JPS63168472A - Epoxy resin powder coating composition - Google Patents
Epoxy resin powder coating compositionInfo
- Publication number
- JPS63168472A JPS63168472A JP31417986A JP31417986A JPS63168472A JP S63168472 A JPS63168472 A JP S63168472A JP 31417986 A JP31417986 A JP 31417986A JP 31417986 A JP31417986 A JP 31417986A JP S63168472 A JPS63168472 A JP S63168472A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder coating
- coating composition
- parts
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 66
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 66
- 239000000843 powder Substances 0.000 title claims abstract description 59
- 239000008199 coating composition Substances 0.000 title claims description 26
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 150000004996 alkyl benzenes Chemical class 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000007859 condensation product Substances 0.000 claims description 5
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 4
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 37
- 239000011248 coating agent Substances 0.000 abstract description 28
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 239000000945 filler Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 9
- 239000008096 xylene Substances 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 6
- 238000007598 dipping method Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- -1 aliphatic acid anhydride Chemical class 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- HLLSOEKIMZEGFV-UHFFFAOYSA-N 4-(dibutylsulfamoyl)benzoic acid Chemical compound CCCCN(CCCC)S(=O)(=O)C1=CC=C(C(O)=O)C=C1 HLLSOEKIMZEGFV-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はエポキシ樹脂粉体塗料組成物に間するものであ
り、電気電子部品の絶縁被覆に適した耐湿性、可撓性の
極めて優れた粉体塗料キ且成物を提供するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an epoxy resin powder coating composition, which has extremely excellent moisture resistance and flexibility and is suitable for insulation coating of electrical and electronic parts. The present invention provides powder coating compositions.
（従来技術）
従来、電気電子部品の絶縁被覆に用いられるエポキシ樹
脂粉体塗料として、ビスフェノールＡ型エポキシ樹脂、
ノボラック型エポキシ樹脂、脂環型エポキシ樹脂等のエ
ポキシ樹脂、酸無水物、ポリアミン等の硬化剤、第３級
アミン、イミダゾール等の硬化促進剤、充填剤、その池
の添加剤を配合した粉体塗料が良く知られている。(Prior art) Bisphenol A type epoxy resin, bisphenol A type epoxy resin,
Powder containing epoxy resins such as novolac type epoxy resins and alicyclic epoxy resins, curing agents such as acid anhydrides and polyamines, curing accelerators such as tertiary amines and imidazole, fillers, and additives for the same. The paint is well known.
これらの粉体塗料は、流動浸漬法、静電流動浸漬法等の
方法で電気電子部品に塗装されるものであり、経済的に
有利な電気電子部品の絶縁被覆方法として近年多く用い
られるようになった。These powder coatings are applied to electrical and electronic components using methods such as fluidized dipping and electrostatic dynamic dipping, and have recently become widely used as an economically advantageous insulation coating method for electrical and electronic components. became.
しかし、最近電気電子部品の高信頼性化の動きに伴い、
この被覆に用いられるエポキシ樹脂粉体塗料は、高温高
湿度処理やヒートサイクル処理による電気的特性、機械
的特性の劣化の少ないものが要求されており、この要求
に従来のエポキシ樹脂粉体塗料で対応することは困難に
なって来ている。However, with the recent trend toward higher reliability of electrical and electronic components,
The epoxy resin powder coating used for this coating is required to have minimal deterioration in electrical and mechanical properties due to high temperature, high humidity treatment or heat cycle treatment, and conventional epoxy resin powder coatings meet this requirement. It is becoming difficult to respond.
前記従来のエポキシ樹脂粉体塗料の耐湿性を向上する方
法として、ノボラック型エポキシ樹脂を使用し硬化物の
架橋密度を高くする方法があるが、この方法では耐湿性
が向上するものの、塗装した部品の耐ヒートサイクル性
が大幅に低下してしまう。One way to improve the moisture resistance of the conventional epoxy resin powder coating is to use a novolac type epoxy resin to increase the crosslinking density of the cured product. The heat cycle resistance of the material is significantly reduced.
