JPS63157481U - - Google Patents
Info
- Publication number
- JPS63157481U JPS63157481U JP4916087U JP4916087U JPS63157481U JP S63157481 U JPS63157481 U JP S63157481U JP 4916087 U JP4916087 U JP 4916087U JP 4916087 U JP4916087 U JP 4916087U JP S63157481 U JPS63157481 U JP S63157481U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- tip
- stirring rod
- protrusion
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4916087U JPS63157481U (ko) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4916087U JPS63157481U (ko) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157481U true JPS63157481U (ko) | 1988-10-14 |
Family
ID=30871353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4916087U Pending JPS63157481U (ko) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157481U (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011210953A (ja) * | 2010-03-30 | 2011-10-20 | Fujitsu Ltd | フラックスピン，フラックス転写装置及びフラックス転写方法 |
| JP2012074565A (ja) * | 2010-09-29 | 2012-04-12 | Diamond Electric Mfg Co Ltd | 超音波接合ツール及び超音波接合装置及び接合材パターン成形方法 |
-
1987
- 1987-03-31 JP JP4916087U patent/JPS63157481U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011210953A (ja) * | 2010-03-30 | 2011-10-20 | Fujitsu Ltd | フラックスピン，フラックス転写装置及びフラックス転写方法 |
| JP2012074565A (ja) * | 2010-09-29 | 2012-04-12 | Diamond Electric Mfg Co Ltd | 超音波接合ツール及び超音波接合装置及び接合材パターン成形方法 |