JPS6316189B2 - - Google Patents
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- Publication number
- JPS6316189B2 JPS6316189B2 JP58220102A JP22010283A JPS6316189B2 JP S6316189 B2 JPS6316189 B2 JP S6316189B2 JP 58220102 A JP58220102 A JP 58220102A JP 22010283 A JP22010283 A JP 22010283A JP S6316189 B2 JPS6316189 B2 JP S6316189B2
- Authority
- JP
- Japan
- Prior art keywords
- steam
- cleaning
- section
- substrate
- vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- 238000013020 steam cleaning Methods 0.000 claims description 31
- 238000004140 cleaning Methods 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 description 44
- 238000009833 condensation Methods 0.000 description 12
- 230000005494 condensation Effects 0.000 description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Description
【発明の詳細な説明】 本発明は、蒸気洗浄装置の改良に関する。[Detailed description of the invention] The present invention relates to improvements in steam cleaning equipment.
蒸気洗浄は、被洗浄物を精密洗浄する手段であ
り、特に半導体製造用のフオトマスクブランク、
フオトマスクや各種光学ガラス等の基板の被洗浄
物の洗浄工程において使用され、被洗浄物上の付
着水を蒸発潜熱の小さい洗浄液に置換して、その
被洗浄物に露結した凝縮液を流して、洗浄するも
のである。 Steam cleaning is a means of precision cleaning of objects to be cleaned, especially photomask blanks for semiconductor manufacturing,
It is used in the process of cleaning substrates such as photomasks and various types of optical glass, and replaces the adhering water on the object with a cleaning liquid that has a small latent heat of vaporization, and then flows the condensed liquid onto the object. , to be washed.
従来の蒸気洗浄装置は、第１図に示すように、
装置本体１内の下方部分に洗浄液２を収容し、洗
浄液２内に加熱器３を配設して、その洗浄液２を
加熱することにより、蒸気Ｖを発生する蒸気発生
部４と、装置本体１内の上方部分にコイル状冷却
管５を配設して、その冷却管５に冷却水（W1→
W2）を流すことにより、上昇してきた前記蒸気
Ｖを冷却して、装置本体１の上方開口から外部へ
のもれを防止する冷却部６と、装置本体１内の中
間部分に被洗浄物としての基板７を設置し、その
基板７の表面に前記蒸気Ｖを露結させた凝縮液Ｗ
を流して、その基板７を洗浄する蒸気洗浄部８と
を具備している。なお、蒸気洗浄部８において、
基板７は設置治具９に設置され、その設置治具９
と連結した搬送アーム１０を手にして、蒸気洗浄
部８に配置される。そして、基板７の表面を流れ
た凝縮液Ｗは、基板７の直下に設置された受け皿
１１と、これに連結された排液ドレーン１２を通
して装置本体１の内部から外部へ排出される。 The conventional steam cleaning equipment, as shown in Fig. 1,
A cleaning liquid 2 is stored in the lower part of the apparatus main body 1, a heater 3 is disposed in the cleaning liquid 2, and a steam generating section 4 generates steam V by heating the cleaning liquid 2; A coiled cooling pipe 5 is arranged in the upper part of the inside, and cooling water (W 1 →
A cooling section 6 that cools the rising steam V by flowing water W 2 ) to prevent it from leaking to the outside from the upper opening of the apparatus main body 1, and a A substrate 7 is installed as
A steam cleaning section 8 is provided for cleaning the substrate 7 by flowing a vapor therethrough. Note that in the steam cleaning section 8,
The board 7 is installed on an installation jig 9, and the installation jig 9
The user is placed in the steam cleaning section 8 while holding the transport arm 10 connected to the robot. The condensate W flowing on the surface of the substrate 7 is discharged from the inside of the apparatus main body 1 to the outside through a tray 11 installed directly below the substrate 7 and a drainage drain 12 connected to the tray 11.