一方、可撓性に優れた粉体塗料を得るため、線状脂肪族
エポキシ樹脂等の可撓性樹脂や脂肪族酸無水物系硬化剤
を用いる方法があるが、耐ヒートサイグル性は良好なも
のの、耐湿性は極めて劣ることが多い。On the other hand, in order to obtain powder coatings with excellent flexibility, there is a method of using flexible resins such as linear aliphatic epoxy resins and aliphatic acid anhydride curing agents, but although they have good heat cycle resistance, , moisture resistance is often extremely poor.
このように、従来の方法では耐湿性と可撓性とが両立す
るものを得ることは極めて困難であった。As described above, it has been extremely difficult to obtain a material that is both moisture resistant and flexible using conventional methods.
（発明の目的）
本発明は、上記問題を解決すべく種々検討の結果、特定
のエポキシ樹脂、硬化剤、無機充填剤及びアルキルベン
ゼンとホルムアルデヒドの縮合生成物を必須成分として
適正な割合で配合した場合、粉体塗料硬化物の耐湿性、
耐ヒートサイクル性が極めて優れることを見出し、本発
明を完成ずろζこ至ったものである。(Purpose of the Invention) As a result of various studies to solve the above problems, the present invention has been developed by incorporating a specific epoxy resin, a curing agent, an inorganic filler, and a condensation product of alkylbenzene and formaldehyde as essential components in appropriate proportions. , moisture resistance of cured powder coatings,
It was discovered that the heat cycle resistance was extremely excellent, and the present invention was recently completed.
本発明の目的とするところは、耐湿性を劣化させること
なく耐ヒートサイクル性に著しく優れた硬化物を与える
エポキシ樹脂粉体塗料組成物を提供することにある。An object of the present invention is to provide an epoxy resin powder coating composition that provides a cured product with outstanding heat cycle resistance without deteriorating moisture resistance.
（発明の構成）
本発明は、
（Ａ）融点５０〜１５０℃のエポキシ樹脂（Ｂ）硬化剤
（Ｃ）アルキルベンゼンとホルムアルデヒドの縮合生成
物（以下ＡＢ樹脂という）
（Ｄ）無機充填剤
を含有し、ＡＢ樹脂（Ｃ）の含有量がエポキシ樹脂（Ａ
） １００重量部に対して１０〜４０重量部の範囲にあ
るエポキシ樹脂粉体塗料組成物に間するものである。(Structure of the Invention) The present invention comprises (A) an epoxy resin with a melting point of 50 to 150°C, (B) a curing agent, (C) a condensation product of alkylbenzene and formaldehyde (hereinafter referred to as AB resin), and (D) an inorganic filler. , the content of AB resin (C) is epoxy resin (A
) The amount of the epoxy resin powder coating composition ranges from 10 to 40 parts by weight per 100 parts by weight.
本発明に用いられるエポキシ樹脂（Ａ）は、融点が５０
〜１５０℃のエポキシ樹脂が好適に使用される。The epoxy resin (A) used in the present invention has a melting point of 50
~150°C epoxy resin is preferably used.
エポキシ樹脂（Ａ）の融点が５０℃を下回ると粉体塗料
が固結しやすくなり、融点が１５０℃を上回ると粉体塗
料の溶融時の粘度が高くなるため、平滑な外観を有する
塗膜が得られなくなる。If the melting point of the epoxy resin (A) is lower than 50°C, the powder coating tends to solidify, and if the melting point exceeds 150°C, the viscosity of the powder coating increases when melted, resulting in a coating film with a smooth appearance. will not be obtained.
