JPS63167732U - - Google Patents

Info

Publication number
JPS63167732U
JPS63167732U JP6204187U JP6204187U JPS63167732U JP S63167732 U JPS63167732 U JP S63167732U JP 6204187 U JP6204187 U JP 6204187U JP 6204187 U JP6204187 U JP 6204187U JP S63167732 U JPS63167732 U JP S63167732U
Authority
JP
Japan
Prior art keywords
cavity
resin
semiconductor element
sealing device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6204187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6204187U priority Critical patent/JPS63167732U/ja
Publication of JPS63167732U publication Critical patent/JPS63167732U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6204187U 1987-04-23 1987-04-23 Pending JPS63167732U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6204187U JPS63167732U (enrdf_load_stackoverflow) 1987-04-23 1987-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6204187U JPS63167732U (enrdf_load_stackoverflow) 1987-04-23 1987-04-23

Publications (1)

Publication Number Publication Date
JPS63167732U true JPS63167732U (enrdf_load_stackoverflow) 1988-11-01

Family

ID=30895935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6204187U Pending JPS63167732U (enrdf_load_stackoverflow) 1987-04-23 1987-04-23

Country Status (1)

Country Link
JP (1) JPS63167732U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267345A (ja) * 2000-03-21 2001-09-28 Apic Yamada Corp 樹脂封止装置及び樹脂封止方法
JP2005305899A (ja) * 2004-04-23 2005-11-04 Ricoh Co Ltd 成形用金型および成形品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153866A (en) * 1978-05-24 1979-12-04 Hitachi Ltd Resin molding and its mold
JPS5795432A (en) * 1980-12-05 1982-06-14 Hitachi Ltd Mold structure for reaction injection molding
JPS6274613A (ja) * 1985-09-30 1987-04-06 Sony Corp 射出成形装置
JPS6220811B2 (enrdf_load_stackoverflow) * 1981-04-01 1987-05-08 Zeiss Jena Veb Carl

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153866A (en) * 1978-05-24 1979-12-04 Hitachi Ltd Resin molding and its mold
JPS5795432A (en) * 1980-12-05 1982-06-14 Hitachi Ltd Mold structure for reaction injection molding
JPS6220811B2 (enrdf_load_stackoverflow) * 1981-04-01 1987-05-08 Zeiss Jena Veb Carl
JPS6274613A (ja) * 1985-09-30 1987-04-06 Sony Corp 射出成形装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267345A (ja) * 2000-03-21 2001-09-28 Apic Yamada Corp 樹脂封止装置及び樹脂封止方法
JP2005305899A (ja) * 2004-04-23 2005-11-04 Ricoh Co Ltd 成形用金型および成形品

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