JPS63158216A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPS63158216A JPS63158216A JP61305956A JP30595686A JPS63158216A JP S63158216 A JPS63158216 A JP S63158216A JP 61305956 A JP61305956 A JP 61305956A JP 30595686 A JP30595686 A JP 30595686A JP S63158216 A JPS63158216 A JP S63158216A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- coated cloth
- cut surface
- temperature
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004744 fabric Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は積層板の製造法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a laminate.
(従来の技術)
従来、印刷回路板用等の積層板は熱硬化性樹脂フェスを
クラフト紙、リンター紙、ガラス織布、ガラス不織布等
の長尺の基材に含浸乾燥させることにより塗工布を得、
この塗工布を切断機により所定の大きさに切断し、これ
を必要枚数積層し、用途に応し銅箔を片面又は両面に加
え、加軌加■成形されて製造されている。(Prior art) Conventionally, laminates for printed circuit boards, etc. have been made by impregnating and drying a long base material such as kraft paper, linter paper, glass woven fabric, glass non-woven fabric, etc. with a thermosetting resin face. obtained,
This coated fabric is cut into a predetermined size using a cutting machine, the required number of sheets are laminated, copper foil is added to one or both sides depending on the purpose, and the fabric is machined and formed.
(発明が解決しようとする問題点)
塗工布の切断面には、塗工布切断時に発生した切粉が残
ったままになっており、この切粉が空中に飛散し積層板
構成材料の表面に付着し、成形された後に積層板表面(
主に銅箔面上)に打痕(微細な凹凸乃至傷)となること
がある。(Problem to be solved by the invention) Chips generated when cutting the coated fabric remain on the cut surface of the coated fabric, and these chips scatter in the air and damage the laminate constituent materials. After adhering to the surface and forming, the laminate surface (
This may result in dents (fine irregularities or scratches) mainly on the copper foil surface.
最近、の印刷回路配線板の高密度化により、回路導体の
細線化が進んでいるが、積層板の打痕(主に銅箔面上の
打痕)は回路の断線、ショートの原因となり印刷回路配
線板加工上の大きな問題となっている。Recently, circuit conductors have become thinner due to the increased density of printed circuit wiring boards, but dents in laminates (mainly dents on the copper foil surface) can cause disconnections and short circuits in printed circuits. This has become a major problem in processing circuit wiring boards.
本発明は、塗工布の切断時に発生する切粉を減少させる
ことにより積層板表面の打痕発生の少ない積層板の製造
法を堤供するものである。The present invention provides a method for manufacturing a laminate that reduces the occurrence of dents on the surface of the laminate by reducing the amount of chips generated when cutting the coated fabric.
(問題点を解決するための手段)
本発明は、長尺の塗工布を所定の長さに切断機で切断し
た後、塗工布の切断面を一枚毎あるいは複数枚毎に赤外
線、熱風又は211!板を用いて、塗工布の切断面が熱
硬化性樹脂の融点以上かつ硬化温度板下の範囲になるよ
う加熱するものである。(Means for Solving the Problems) The present invention cuts a long coated cloth into a predetermined length using a cutting machine, and then cuts the cut surface of the coated cloth one by one or every plurality of sheets using infrared rays. Hot air or 211! Using a plate, the cut surface of the coated cloth is heated to a temperature above the melting point of the thermosetting resin and below the curing temperature plate.
塗工布切断面の全体を加熱することにより切断面に発生
した切粉が融点に達し、この切粉を塗工布に融着させる
ことが可能になる。By heating the entire cut surface of the coated fabric, the chips generated on the cut surface reach their melting point, making it possible to fuse the chips to the coated fabric.
熱硬化性樹脂として、フェノール樹脂、エポキシ樹脂、
ポリエステル樹脂、ポリイミド樹脂等一般の積層板用樹
脂が使用し得る。As thermosetting resins, phenolic resins, epoxy resins,
General resins for laminates such as polyester resin and polyimide resin can be used.
実施例
エポキシ樹脂積層板の製造において、長尺の塗工布を切
断し塗工布切断面を遠赤外線を用い樹脂が軟化状態にな
る温度まで加熱した後、この塗工布を8枚積層しさらに
両面に銅箔を加え加熱成形してエポキシ樹脂積層板(1
m角)を240枚製造した。この時の打痕発生率は1.