上記エポキシ樹脂としては、例えばビスフェノールＡ型
エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂等のジ
クリシジルエーテル型エポキシ樹脂、フェノールノボラ
ック型エポキシ樹脂、クレゾールノボラック型エポキシ
樹脂等のノボラック型エポキシ樹脂、グリシジルエステ
ル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、
線状脂肪族型エポキシ樹脂、複素環型エポキシ樹脂、ハ
ロゲン化エポキシ樹脂等があげられる。The above-mentioned epoxy resins include, for example, dicrycidyl ether type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, and glycidyl ester type epoxy resin. , glycidylamine type epoxy resin,
Examples include linear aliphatic epoxy resins, heterocyclic epoxy resins, and halogenated epoxy resins.
前記エポキシ樹脂の中で、ビスフェノールＡ型エポキシ
樹脂が最も好ましい。それは、ビスフェノールＡ型エポ
キシ樹脂は、粉体塗料の特性として、耐湿性、可撓性の
バランスがとれており、その他のエポキシ樹脂では、耐
湿性は良いが可撓性が悪い、あるいはその逆のごとく、
バランスがとり難い。また更に耐湿性や可撓性の向上あ
るいは難燃性の付与を目的として、ノボラック型エポキ
シ樹脂、線状脂肪族エポキシ樹脂、ハロゲン化エポキシ
樹脂等を１種以上併用してもよい。Among the epoxy resins, bisphenol A epoxy resin is most preferred. The reason is that bisphenol A type epoxy resin has a good balance of moisture resistance and flexibility as powder coating properties, while other epoxy resins have good moisture resistance but poor flexibility, or vice versa. like,
It's difficult to balance. Further, for the purpose of improving moisture resistance and flexibility or imparting flame retardance, one or more types of novolac type epoxy resin, linear aliphatic epoxy resin, halogenated epoxy resin, etc. may be used in combination.
本発明に用いられるエポキシ樹脂（Ａ）のエポキシ当量
は３００〜２５００が好ましい。それは、エポキシ樹脂
（Ａ）のエポキシ当量が３００を下回ると、該粉体塗料
組成物を加熱溶融硬化させることにより得られる塗膜の
架橋密度が高くなりすぎ、可撓性が損なわれるため該粉
体塗料により被覆された部品の耐ヒートサイクル性が低
下する。また、エポキシ当量が２５００を上回ると塗膜
の架橋密度が低くなりすぎ、被覆された部品の耐湿性が
低下する。The epoxy equivalent of the epoxy resin (A) used in the present invention is preferably 300 to 2,500. If the epoxy equivalent of the epoxy resin (A) is less than 300, the crosslinking density of the coating film obtained by heating and melting the powder coating composition will become too high, and the flexibility will be impaired. The heat cycle resistance of parts coated with body paint is reduced. On the other hand, if the epoxy equivalent exceeds 2500, the crosslinking density of the coating film becomes too low and the moisture resistance of the coated parts decreases.
本発明に用いられる硬化剤（Ｂ）としては、酸無水物、
ポリアミン、ノボラック型フェノール樹脂、第３級アミ
ン、イミダゾール化合物等があり、いずれを用いてもよ
いが、酸無水物、特にその中で無水トリメリット酸、無
水ピロメリット酸、または無水ベンゾフェノンテトラカ
ルボン酸が好ましい。その理由は、酸無水物硬化型の樹
脂は、ポリアミン、ノボラック型フェノール樹脂等を硬
化剤として含有した樹脂に比べ、密着性に優れるためで
あり、かつ上記の酸無水物は多官能性であるためエポキ
シ樹脂との反応において、無水テトラヒドロフタル酸等
一般的な官能基の少ない酸無水物に比べ、密な架橋を生
じせしめることができ、耐湿性に良好な傾向をもたらす
ためである。The curing agent (B) used in the present invention includes acid anhydrides,
There are polyamines, novolac type phenolic resins, tertiary amines, imidazole compounds, etc., and any of them may be used, but acid anhydrides, especially trimellitic anhydride, pyromellitic anhydride, or benzophenonetetracarboxylic anhydride is preferred. The reason for this is that acid anhydride-curing resins have better adhesion than resins containing polyamines, novolac-type phenolic resins, etc. as curing agents, and the acid anhydrides mentioned above are polyfunctional. Therefore, in the reaction with an epoxy resin, compared to general acid anhydrides with few functional groups, such as tetrahydrophthalic anhydride, it can form dense crosslinks, resulting in better moisture resistance.