このような蒸気洗浄装置は、洗浄液２の蒸気Ｖ
発生、基板７の表面上での蒸気露結、凝縮液Ｗの
流れにより蒸気洗浄するが、そのためには冷却部
６の冷却管５の下方付近で蒸気Ｖから液体への相
変化を起こしている。この相変化の界面Ａは、ベ
ーパーラインＡと称せられている。このベーパー
ラインＡは定常状態において一定しており、第１
図に示すように基板７より上方の位置に保持され
ていれば、基板７が蒸気Ｖ中に浸漬されて、その
基板７の温度が洗浄液２の沸点、すなわち蒸気温
度と等しくなつた時点で、その基板７を装置本体
１から引上げて乾燥させることができる。また同
時に、蒸気Ｖがその基板７の表面上に露結して凝
縮液Ｗを形成し、その凝縮液Ｗが基板７の表面を
洗い流すことから、洗浄効果も奏する。 Such a steam cleaning device uses the steam V of the cleaning liquid 2.
generation, vapor dew on the surface of the substrate 7, and vapor cleaning by the flow of the condensate W. To do this, a phase change from vapor V to liquid occurs near the bottom of the cooling pipe 5 of the cooling section 6. . This phase change interface A is called vapor line A. This vapor line A is constant in a steady state, and the first
If the substrate 7 is held at a position above the substrate 7 as shown in the figure, when the substrate 7 is immersed in the vapor V and the temperature of the substrate 7 becomes equal to the boiling point of the cleaning liquid 2, that is, the vapor temperature, The substrate 7 can be pulled up from the device main body 1 and dried. At the same time, the vapor V condenses on the surface of the substrate 7 to form a condensate W, and the condensate W washes away the surface of the substrate 7, thereby providing a cleaning effect.
しかしながら、蒸気発生量を越えて基板７を数
多く同時に蒸気洗浄部８に配置して蒸気Ｖ中に浸
漬した場合、基板７の合計した総面積が増加する
ことから、基板１枚当り必要とする凝縮量Ｗに不
足を来たし、洗浄効果を低減させる欠点があつ
た。 However, if a large number of substrates 7 are placed in the steam cleaning section 8 and immersed in the steam V at the same time, exceeding the amount of steam generated, the total area of the substrates 7 increases. The amount W was insufficient and the cleaning effect was reduced.
また、この場合、発生する蒸気Ｖは、多数の基
板の浸漬時に各基板表面上に露結・凝縮した液が
下滴下する際、蒸気が加速度的に露結・凝縮さ
れ、凝縮量Ｗとなつて下方に急激に洗い流される
ことから、前述したベーパーラインＡは、第１図
に示した位置を保持することができず、基板７の
下方付近に位置するベーパーラインＢまで降下
し、連続的に発生している蒸気Ｖにより、先のベ
ーパーラインＡまで上昇復帰するには、所定の時
間経過が必要になる。その結果、前記所定の時間
経過中は、蒸気洗浄を不能にする欠点があつた。 In addition, in this case, the generated vapor V becomes the amount of condensation W as the vapor dews and condenses at an accelerated rate when the dew/condensed liquid drips onto the surface of each substrate when a large number of substrates are immersed. Since the vapor line A mentioned above cannot maintain the position shown in FIG. 1, it descends to the vapor line B located near the bottom of the substrate 7, and continues to A predetermined period of time is required for the generated steam V to rise and return to the previous vapor line A. As a result, there was a drawback that steam cleaning was disabled during the predetermined period of time.
更にまた、前述したベーパーラインＢ→Ａの上
昇復帰において、基板表面の露結がその下方面か
ら開始し、次いで上方面へ進行することから、基
板全表面にわたつて露結完了する直前では、基板
上方面で汚れを含む凝縮液Ｗが洗浄済の基板下方
面に向かつて流れることになり、結局、基板表面
に付着した汚れを完全に流しきれない欠点があつ
た。 Furthermore, in the upward return of the vapor line B→A described above, dew condensation on the substrate surface starts from the lower side and then progresses upward, so that immediately before the dew condensation is completed over the entire surface of the substrate, The condensate W containing dirt on the upper surface of the substrate flows toward the lower surface of the cleaned substrate, resulting in the drawback that the dirt adhering to the substrate surface cannot be completely washed away.
