JPS63157969U - - Google Patents
Info
- Publication number
- JPS63157969U JPS63157969U JP4920287U JP4920287U JPS63157969U JP S63157969 U JPS63157969 U JP S63157969U JP 4920287 U JP4920287 U JP 4920287U JP 4920287 U JP4920287 U JP 4920287U JP S63157969 U JPS63157969 U JP S63157969U
- Authority
- JP
- Japan
- Prior art keywords
- end surface
- laser
- semiconductor substrate
- bonded
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 4
- 238000012544 monitoring process Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4920287U JPS63157969U (bg) | 1987-04-01 | 1987-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4920287U JPS63157969U (bg) | 1987-04-01 | 1987-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157969U true JPS63157969U (bg) | 1988-10-17 |
Family
ID=30871435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4920287U Pending JPS63157969U (bg) | 1987-04-01 | 1987-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157969U (bg) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022181542A1 (ja) * | 2021-02-26 | 2022-09-01 | 京セラ株式会社 | 半導体デバイスの製造方法、半導体デバイスおよび半導体装置 |
| WO2023153476A1 (ja) * | 2022-02-10 | 2023-08-17 | 京セラ株式会社 | 発光デバイスの製造方法および製造装置並びにレーザ素子基板 |
-
1987
- 1987-04-01 JP JP4920287U patent/JPS63157969U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022181542A1 (ja) * | 2021-02-26 | 2022-09-01 | 京セラ株式会社 | 半導体デバイスの製造方法、半導体デバイスおよび半導体装置 |
| WO2023153476A1 (ja) * | 2022-02-10 | 2023-08-17 | 京セラ株式会社 | 発光デバイスの製造方法および製造装置並びにレーザ素子基板 |