また、前記硬化剤と組合せて、イミダゾール類、芳香族
第３級アミン等の硬化促進剤を併用してもよい。Furthermore, in combination with the curing agent, a curing accelerator such as imidazoles and aromatic tertiary amines may be used.
本発明で用いられる無機充填剤（Ｄ）は、公知の無機充
填剤、例えばジルコン粉末、タルク粉末、結晶シリカ粉
末、溶融シリカ粉末、炭酸カルシウム粉末、マグネシア
粉末、ケイ酸カルシウム粉末、水和アルミナ粉末、アル
ミナ粉末等であり、限定するものではない。The inorganic filler (D) used in the present invention is a known inorganic filler, such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alumina powder. , alumina powder, etc., but is not limited thereto.
本発明では、ＡＢ樹脂を必須成分とするが、ＡＢ樹脂は
メタキシレン、トルエン、あるいはメシチレン等のアル
キルベンゼンとホルマリンとを強酸下で触媒にて縮合反
応させて得られる水飴状樹脂であるが、メタキシレンと
ホルムアルデヒドの縮合生成物であるキシレン樹脂が好
ましく、エポキシ樹脂粉体塗料の可塑化剤として用いる
。In the present invention, AB resin is an essential component. Xylene resins, which are condensation products of xylene and formaldehyde, are preferred and are used as plasticizers in epoxy resin powder coatings.
本発明において、ＡＢ樹脂を通訳した理由は、電気電子
部品用外装材としての粉体塗料用可塑剤として、液状ゴ
ム、ポリエチレン系樹脂等を種々検討した中で、ＡＢ樹
脂がエポキシ樹脂との相溶性に優れるため、エポキシ樹
脂粉１本塗料へ含有すしめた際、硬化後の塗膜外観へ悪
影響を及ぼすことなく、また、電気絶縁性及び耐湿性の
劣化が少なく、かつ、硬化物の熱変形温度を低下させう
ろことを発見したためである。The reason for using AB resin in the present invention is that while various liquid rubbers, polyethylene resins, etc. were investigated as plasticizers for powder coatings used as exterior materials for electrical and electronic components, AB resin was compatible with epoxy resins. Due to its excellent solubility, when a single epoxy resin powder is added to a paint, there is no adverse effect on the appearance of the paint film after curing, there is little deterioration of electrical insulation and moisture resistance, and the cured product is heat resistant. This is due to the discovery of scales that lower the deformation temperature.
本発明に用いるＡＢ樹脂（Ｃ）としては、平均分子量３
００〜６００のものが好ましい。平均分子量が３００を
下回ると、粉体塗料を焼成硬化する際低分子量のＡＢ樹
脂が揮発しやすくなり、塗膜にボイド発泡が生じやすく
なり、また平均分子量が６００を越えた場合では、エポ
キシ樹脂との相溶性が低下し、塗膜の外観不良となる傾
向があるためである。ＡＢ樹脂（Ｃ）の添加量は、エポ
キシ樹脂（Ａ） １００部に対し、１０〜４０部の範囲
に限定される。１０部未満の添加量では、目的とする耐
ヒートサイクル性の向上が期待できず、４０部を越える
添加量では、耐ヒートサイクル性は向上するもののキシ
レン樹脂は前記のような常温で水飴状樹脂のため粉体塗
料としてはブロッキングが生じやすくなり、また、エポ
キシ樹脂との相溶性が劣るため、塗膜の外観不良となる
傾向がある。The AB resin (C) used in the present invention has an average molecular weight of 3
00 to 600 is preferable. If the average molecular weight is less than 300, the low molecular weight AB resin will easily volatilize when the powder coating is baked and cured, causing voids to form in the coating film, and if the average molecular weight exceeds 600, the epoxy resin This is because there is a tendency for the compatibility with the paint to decrease, resulting in poor appearance of the coating film. The amount of AB resin (C) added is limited to a range of 10 to 40 parts per 100 parts of epoxy resin (A). If the added amount is less than 10 parts, the desired improvement in heat cycle resistance cannot be expected, and if the added amount exceeds 40 parts, although the heat cycle resistance will be improved, the xylene resin will become a starch syrup-like resin at room temperature. Therefore, blocking tends to occur as a powder coating, and the compatibility with epoxy resins is poor, so the appearance of the coating film tends to be poor.