以上の欠点を除去手段として、加熱器３の容量
を多くすることが考えられるが、この手段によれ
ば、熱エネルギーの増加のみならず、蒸気発生部
４及び蒸気洗浄部８の耐熱化をより一層計らなけ
ればならない。 In order to eliminate the above-mentioned drawbacks, increasing the capacity of the heater 3 can be considered, but this method not only increases the thermal energy but also makes the steam generation section 4 and the steam cleaning section 8 more heat resistant. I have to measure it even more.
本発明は、上記のような欠点を除去するために
なされたものであり、過剰な加熱容量を用いるこ
となく、基板表面上での露結、凝縮量を充分に確
保し、かつベーパーラインを基板上方面まで降下
させないようにすることにより、洗浄効果を高め
た蒸気洗浄装置を提供することを目的としてい
る。 The present invention was made in order to eliminate the above-mentioned drawbacks, and it is possible to secure a sufficient amount of dew condensation and condensation on the substrate surface without using excessive heating capacity, and to remove vapor lines from the substrate. It is an object of the present invention to provide a steam cleaning device that improves the cleaning effect by preventing the steam from descending to the upper surface.
第２図は、本発明による一実施例の蒸気洗浄装
置の構造を示し、第１図に示した構造部分を基本
的に同一のものについては互いに同一記号を付し
ている。 FIG. 2 shows the structure of a steam cleaning apparatus according to an embodiment of the present invention, and structural parts that are basically the same as those shown in FIG. 1 are given the same symbols.
本発明の一実施例の特徴となる装置本体１３の
うち蒸気洗浄部１４は、その上方付近から冷却部
６の下方付近までが、第２図に示すとおり斜面１
５を形成して、その部分の容積が連続的に減少し
ており、かつ蒸気発生部４と蒸気洗浄部１４の各
容積は冷却部６の容積よりも大きい構造になつて
いる。さらに、第２図に示すとおり、冷却部６の
下方開口面６ａ、すなわち、斜面１５，１５の上
端１５ａ，１５ａを結ぶ平面の面積が、蒸気洗浄
部１４の上方付近の開口部における、冷却部６か
ら蒸気発生部４方向に対して実質的に直交する方
向の断面積、すなわち、斜面１５，１５の下端１
５ｂ，１５ｂを結ぶ平面の面積よりも小さい。さ
らにまた、第２図に示すとおり冷却部６の下方開
口面６ａと蒸気洗浄部１４の前述した上方の開口
部とは、連結している。そして、基板７は、設置
治具９と搬送アーム１０を使用して、蒸気洗浄部
１４に配置された容器１６内に収納されている。
この容器１６の高さ寸法は基板７の高さ寸法より
も大きく設計されていることから、この基板は高
さ寸法において容器１６の側面により完全に収納
される。更に、この容器１６には底面を有して、
洗浄液としてイソプロピルアルコール２を収容し
た蒸気発生部４から発生した蒸気Ｖの上昇方向に
対して遮蔽構造になつている。したがつて、この
容器１６は、第２図に示すとおり、上方のみに開
口部を有している。なお、この底面は下方中心に
向つて傾斜していることから、基板７の表面を洗
い出した凝縮液Ｗは排出ドレーン１７を通して装
置本体１３の内部から外部に排出され、さらに、
底面下方の蒸気Ｖを装置本体１３の内側面方向に
導くことができる。 As shown in FIG.
5, and the volume of that portion is continuously reduced, and the volumes of the steam generating section 4 and the steam cleaning section 14 are larger than the volume of the cooling section 6. Furthermore, as shown in FIG. 2, the area of the lower opening surface 6a of the cooling section 6, that is, the area of the plane connecting the upper ends 15a, 15a of the slopes 15, 15, 6 to the cross-sectional area in the direction substantially perpendicular to the direction of the steam generating part 4, that is, the lower end 1 of the slope 15, 15
It is smaller than the area of the plane connecting 5b and 15b. Furthermore, as shown in FIG. 2, the lower opening surface 6a of the cooling section 6 and the above-mentioned upper opening of the steam cleaning section 14 are connected. The substrate 7 is housed in a container 16 disposed in the steam cleaning section 14 using the installation jig 9 and the transfer arm 10.
