JPS63164239U - - Google Patents

Info

Publication number
JPS63164239U
JPS63164239U JP1987057646U JP5764687U JPS63164239U JP S63164239 U JPS63164239 U JP S63164239U JP 1987057646 U JP1987057646 U JP 1987057646U JP 5764687 U JP5764687 U JP 5764687U JP S63164239 U JPS63164239 U JP S63164239U
Authority
JP
Japan
Prior art keywords
hole
frame
wiring board
thermally conductive
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987057646U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987057646U priority Critical patent/JPS63164239U/ja
Publication of JPS63164239U publication Critical patent/JPS63164239U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/682
    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1987057646U 1987-04-15 1987-04-15 Pending JPS63164239U (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987057646U JPS63164239U (index.php) 1987-04-15 1987-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987057646U JPS63164239U (index.php) 1987-04-15 1987-04-15

Publications (1)

Publication Number Publication Date
JPS63164239U true JPS63164239U (index.php) 1988-10-26

Family

ID=30887549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987057646U Pending JPS63164239U (index.php) 1987-04-15 1987-04-15

Country Status (1)

Country Link
JP (1) JPS63164239U (index.php)

Similar Documents

Publication Publication Date Title
JPS63164239U (index.php)
JPH0270447U (index.php)
JPS6333665U (index.php)
JPS63187330U (index.php)
JPH0247062U (index.php)
JPS6371570U (index.php)
JPS59171350U (ja) 半導体素子の実装構造
JPS6316455U (index.php)
JPH03101529U (index.php)
JPS63115233U (index.php)
JPS62112144U (index.php)
JPH03120052U (index.php)
JPS63174460U (index.php)
JPH01176946U (index.php)
JPS58195445U (ja) 半導体集積回路パツケ−ジ
JPS6416636U (index.php)
JPS63147831U (index.php)
JPH0220349U (index.php)
JPS5881940U (ja) 半導体素子の取付構造
JPH0351868U (index.php)
JPS62162848U (index.php)
JPS6240884U (index.php)
JPS6424835U (index.php)
JPH03117839U (index.php)
JPS606231U (ja) 混成集積回路の構造