また、エポキシ樹脂（Ａ）、硬化剤（Ｂ）、無機充填剤
（Ｄ）の含有割合については特に限定するものではない
が、無機充填剤（Ｄ）については、エポキシ樹脂（Ａ）
１００重量部に対し、５０〜２００！量部を配合する
ことが好ましい。無機充填剤（Ｄ）の配合割合が５０重
量部を下回ると耐ヒートサイクル性、耐湿性等の特性が
劣化する。２００重量部を上回ると樹脂分が少なくなり
すぎ、粉体塗料を加熱硬化させることにより得られる塗
膜の外観（平滑性）が低下する傾向にある。本発明の粉
体塗料組成物には、必要に応じ顔料、難燃剤等各種添加
剤を配合してもよい。Furthermore, the content ratios of the epoxy resin (A), the curing agent (B), and the inorganic filler (D) are not particularly limited;
50-200 for 100 parts by weight! It is preferable to mix a certain amount. If the blending ratio of the inorganic filler (D) is less than 50 parts by weight, properties such as heat cycle resistance and moisture resistance will deteriorate. When it exceeds 200 parts by weight, the resin content becomes too small and the appearance (smoothness) of the coating film obtained by heating and curing the powder coating tends to deteriorate. The powder coating composition of the present invention may contain various additives such as pigments and flame retardants, if necessary.
本発明の粉体塗料組成物を製造する方法としては、例え
ば所定の割合で秤量した原料成分をミキサーによって充
分混合した後、エクストルーダー、コニーダーあるいは
ロール等で溶融混練し、次いで粉砕機にて粉砕する方法
等がある。As a method for producing the powder coating composition of the present invention, for example, raw ingredients weighed in a predetermined ratio are thoroughly mixed using a mixer, then melt-kneaded using an extruder, co-kneader, roll, etc., and then pulverized using a pulverizer. There are ways to do this.
粉体塗料組成物により電気電子部品の絶縁被覆を行う方
法としては、流動浸漬法、静電流動漫潰法、ころがし法
、ふりかけ法、ホットスプレー法、静電スプレー法等一
般の粉体塗装方法が用いられる。General powder coating methods such as fluidized dipping method, electrostatic current spreading method, rolling method, sprinkle method, hot spray method, and electrostatic spray method are methods for insulating coating electrical and electronic parts with powder coating compositions. used.
本発明の粉体塗料組成物において好適な粒度分布は、コ
ールタ−カウンター（８科機側製）により得られる粒度
分布を重量平均することにより求められる平均粒径が２
０〜２００μｍの範囲である。A suitable particle size distribution for the powder coating composition of the present invention is an average particle size of 2
It is in the range of 0 to 200 μm.