Since the height of the container 16 is designed to be larger than that of the substrate 7, the substrate is completely accommodated by the side surface of the container 16 in terms of height. Furthermore, this container 16 has a bottom surface,
It has a shielding structure against the rising direction of the steam V generated from the steam generating section 4 containing isopropyl alcohol 2 as a cleaning liquid. Therefore, this container 16 has an opening only at the top, as shown in FIG. Since this bottom surface is inclined toward the center of the lower part, the condensate W that has washed off the surface of the substrate 7 is discharged from the inside of the apparatus main body 13 to the outside through the discharge drain 17, and further,
The steam V below the bottom surface can be guided toward the inner surface of the device main body 13.
本発明による蒸気洗浄装置は以上のような構造
を有することから、蒸気発生部４から発生した蒸
気Ｖは、蒸気洗浄部１４における装置本体１３の
内側面と容器１６の外側面の間に誘導されて上昇
し、冷却部６の冷却器５により冷却されて、その
冷却器５の直下付近でベーパーラインＡを形成す
る。そして、多数の基板７を容器１６に収納する
と、蒸気Ｖは容器１６の開口部から進入して、基
板７の上方面から下方面に向かつて浸漬し続け、
基板７の表面温度が蒸気Ｖの温度（沸点82℃）に
達する露結修了直前まで、その露結が上方面から
下方面に向かつて進行する。この露結は凝縮液Ｗ
となつて、基板７の上方面から下方面に向かつて
洗い流され、露結修了後、基板７は引上げられ、
乾燥される。 Since the steam cleaning device according to the present invention has the above structure, the steam V generated from the steam generation section 4 is guided between the inner surface of the device main body 13 and the outer surface of the container 16 in the steam cleaning section 14. The vapor rises, is cooled by the cooler 5 of the cooling section 6, and forms a vapor line A near directly below the cooler 5. When a large number of substrates 7 are stored in the container 16, the vapor V enters from the opening of the container 16 and continues to immerse the substrates 7 from the upper surface to the lower surface.
The dew condensation progresses from the top to the bottom until the surface temperature of the substrate 7 reaches the temperature of the vapor V (boiling point 82° C.), just before dew condensation is completed. This dew is condensate W
As a result, the substrate 7 is washed away from the upper surface to the lower surface, and after the dew condensation is completed, the substrate 7 is pulled up.
dried.
このような露結→凝縮系は容器１６内で行わ
れ、前述した蒸気Ｖの誘導上昇系とは分離されて
いることから、容器１６外側に存する蒸気Ｖの露
結・凝縮が容器１６内側に存する蒸気Ｖの露結・
凝縮と同時には生ぜず、その結果基板７の収容後
のベーパーラインＢは、ベーパーラインＡより一
時的に降下するものの、容器１６の外側で常時上
昇している蒸気Ｖにより容器１６の開口部付近で
阻止することができる。その結果、容器１６内で
は、発生した蒸気Ｖをその開口部から進入させる
ことができる。なお、容器１６の開口部付近にま
で降下したベーパーラインＢは、その後常時上昇
している蒸気Ｖによつて再びベーパーラインＡま
で上昇する。また、冷却部６の下方開口面６ａの
面積が、蒸気洗浄部１４の上方付近の開口部の断
面積より小さいことから、冷却効果が向上し、ベ
ーパーラインで形成される面の中央近傍におい
て、冷却部６への蒸気Ｖの局部的に異常な漏洩を
防止することができる。その結果、基板７を洗浄
した後、冷却部６を通つて基板７を引上げるとき
に、基板７の表面に洗浄液のしみの付着を防止す
ることができる。また、冷却部６の下方開口面６
ａの面積を小さくしたので、冷却部６の容積が、
蒸気発生部４や蒸気洗浄部１４の容積よりも小さ
くなり、装置本体１３がコンパクトになる。ま
た、蒸気洗浄部１４の上方付近に斜面１５を形成
していることから、円滑に蒸気Ｖを冷却部６に導
くことができる。なお、装置本体１３の内側面と
容器１６の外側面の間隔は、蒸気Ｖの上昇を確保
できる程度であればよく、好ましくは基板７の寸
法及びその枚数の増加に応じて、広くとる方がよ
い。 Since such a dew→condensation system is performed inside the container 16 and is separated from the steam V induction rise system described above, the dew/condensation of the steam V existing outside the container 16 is caused to occur inside the container 16. Condensation of existing vapor V
