JPS63159894U - - Google Patents
Info
- Publication number
- JPS63159894U JPS63159894U JP1987052139U JP5213987U JPS63159894U JP S63159894 U JPS63159894 U JP S63159894U JP 1987052139 U JP1987052139 U JP 1987052139U JP 5213987 U JP5213987 U JP 5213987U JP S63159894 U JPS63159894 U JP S63159894U
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- semiconductor
- fixed
- semiconductor element
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Power Conversion In General (AREA)
- Fuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の一実施例を示す図、第2図及
び第3図は第1図のA―A矢視図及び回路図であ
る。第4図は本考案が適用される半導体変換装置
の側面図である。 1……ヒートシンク、2……半導体素子、3…
…導体、4……半導体スタツク、5……締付クラ
ンプ、6……ヒユーズ、7……導体、8……スタ
ツク取付板、9……金物、10……絶縁板、11
……金物、12a,12b……角穴、13……半
導体ユニツト、14……半導体変換装置、15…
…トビラ、16……フイルター、17……吸気口
、18……冷却フアン、19……排気口。
び第3図は第1図のA―A矢視図及び回路図であ
る。第4図は本考案が適用される半導体変換装置
の側面図である。 1……ヒートシンク、2……半導体素子、3…
…導体、4……半導体スタツク、5……締付クラ
ンプ、6……ヒユーズ、7……導体、8……スタ
ツク取付板、9……金物、10……絶縁板、11
……金物、12a,12b……角穴、13……半
導体ユニツト、14……半導体変換装置、15…
…トビラ、16……フイルター、17……吸気口
、18……冷却フアン、19……排気口。
Claims (1)
- 半導体素子と直列にヒユーズが接続され、空気
で冷却する半導体ユニツトにおいて、半導体素子
を冷却するヒートシンク側に取り付けられた導体
に前記ヒユーズの片端を固定し、他端を外部接続
用導体に固定し、その導体間にコの字状の絶縁板
を取り付けして、前記ヒユーズをダクト状にした
ことを特徴とする半導体ユニツト。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987052139U JPS63159894U (ja) | 1987-04-08 | 1987-04-08 | |
US07/169,750 US4866503A (en) | 1987-04-08 | 1988-03-18 | Semiconductor stack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987052139U JPS63159894U (ja) | 1987-04-08 | 1987-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63159894U true JPS63159894U (ja) | 1988-10-19 |
Family
ID=12906537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987052139U Pending JPS63159894U (ja) | 1987-04-08 | 1987-04-08 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4866503A (ja) |
JP (1) | JPS63159894U (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066998A (en) * | 1989-06-30 | 1991-11-19 | At&T Bell Laboratories | Severable conductive path in an integrated-circuit device |
US5043797A (en) * | 1990-04-03 | 1991-08-27 | General Electric Company | Cooling header connection for a thyristor stack |
WO1998011767A1 (en) * | 1996-09-16 | 1998-03-19 | Abb Power T & D Company Inc. | Solid state switching device arrangement for silicon transfer switch |
US6333853B2 (en) * | 1998-12-22 | 2001-12-25 | S&C Electric Company | Configuration of power electronic device modules |
EP1494278A1 (de) * | 2003-07-04 | 2005-01-05 | Siemens Aktiengesellschaft | Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren |
CN102290301B (zh) * | 2010-06-18 | 2014-04-02 | 厦门赛尔特电子有限公司 | 一种大电流熔断器 |
CN109804506B (zh) * | 2016-10-31 | 2020-07-28 | 株式会社自动网络技术研究所 | 配线模块 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT323288B (de) * | 1973-02-15 | 1975-07-10 | Siemens Ag | Luftgekuhlter stromrichtersatz |
JPS5713970A (en) * | 1980-06-03 | 1982-01-25 | Mitsubishi Electric Corp | Semiconductor rectifying device stack |
JPS6311906Y2 (ja) * | 1981-06-15 | 1988-04-06 | ||
US4554574A (en) * | 1983-08-04 | 1985-11-19 | Associated Equipment Corporation | Rectifier assembly for parallel connection of diodes |
-
1987
- 1987-04-08 JP JP1987052139U patent/JPS63159894U/ja active Pending
-
1988
- 1988-03-18 US US07/169,750 patent/US4866503A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4866503A (en) | 1989-09-12 |