（なお、この平均粒径の測定はコールタ−カウンター以
外の測定方法でもよい。）この理由としては、上記塗装
方法において、通常塗装槽あるいは流動槽に圧縮空気を
送り粉体層を均一に流動させるが、該粉体塗料組成物の
平均粒径が２０μｍを下回る細かな粉体では、ファンデ
ルワールズ引力に起因する凝集力によって良好な流動状
態が得られず、粉体層表面での局部的な空気の吹出しに
より塗装する部品のリード部に汚れを生じたり、また流
動層の多孔板の目詰りが生じやすくなる。一方平均粒径
が２００μｍを越えると、塗装槽あるいは流動層内で粗
い粒子と細かな粒子との分級が生じやすく、これに伴っ
て塗装物にムラが生じたり、膜厚の安定性が著しく劣る
結果となるためである。(Note that this average particle size may be measured by a method other than a coulter counter.) The reason for this is that in the above coating method, compressed air is usually sent to the coating tank or fluidization tank to uniformly fluidize the powder layer. However, if the powder coating composition has fine powder with an average particle size of less than 20 μm, a good fluidity state cannot be obtained due to the cohesive force caused by van der Waals attraction, and local Air blowing tends to stain the lead portions of parts to be painted, and also tends to clog the perforated plates of the fluidized bed. On the other hand, if the average particle size exceeds 200 μm, classification into coarse particles and fine particles tends to occur in the coating tank or fluidized bed, resulting in uneven coating and significantly poor film thickness stability. This is because it results in results.
（発明の効果）
以上の構成による本発明のエポキシ樹脂粉体塗料組成物
は、フィルムコンデンサ、セラミックコンデンサ、バリ
スタ、コイル、抵抗体、抵抗ネットワーク、ハイブリッ
ドＩＣ等の電気電子部品の絶縁被覆に用いた場合、従来
得られなかった高度の耐湿性と耐ヒートサイクル性が発
揮される。(Effects of the Invention) The epoxy resin powder coating composition of the present invention having the above structure can be used for insulating coating of electrical and electronic components such as film capacitors, ceramic capacitors, varistors, coils, resistors, resistance networks, and hybrid ICs. In this case, it exhibits a high degree of moisture resistance and heat cycle resistance that was previously unobtainable.
（実施例） 次に、本発明を実施例により更に詳しく説明する。(Example) Next, the present invention will be explained in more detail with reference to Examples.
実崖１０゜
ビスフェノールＡ型エポキシ樹脂
（エポキシ当１［９５０） １００重量
部結晶シリカ粉末 １００ ／／キ
シレン樹脂（平均分子ｆｆ１３５０） １０ ／
／無水トリメリット酸（硬化剤）１０〃
を上記組成比で配合し、ヘンシェルミキサーでブレンド
した後コニーダーにて溶融混合した後、粉砕機で粉砕す
ることにより、平均粒径６３μｍの本発明のエポキシ樹
脂粉体塗料組成物を得た。Real cliff 10° Bisphenol A type epoxy resin (1 [950 per epoxy) 100 parts by weight Crystalline silica powder 100 // Xylene resin (average molecular ff 1350) 10 /
/trimellitic anhydride (curing agent) in the above composition ratio, blended in a Henschel mixer, melt-mixed in a co-kneader, and then ground in a grinder to obtain the epoxy resin of the present invention having an average particle size of 63 μm. A resin powder coating composition was obtained.
裏車■２
実施例１において、キシレン樹脂１０重量部を４０重量
部に替え、他は同様にして、平均粒径７５μｍの本発明
のエポキシ樹脂粉体塗料組成物を得た。Back Wheel (2) In Example 1, except that 10 parts by weight of the xylene resin was replaced with 40 parts by weight, the same procedure was repeated to obtain an epoxy resin powder coating composition of the present invention having an average particle size of 75 μm.
裏車■旦
実施例１において、硬化剤、無水トリメリット酸１０重
量部を２ヘプタデシルイミダゾ一ル３重量部に替えた他
は同様にして、平均粒径６４μｍの本発明のエポキシ樹
脂粉体塗料組成物を得た。The epoxy resin powder of the present invention having an average particle size of 64 μm was produced in the same manner as in Example 1, except that the curing agent, 10 parts by weight of trimellitic anhydride, was replaced with 3 parts by weight of 2-heptadecylimidazole. A coating composition was obtained.
土較土ユ
実施例１において、キシレン樹脂１０重量部を除いて、
他は同様にして、平均粒径６４μｍのエポキシ樹脂粉体
塗料組成物を得た。In Example 1, except for 10 parts by weight of xylene resin,
Otherwise, an epoxy resin powder coating composition having an average particle size of 64 μm was obtained in the same manner.
