JPS63158216A - Manufacture of laminated sheet - Google Patents

Manufacture of laminated sheet

Info

Publication number
JPS63158216A
JPS63158216A JP61305956A JP30595686A JPS63158216A JP S63158216 A JPS63158216 A JP S63158216A JP 61305956 A JP61305956 A JP 61305956A JP 30595686 A JP30595686 A JP 30595686A JP S63158216 A JPS63158216 A JP S63158216A
Authority
JP
Japan
Prior art keywords
resin
coated cloth
cut surface
temperature
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61305956A
Other languages
Japanese (ja)
Inventor
Masae Yamakawa
山川 正栄
Hiroshi Suzuki
博 鈴木
Kiyoshi Kikuchi
清 菊地
Hajime Yoshida
肇 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP61305956A priority Critical patent/JPS63158216A/en
Publication of JPS63158216A publication Critical patent/JPS63158216A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To make it possible to reduce the incidence of beat mark by a method wherein the cut surface of a coated cloth is heated up to a temperature, which is higher than the softening point of thermosetting resin and lower than its setting temperature, after the cutting of the coated cloth in continuous form. CONSTITUTION:A coated cloth in continuous form is cut in lengths with a cutter. After that, the cut surface of each sheet or a plurality of sheets of the coated cloth is heated up to a temperature, which is higher than the melting point of thermosetting resin and lower than its setting temperature, by means of hot air or a hot plate. By heating the whole cut surface of the coated cloth, the temperature of chips produced on the cut surface reaches the melting point of the resin, resulting an allowing the chips to fuse to the coated cloth. Consequently, the chips are prevented from flying in air and adhering to the surface of the constitutional material of a laminated sheet. As the thermosetting resin, general-purpose resin for laminated sheet such as phenolic resin, epoxy resin, polyester resin, polyimide resin or the like can be used.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は積層板の製造法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a laminate.

(従来の技術) 従来、印刷回路板用等の積層板は熱硬化性樹脂フェスを
クラフト紙、リンター紙、ガラス織布、ガラス不織布等
の長尺の基材に含浸乾燥させることにより塗工布を得、
この塗工布を切断機により所定の大きさに切断し、これ
を必要枚数積層し、用途に応し銅箔を片面又は両面に加
え、加軌加■成形されて製造されている。
(Prior art) Conventionally, laminates for printed circuit boards, etc. have been made by impregnating and drying a long base material such as kraft paper, linter paper, glass woven fabric, glass non-woven fabric, etc. with a thermosetting resin face. obtained,
This coated fabric is cut into a predetermined size using a cutting machine, the required number of sheets are laminated, copper foil is added to one or both sides depending on the purpose, and the fabric is machined and formed.

(発明が解決しようとする問題点) 塗工布の切断面には、塗工布切断時に発生した切粉が残
ったままになっており、この切粉が空中に飛散し積層板
構成材料の表面に付着し、成形された後に積層板表面(
主に銅箔面上)に打痕(微細な凹凸乃至傷)となること
がある。
(Problem to be solved by the invention) Chips generated when cutting the coated fabric remain on the cut surface of the coated fabric, and these chips scatter in the air and damage the laminate constituent materials. After adhering to the surface and forming, the laminate surface (
This may result in dents (fine irregularities or scratches) mainly on the copper foil surface.

最近、の印刷回路配線板の高密度化により、回路導体の
細線化が進んでいるが、積層板の打痕(主に銅箔面上の
打痕)は回路の断線、ショートの原因となり印刷回路配
線板加工上の大きな問題となっている。
Recently, circuit conductors have become thinner due to the increased density of printed circuit wiring boards, but dents in laminates (mainly dents on the copper foil surface) can cause disconnections and short circuits in printed circuits. This has become a major problem in processing circuit wiring boards.

本発明は、塗工布の切断時に発生する切粉を減少させる
ことにより積層板表面の打痕発生の少ない積層板の製造
法を堤供するものである。
The present invention provides a method for manufacturing a laminate that reduces the occurrence of dents on the surface of the laminate by reducing the amount of chips generated when cutting the coated fabric.

(問題点を解決するための手段) 本発明は、長尺の塗工布を所定の長さに切断機で切断し
た後、塗工布の切断面を一枚毎あるいは複数枚毎に赤外
線、熱風又は211!板を用いて、塗工布の切断面が熱
硬化性樹脂の融点以上かつ硬化温度板下の範囲になるよ
う加熱するものである。
(Means for Solving the Problems) The present invention cuts a long coated cloth into a predetermined length using a cutting machine, and then cuts the cut surface of the coated cloth one by one or every plurality of sheets using infrared rays. Hot air or 211! Using a plate, the cut surface of the coated cloth is heated to a temperature above the melting point of the thermosetting resin and below the curing temperature plate.

塗工布切断面の全体を加熱することにより切断面に発生
した切粉が融点に達し、この切粉を塗工布に融着させる
ことが可能になる。
By heating the entire cut surface of the coated fabric, the chips generated on the cut surface reach their melting point, making it possible to fuse the chips to the coated fabric.