This does not occur at the same time as condensation, and as a result, the vapor line B after the substrate 7 is accommodated temporarily drops below the vapor line A, but due to the vapor V constantly rising outside the container 16, the vapor line B rises near the opening of the container 16. can be prevented with. As a result, the generated steam V can enter the container 16 through its opening. Note that the vapor line B that has descended to the vicinity of the opening of the container 16 then rises again to the vapor line A due to the constantly rising vapor V. In addition, since the area of the lower opening surface 6a of the cooling section 6 is smaller than the cross-sectional area of the opening near the upper part of the steam cleaning section 14, the cooling effect is improved, and near the center of the surface formed by the vapor line, Local abnormal leakage of the steam V into the cooling unit 6 can be prevented. As a result, when the substrate 7 is pulled up through the cooling section 6 after cleaning, it is possible to prevent stains of the cleaning liquid from adhering to the surface of the substrate 7. In addition, the lower opening surface 6 of the cooling section 6
Since the area of a is reduced, the volume of the cooling section 6 is
The volume is smaller than that of the steam generation section 4 and the steam cleaning section 14, and the apparatus main body 13 becomes compact. Further, since the slope 15 is formed near the upper part of the steam cleaning section 14, the steam V can be smoothly guided to the cooling section 6. Note that the distance between the inner surface of the device body 13 and the outer surface of the container 16 is sufficient as long as it can ensure the rise of the steam V, and it is preferable to make the distance wide according to the dimensions of the substrates 7 and the increase in the number of substrates 7. good.
次に、本例の蒸気洗浄装置を使用して、フオト
マスク基板を洗浄した場合の実施例を説明する。 Next, an example will be described in which a photomask substrate is cleaned using the steam cleaning apparatus of this example.
表面寸法が152mm角、厚さ2.3mmのフオトマスク
基板12枚を設置治具９に設置して、イソプロピル
アルコール槽にて１分間、超音波洗浄を行い、次
に、本例の蒸気洗浄装置に上記フオトマスク基板
12枚を収容して、蒸気に１分間浸漬して洗浄し、
引上げて乾燥させた。そして、基板表面に集光ラ
ンプを照して検査した結果、3μｍ以上の粒子を
確認されず、清浄なフオトマスク基板が得られ
た。なお、洗浄液としてイソプロピルアルコール
の代わりに、フレオン、塩化メチレン等の有機溶
剤を用いてもよい。また、本発明による蒸気洗浄
装置は、単槽式の洗浄槽として使用してもよい
が、多槽式の洗浄槽の最終槽として使用すること
が洗浄効果面から好ましい。 Twelve photomask substrates with a surface dimension of 152 mm square and a thickness of 2.3 mm were placed on the installation jig 9, and ultrasonically cleaned for 1 minute in an isopropyl alcohol bath. photomask substrate
Holds 12 sheets, soaks them in steam for 1 minute and cleans them.
It was pulled up and dried. As a result of inspecting the substrate surface by shining a condensing lamp on it, no particles larger than 3 μm were found, and a clean photomask substrate was obtained. Note that an organic solvent such as Freon or methylene chloride may be used instead of isopropyl alcohol as the cleaning liquid. Further, the steam cleaning device according to the present invention may be used as a single-tank type cleaning tank, but from the viewpoint of cleaning effectiveness, it is preferable to use it as the final tank of a multi-tank type cleaning tank.