比ｌし１２
実施例１において、キシレン樹脂１０！量部を５０重量
部に替え、他は同様にして、平均粒径７０μｍのエポキ
シ樹脂粉体塗料組成物を得た。Comparison: 12 In Example 1, the xylene resin was 10! An epoxy resin powder coating composition having an average particle size of 70 μm was obtained in the same manner except that the amount was changed to 50 parts by weight.
比較１１
実施例１において、キシレン樹脂１０重量部を、ポリエ
チレンゴリコール（平均分子量４００） １０重量部に
替え、他は同様にして、平均粒径５８μｍのエポキシ樹
脂粉体塗料組成物を得た。Comparison 11 An epoxy resin powder coating composition having an average particle size of 58 μm was obtained in the same manner as in Example 1 except that 10 parts by weight of the xylene resin was replaced with 10 parts by weight of polyethylene golicol (average molecular weight 400).
ＪＪＬＭ４
実施例３において、キシレン樹脂１０重量部を除いて、
他は同様にして、平均粒径６０μｍのエポキシ樹脂粉体
塗料組成物を得た。JJLM4 In Example 3, except for 10 parts by weight of xylene resin,
Otherwise, an epoxy resin powder coating composition having an average particle size of 60 μm was obtained in the same manner.
実施例及び比較例の粉体塗料組成物につき、！００Ω５
抵抗の抵抗ネットワークを各２０個流動浸漬法にて塗装
し、１５０℃乾燥機中で３時間焼成したサンプルにおい
て、１２１℃２気圧の飽和水蒸気中で１００時間吸湿処
理を行った場合の抵抗変化率を求めた。Regarding the powder coating compositions of Examples and Comparative Examples,! 00Ω5
Resistance change rate when moisture absorption treatment is performed for 100 hours in saturated steam at 121 degrees Celsius and 2 atmospheres for samples that were coated with 20 resistor networks using the fluidized dipping method and baked for 3 hours in a dryer at 150 degrees Celsius. I asked for
上記粉体塗料組成物につき、１０ｍφのセラミックコン
デンサを各２０個流動浸漬法にて塗装し、１５０℃乾燥
機中で３時間焼成したサンプルにおいて、−４０℃（３
０分）←→１５０℃（３０分）の冷熱サイクルを繰り返
した場合の塗膜のクラック発生状況を評価した。Regarding the above powder coating composition, samples were coated with 20 ceramic capacitors each having a diameter of 10 m by the fluidized dipping method and baked in a dryer at 150°C for 3 hours.
The occurrence of cracks in the coating film was evaluated after repeated heating and cooling cycles at 150° C. (30 minutes).
上記粉体を、１００ｇ計量し、１８０ｃｃの紙コツプに
投入した後、３５℃乾燥機中で２４８ｒ放置した時のブ
ロッキングの有無を観察した。After weighing 100 g of the above powder and putting it into a 180 cc paper cup, it was left in a dryer at 35° C. for 248 r, and the presence or absence of blocking was observed.
以上のテスト結果を第１表に示した。The above test results are shown in Table 1.
第１表より、本発明のエポキシ樹脂粉体塗料組成物は、
比較例に比べ、優位な信頼性を持つことがわかる。From Table 1, the epoxy resin powder coating composition of the present invention is as follows:
It can be seen that this example has superior reliability compared to the comparative example.
また、バリスターハイブリッドＩＣ等の部品について適
用した場合についても、本発明のエポキシ樹脂粉体塗料
で塗装したものは、耐湿性、耐ヒートサイクル性が著し
く優れるという結果が得られた。Furthermore, when applied to parts such as varistor hybrid ICs, the results were obtained that those coated with the epoxy resin powder coating of the present invention have significantly excellent moisture resistance and heat cycle resistance.
