JPS5713970A - Semiconductor rectifying device stack - Google Patents

Semiconductor rectifying device stack

Info

Publication number
JPS5713970A
JPS5713970A JP7520480A JP7520480A JPS5713970A JP S5713970 A JPS5713970 A JP S5713970A JP 7520480 A JP7520480 A JP 7520480A JP 7520480 A JP7520480 A JP 7520480A JP S5713970 A JPS5713970 A JP S5713970A
Authority
JP
Japan
Prior art keywords
rectifying device
main conductor
semiconductor
arms
positive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7520480A
Other languages
Japanese (ja)
Inventor
Junichi Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7520480A priority Critical patent/JPS5713970A/en
Priority to DE3152040T priority patent/DE3152040C2/en
Priority to AU72281/81A priority patent/AU541377B2/en
Priority to BR8108635A priority patent/BR8108635A/en
Priority to PCT/JP1981/000122 priority patent/WO1981003582A1/en
Priority to CH769/82A priority patent/CH661151A5/en
Publication of JPS5713970A publication Critical patent/JPS5713970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To reduce the number of the semiconductor rectifying device stack for a device by a method wherein arms of positive side rectifying device and arms of negative side rectifying device are attached symmetrically at both sides of the main conductor and are fixed to constitute the semiconductor rectifying device stack. CONSTITUTION:The AC side main conductor 34 extending in the vertical direction are provided, and the DC side positive main conductor 33A, the DC side negative main conductor 33B are provided on the right and left sides along the former. The plural arms of rectifying device consisted of cooling pieces 35A, 35B, the semiconductor rectifying devices 36A, 36B, fuses 38A, 38B and connecting conductors 39 are arranged on the side faces of both main conductors 33A, 33B in the vertical direction symmetrically with positive and negative. The connecting conductors 39 corresponding a pair of arms of positive and negative sides rectifying devices are connected with each other and is connected to the AC side main conductor 34. Accordingly, the number of the semiconductor rectifying device stacks used when a semiconductor converter of polyphase bridge rectifier, etc., is constituted can be reduced by half as compared with the conventional system.
JP7520480A 1980-06-03 1980-06-03 Semiconductor rectifying device stack Pending JPS5713970A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP7520480A JPS5713970A (en) 1980-06-03 1980-06-03 Semiconductor rectifying device stack
DE3152040T DE3152040C2 (en) 1980-06-03 1981-06-02 RECTIFIER ARRANGEMENT
AU72281/81A AU541377B2 (en) 1980-06-03 1981-06-02 Semiconductor element stack
BR8108635A BR8108635A (en) 1980-06-03 1981-06-02 SEMICONDUCTOR ELEMENT STACK
PCT/JP1981/000122 WO1981003582A1 (en) 1980-06-03 1981-06-02 Semiconductor element stack
CH769/82A CH661151A5 (en) 1980-06-03 1981-06-02 Semiconductor element stack.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7520480A JPS5713970A (en) 1980-06-03 1980-06-03 Semiconductor rectifying device stack

Publications (1)

Publication Number Publication Date
JPS5713970A true JPS5713970A (en) 1982-01-25

Family

ID=13569422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7520480A Pending JPS5713970A (en) 1980-06-03 1980-06-03 Semiconductor rectifying device stack

Country Status (1)

Country Link
JP (1) JPS5713970A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866503A (en) * 1987-04-08 1989-09-12 Kabushiki Kaisha Toshiba Semiconductor stack
JPH0480066U (en) * 1990-11-27 1992-07-13

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4218246Y1 (en) * 1965-11-29 1967-10-23
JPS4721093U (en) * 1971-03-09 1972-11-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4218246Y1 (en) * 1965-11-29 1967-10-23
JPS4721093U (en) * 1971-03-09 1972-11-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866503A (en) * 1987-04-08 1989-09-12 Kabushiki Kaisha Toshiba Semiconductor stack
JPH0480066U (en) * 1990-11-27 1992-07-13

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