以上のとおり、本発明によれば、加熱容量を過
剰にすることなく、充分な蒸気密度が得られ、か
つ被洗浄物を上方から下方へと露結させて、凝縮
液を洗い流して、引上げ時に乾燥させることによ
り、極めて洗浄な蒸気乾燥を行うことができる。 As described above, according to the present invention, a sufficient vapor density can be obtained without increasing the heating capacity, and the object to be cleaned is dewy from the top to the bottom, and the condensate is washed away. By drying, extremely clean steam drying can be performed.
第１図は従来の蒸気洗浄装置の構造を示し、同
図ａは正面断面図及び同図ｂは側面断面図であ
る。第２図は本発明による一実施例の蒸気洗浄装
置の構造を示し、同図ａは正面断面図及び同図ｂ
は側面断面図である。
１３……装置本体、２……洗浄液、３……加熱
器、４……蒸気発生部、５……冷却器、６……冷
却部、７……被洗浄物、１４……蒸気洗浄部、１
６……容器。
FIG. 1 shows the structure of a conventional steam cleaning device, with FIG. 1A being a front sectional view and FIG. 1B being a side sectional view. FIG. 2 shows the structure of a steam cleaning device according to an embodiment of the present invention, and FIG. 2a is a front sectional view and FIG.
is a side sectional view. 13... Apparatus body, 2... Cleaning liquid, 3... Heater, 4... Steam generating section, 5... Cooler, 6... Cooling section, 7... Object to be cleaned, 14... Steam cleaning section, 1
6... Container.
Claims (1)
収容された洗浄液を加熱して、蒸気を発生する蒸
気発生部と、前記装置本体の上方部分に前記蒸気
を冷却する冷却部と、前記蒸気発生部と前記冷却
部との間に被洗浄物を設置して、前記被洗浄物の
表面に前記蒸気が露結した凝縮液を流して、前記
被洗浄物を洗浄する蒸気洗浄部とを具備した蒸気
洗浄装置において、前記冷却部の下方開口面の面
積が、前記蒸気洗浄部の上方付近の開口部におけ
る、前記冷却部から前記蒸気発生部方向に対して
直交する方向の断面積より小さく、かつ前記冷却
部の前記下方開口面と前記蒸気洗浄部の前記上方
付近の開口部とが連結しており、さらに前記被洗
浄物の高さ寸法よりも大きい高さ寸法を有する側
面と、底面とを備え、上方のみに開口部を有する
容器を前記蒸気洗浄部に配置することを特徴とす
る蒸気洗浄装置。1. A steam generating section that heats the cleaning liquid stored in the lower part of the bottomed device main body with an open top and generates steam, a cooling section that cools the steam in the upper part of the device main body, and the steam generator. and a steam cleaning section that installs an object to be cleaned between the generating section and the cooling section, and flows a condensate containing the steam onto the surface of the object to be cleaned, thereby cleaning the object. In the steam cleaning device, the area of the lower opening surface of the cooling part is smaller than the cross-sectional area of the opening near the upper part of the steam cleaning part in a direction perpendicular to the direction from the cooling part to the steam generating part, and the lower opening surface of the cooling section and the opening near the upper part of the steam cleaning section are connected, and the side surface and the bottom surface have a height dimension larger than the height dimension of the object to be cleaned. A steam cleaning device comprising: a container having an opening only at the top and disposed in the steam cleaning section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22010283A JPS60114385A (en) | 1983-11-22 | 1983-11-22 | Steam washer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22010283A JPS60114385A (en) | 1983-11-22 | 1983-11-22 | Steam washer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60114385A JPS60114385A (en) | 1985-06-20 |
| JPS6316189B2 true JPS6316189B2 (en) | 1988-04-07 |
Family
ID=16745944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22010283A Granted JPS60114385A (en) | 1983-11-22 | 1983-11-22 | Steam washer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114385A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0659070U (en) * | 1993-02-02 | 1994-08-16 | 賢一 江草 | A book that automatically completes as an autobiography of your own history by entering all the events of your life in the blank spaces in the uniform text. |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5089146U (en) * | 1973-12-17 | 1975-07-28 |
-
1983
- 1983-11-22 JP JP22010283A patent/JPS60114385A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60114385A (en) | 1985-06-20 |
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