Claims (3)
物 （Ｄ）無機充填剤 を含有し、アルキルベンゼンとホルムアルデヒドの縮合
生成物（Ｃ）の含有量がエポキシ樹脂（Ａ）１００重量
部に対し１０〜４０重量部であることを特徴とするエポ
キシ樹脂粉体塗料組成物。(1) (A) An epoxy resin with a melting point of 50 to 150°C (B) A curing agent (C) A condensation product of alkylbenzene and formaldehyde (D) A condensation product of alkylbenzene and formaldehyde containing an inorganic filler (C) An epoxy resin powder coating composition having a content of 10 to 40 parts by weight per 100 parts by weight of epoxy resin (A).
５００の範囲にあることを特徴とする特許請求の範囲第
１項記載のエポキシ樹脂粉体塗料組成物。(2) The epoxy equivalent of the epoxy resin (A) is 300 to 2
500. The epoxy resin powder coating composition according to claim 1, wherein the epoxy resin powder coating composition is in the range of 500%.
リット酸、無水ベンゾフェノンテトラカルボン酸の群の
中から選ばれた１種以上であることを特徴とする特許請
求の範囲第１項または第２項記載のエポキシ樹脂粉体塗
料組成物。(3) Claim 1, wherein the curing agent (B) is one or more selected from the group of trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic anhydride; or 2. The epoxy resin powder coating composition according to item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31417986A JPS63168472A (en) | 1986-12-27 | 1986-12-27 | Epoxy resin powder coating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31417986A JPS63168472A (en) | 1986-12-27 | 1986-12-27 | Epoxy resin powder coating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63168472A true JPS63168472A (en) | 1988-07-12 |
Family
ID=18050206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31417986A Pending JPS63168472A (en) | 1986-12-27 | 1986-12-27 | Epoxy resin powder coating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63168472A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152168A (en) * | 1987-10-21 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Epoxy resin powder coating composition |
| EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5153538A (en) * | 1974-11-05 | 1976-05-12 | Aika Kogyo Kk | PURAIMAA SOSEIBUTSU |
| JPS5839040A (en) * | 1981-09-02 | 1983-03-07 | Matsushita Electric Works Ltd | Forming material for sealing with epoxy resin |
| JPS5964623A (en) * | 1982-10-04 | 1984-04-12 | Matsushita Electric Works Ltd | Epoxy resin casting material |
| JPS60110747A (en) * | 1983-11-21 | 1985-06-17 | Matsushita Electric Works Ltd | Resin composition for casting |
| JPS6189271A (en) * | 1984-10-08 | 1986-05-07 | Sumitomo Deyurezu Kk | Epoxy resin composition for powder coating |
| JPS61181886A (en) * | 1985-02-06 | 1986-08-14 | Nissan Motor Co Ltd | Vibration damper for panel |
-
1986
- 1986-12-27 JP JP31417986A patent/JPS63168472A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5153538A (en) * | 1974-11-05 | 1976-05-12 | Aika Kogyo Kk | PURAIMAA SOSEIBUTSU |
| JPS5839040A (en) * | 1981-09-02 | 1983-03-07 | Matsushita Electric Works Ltd | Forming material for sealing with epoxy resin |
| JPS5964623A (en) * | 1982-10-04 | 1984-04-12 | Matsushita Electric Works Ltd | Epoxy resin casting material |
| JPS60110747A (en) * | 1983-11-21 | 1985-06-17 | Matsushita Electric Works Ltd | Resin composition for casting |
| JPS6189271A (en) * | 1984-10-08 | 1986-05-07 | Sumitomo Deyurezu Kk | Epoxy resin composition for powder coating |
| JPS61181886A (en) * | 1985-02-06 | 1986-08-14 | Nissan Motor Co Ltd | Vibration damper for panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152168A (en) * | 1987-10-21 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Epoxy resin powder coating composition |
| EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
| US5418265A (en) * | 1991-01-25 | 1995-05-23 | Somar Corporation | Powder epoxy resin coating composition |
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