熱硬化性樹脂として、フェノール樹脂、エポキシ樹脂、
ポリエステル樹脂、ポリイミド樹脂等一般の積層板用樹
脂が使用し得る。
As thermosetting resins, phenolic resins, epoxy resins,
General resins for laminates such as polyester resin and polyimide resin can be used.

実施例 エポキシ樹脂積層板の製造において、長尺の塗工布を切
断し塗工布切断面を遠赤外線を用い樹脂が軟化状態にな
る温度まで加熱した後、この塗工布を8枚積層しさらに
両面に銅箔を加え加熱成形してエポキシ樹脂積層板(1
m角)を240枚製造した。この時の打痕発生率は1.
25%であった。
Example In manufacturing an epoxy resin laminate, a long coated fabric was cut, the cut surface of the coated fabric was heated using far infrared rays to a temperature at which the resin softened, and then eight sheets of this coated fabric were laminated. Furthermore, copper foil is added to both sides and heated to form an epoxy resin laminate (1
240 pieces (m square) were manufactured. The incidence of dents at this time was 1.
It was 25%.

比較例 切断直前の塗工布切断面を加熱せずして得た切断後の塗
工布を用い、実施例と同様の構成で加熱成形しエポキシ
樹脂積層板を240枚製造した。
COMPARATIVE EXAMPLE Using a cut coated fabric obtained without heating the cut surface of the coated fabric immediately before cutting, 240 epoxy resin laminates were manufactured by thermoforming with the same configuration as in the example.

この時の打痕発生率は7.50%であった。The occurrence rate of dents at this time was 7.50%.

(発明の効果) 本発明では打痕発生率を大巾に減らすことが出来る。(Effect of the invention) The present invention can greatly reduce the incidence of dents.

加熱方法も従来の設備に多少の改造を加えるだけで済み
、本発明による積層板の製造方法は産業上極めて価値の
高いものである。
The heating method also requires only slight modifications to conventional equipment, and the method for producing a laminate according to the present invention is of extremely high value industrially.

−〇/−〇/

Claims (1)

【特許請求の範囲】[Claims] 1、長尺の基材に熱硬化性樹脂を含浸し乾燥した塗工布
を所定の長さに切断し、この切断塗工布の必要枚数を重
ね合せ加熱加圧する積層板の製造法に於て、長尺の塗工
布を切断後、塗工布の切断面を熱硬化性樹脂の軟化点以
上で硬化温度以下の温度に加熱することを特徴とする積
層板の製造法。
1. In the method of manufacturing a laminate board, a long base material is impregnated with a thermosetting resin and dried, the coated cloth is cut into predetermined lengths, and the required number of cut coated cloths are laminated and heated and pressed. A method for manufacturing a laminate, comprising: cutting a long coated fabric, and then heating the cut surface of the coated fabric to a temperature above the softening point of the thermosetting resin and below the curing temperature.
JP61305956A 1986-12-22 1986-12-22 Manufacture of laminated sheet Pending JPS63158216A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61305956A JPS63158216A (en) 1986-12-22 1986-12-22 Manufacture of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61305956A JPS63158216A (en) 1986-12-22 1986-12-22 Manufacture of laminated sheet

Publications (1)

Publication Number Publication Date
JPS63158216A true JPS63158216A (en) 1988-07-01

Family

ID=17951316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61305956A Pending JPS63158216A (en) 1986-12-22 1986-12-22 Manufacture of laminated sheet

Country Status (1)

Country Link
JP (1) JPS63158216A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451926A (en) * 1987-08-22 1989-02-28 Matsushita Electric Works Ltd Prepreg
JPH04339611A (en) * 1990-12-26 1992-11-26 Shin Kobe Electric Mach Co Ltd Manufacture of metallic foil-stuck laminate
US5368674A (en) * 1989-09-07 1994-11-29 Mitsubishi Gas Chemical Company, Inc. Method of treating glass fiber-based prepreg
US5435877A (en) * 1992-05-07 1995-07-25 Mitsubishi Gas Chemical Company, Inc. Process for the production of copper-clad laminate
JP2014512539A (en) * 2011-04-19 2014-05-22 オウェンス コーニング インテレクチュアル キャピタル リミテッド ライアビリティ カンパニー Online determination method for the curing state of glass fiber products

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451926A (en) * 1987-08-22 1989-02-28 Matsushita Electric Works Ltd Prepreg
JPH0584721B2 (en) * 1987-08-22 1993-12-03 Matsushita Electric Works Ltd
US5368674A (en) * 1989-09-07 1994-11-29 Mitsubishi Gas Chemical Company, Inc. Method of treating glass fiber-based prepreg
JPH04339611A (en) * 1990-12-26 1992-11-26 Shin Kobe Electric Mach Co Ltd Manufacture of metallic foil-stuck laminate
US5435877A (en) * 1992-05-07 1995-07-25 Mitsubishi Gas Chemical Company, Inc. Process for the production of copper-clad laminate
JP2014512539A (en) * 2011-04-19 2014-05-22 オウェンス コーニング インテレクチュアル キャピタル リミテッド ライアビリティ カンパニー Online determination method for the curing state of glass fiber products

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