になるように溶解して、金属張積層板用接着剤
（Ｄ）を得た。Comparative Example 1 50 parts of a polyvinyl butyral resin BX-1 (described above) and 50 parts of a resole-type phenol resin were mixed in a mixed solvent of an equal amount of methyl ethyl ketone, toluene, and methanol to obtain a nonvolatile component.
By dissolving to 20%, an adhesive (D) for a metal-clad laminate was obtained.
比較例 ２ ポリビニルブチラール樹脂BX−１（前出）50部、メラ
ミン樹脂サイメル＃370（前出）57部、およびパラトル
エンスルホン酸0.5部を、メチルエチルケトン・トルエ
ン・メタノールの等量混合溶剤に不揮発分が20％になる
ように溶解して、金属張積層板用接着剤（Ｅ）を得た。Comparative Example 2 50 parts of polyvinyl butyral resin BX-1 (supra), 57 parts of melamine resin Cymel # 370 (supra), and 0.5 part of paratoluenesulfonic acid were mixed in a mixed solvent of an equal amount of methyl ethyl ketone, toluene, and methanol in a nonvolatile solvent. Was dissolved to 20% to obtain an adhesive (E) for a metal-clad laminate.
実施例１〜３および比較例１〜２で得られた接着剤Ａ
〜Ｅを用いて、厚さ35μｍの銅箔に付着固形分30g/m2に
なるように塗布乾燥の後、フェノール樹脂含浸紙と共に
重ね合わせ加熱加圧して銅張積層板をつくった。これら
の銅張積層板について耐トラッキング性、半田耐熱性、
ピール強度を試験したのでその結果を第１表に示した
が、いずれも本発明の顕著な効果が認められた。Adhesive A obtained in Examples 1-3 and Comparative Examples 1-2
Using E to E, a copper-clad laminate was prepared by applying and drying the solution to a 35 μm-thick copper foil so as to have a solid content of 30 g / m 2 , and then superposing and heating and pressing with a phenolic resin-impregnated paper. For these copper clad laminates, tracking resistance, solder heat resistance,
The peel strength was tested, and the results are shown in Table 1. In each case, the remarkable effect of the present invention was recognized.
［発明の効果］ 以上の説明および第１表から明らかなように、本発明
の金属張積層板用接着剤は、特定の組成で構成され、そ
の結果半田耐熱性、耐トラッキング性に優れ、かつピー
ル強度のよい、安価なものであるので、工業上有益なも
のである。 [Effects of the Invention] As is clear from the above description and Table 1, the adhesive for a metal-clad laminate of the present invention has a specific composition, and as a result, has excellent solder heat resistance and tracking resistance, and Since it is inexpensive with good peel strength, it is industrially useful.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−132987（ＪＰ，Ａ) 特開 昭48−90331（ＪＰ，Ａ) 特開 昭62−132986（ＪＰ，Ａ) 特開 昭62−241983（ＪＰ，Ａ) 特開 昭63−154777（ＪＰ，Ａ) 特開 昭59−84966（ＪＰ，Ａ) 特開 昭59−71376（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-132987 (JP, A) JP-A-48-90331 (JP, A) JP-A-62-132986 (JP, A) JP-A-62-132986 241983 (JP, A) JP-A-63-154777 (JP, A) JP-A-59-84966 (JP, A) JP-A-59-71376 (JP, A)
Claims (1)
ラミン樹脂30〜300重量部、及びジシクロペンタジエン
共重合体５〜100重量部、並びに硬化触媒としての酸触
媒を前記メラミン樹脂100重量部に対し0.1〜10重量部に
配合してなることを特徴とする金属張積層板用接着剤。1. A polybutyral resin (100 parts by weight), a melamine resin (30 to 300 parts by weight), a dicyclopentadiene copolymer (5 to 100 parts by weight), and an acid catalyst as a curing catalyst are added in an amount of 0.1 to 100 parts by weight of the melamine resin. An adhesive for a metal-clad laminate, which is blended in an amount of up to 10 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59287A JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59287A JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170482A JPS63170482A (en) | 1988-07-14 |
| JP2575680B2 true JP2575680B2 (en) | 1997-01-29 |
Family
ID=11478006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59287A Expired - Lifetime JP2575680B2 (en) | 1987-01-07 | 1987-01-07 | Adhesive for metal-clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575680B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60025760T2 (en) * | 1999-12-03 | 2006-08-03 | Bridgestone Corp. | ANISOTROP-LEADING FILM |
| KR102186080B1 (en) * | 2017-06-27 | 2020-12-03 | 주식회사 엘지화학 | Adhesive composition, protective film and polarizing plate comprising adhesive layer comprising the same and display device comprising the same |
| KR102218852B1 (en) * | 2017-12-15 | 2021-02-23 | 주식회사 엘지화학 | Adhesive Composition |
-
1987
- 1987-01-07 JP JP59287A patent/JP2575680B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63170482A (en) | 1988-07-14 |
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