25%であった。Example In manufacturing an epoxy resin laminate, a long coated fabric was cut, the cut surface of the coated fabric was heated using far infrared rays to a temperature at which the resin softened, and then eight sheets of this coated fabric were laminated. Furthermore, copper foil is added to both sides and heated to form an epoxy resin laminate (1
240 pieces (m square) were manufactured. The incidence of dents at this time was 1.
It was 25%.
比較例
切断直前の塗工布切断面を加熱せずして得た切断後の塗
工布を用い、実施例と同様の構成で加熱成形しエポキシ
樹脂積層板を240枚製造した。COMPARATIVE EXAMPLE Using a cut coated fabric obtained without heating the cut surface of the coated fabric immediately before cutting, 240 epoxy resin laminates were manufactured by thermoforming with the same configuration as in the example.
この時の打痕発生率は7.50%であった。The occurrence rate of dents at this time was 7.50%.
(発明の効果) 本発明では打痕発生率を大巾に減らすことが出来る。(Effect of the invention) The present invention can greatly reduce the incidence of dents.
加熱方法も従来の設備に多少の改造を加えるだけで済み
、本発明による積層板の製造方法は産業上極めて価値の
高いものである。The heating method also requires only slight modifications to conventional equipment, and the method for producing a laminate according to the present invention is of extremely high value industrially.
−〇/−〇/
Claims (1)
を所定の長さに切断し、この切断塗工布の必要枚数を重
ね合せ加熱加圧する積層板の製造法に於て、長尺の塗工
布を切断後、塗工布の切断面を熱硬化性樹脂の軟化点以
上で硬化温度以下の温度に加熱することを特徴とする積
層板の製造法。1. In the method of manufacturing a laminate board, a long base material is impregnated with a thermosetting resin and dried, the coated cloth is cut into predetermined lengths, and the required number of cut coated cloths are laminated and heated and pressed. A method for manufacturing a laminate, comprising: cutting a long coated fabric, and then heating the cut surface of the coated fabric to a temperature above the softening point of the thermosetting resin and below the curing temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61305956A JPS63158216A (en) | 1986-12-22 | 1986-12-22 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61305956A JPS63158216A (en) | 1986-12-22 | 1986-12-22 | Manufacture of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63158216A true JPS63158216A (en) | 1988-07-01 |
Family
ID=17951316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61305956A Pending JPS63158216A (en) | 1986-12-22 | 1986-12-22 | Manufacture of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63158216A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6451926A (en) * | 1987-08-22 | 1989-02-28 | Matsushita Electric Works Ltd | Prepreg |
JPH04339611A (en) * | 1990-12-26 | 1992-11-26 | Shin Kobe Electric Mach Co Ltd | Manufacture of metallic foil-stuck laminate |
US5368674A (en) * | 1989-09-07 | 1994-11-29 | Mitsubishi Gas Chemical Company, Inc. | Method of treating glass fiber-based prepreg |
US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
JP2014512539A (en) * | 2011-04-19 | 2014-05-22 | オウェンス コーニング インテレクチュアル キャピタル リミテッド ライアビリティ カンパニー | Online determination method for the curing state of glass fiber products |
-
1986
- 1986-12-22 JP JP61305956A patent/JPS63158216A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6451926A (en) * | 1987-08-22 | 1989-02-28 | Matsushita Electric Works Ltd | Prepreg |
JPH0584721B2 (en) * | 1987-08-22 | 1993-12-03 | Matsushita Electric Works Ltd | |
US5368674A (en) * | 1989-09-07 | 1994-11-29 | Mitsubishi Gas Chemical Company, Inc. | Method of treating glass fiber-based prepreg |
JPH04339611A (en) * | 1990-12-26 | 1992-11-26 | Shin Kobe Electric Mach Co Ltd | Manufacture of metallic foil-stuck laminate |
US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
JP2014512539A (en) * | 2011-04-19 | 2014-05-22 | オウェンス コーニング インテレクチュアル キャピタル リミテッド ライアビリティ カンパニー | Online determination method for the curing state of glass fiber products |
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