JPS63165855U - - Google Patents
Info
- Publication number
- JPS63165855U JPS63165855U JP1987059805U JP5980587U JPS63165855U JP S63165855 U JPS63165855 U JP S63165855U JP 1987059805 U JP1987059805 U JP 1987059805U JP 5980587 U JP5980587 U JP 5980587U JP S63165855 U JPS63165855 U JP S63165855U
- Authority
- JP
- Japan
- Prior art keywords
- flip chip
- wiring board
- conductor
- bumps
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/14181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987059805U JPH0543485Y2 (enrdf_load_stackoverflow) | 1987-04-20 | 1987-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987059805U JPH0543485Y2 (enrdf_load_stackoverflow) | 1987-04-20 | 1987-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63165855U true JPS63165855U (enrdf_load_stackoverflow) | 1988-10-28 |
| JPH0543485Y2 JPH0543485Y2 (enrdf_load_stackoverflow) | 1993-11-02 |
Family
ID=30891644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987059805U Expired - Lifetime JPH0543485Y2 (enrdf_load_stackoverflow) | 1987-04-20 | 1987-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543485Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-04-20 JP JP1987059805U patent/JPH0543485Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543485Y2 (enrdf_load_stackoverflow) | 1993-11-02 |