JPS6315707A - Thermoset resin molding device having molding tool with built-in high-frequency inductor - Google Patents
Thermoset resin molding device having molding tool with built-in high-frequency inductorInfo
- Publication number
- JPS6315707A JPS6315707A JP16039586A JP16039586A JPS6315707A JP S6315707 A JPS6315707 A JP S6315707A JP 16039586 A JP16039586 A JP 16039586A JP 16039586 A JP16039586 A JP 16039586A JP S6315707 A JPS6315707 A JP S6315707A
- Authority
- JP
- Japan
- Prior art keywords
- inductor
- thermosetting resin
- high frequency
- resin
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims description 9
- 239000004634 thermosetting polymer Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000000498 cooling water Substances 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 2
- 239000012774 insulation material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は熱硬化性樹脂の成形において、樹脂の硬化反
応を効率良く、又著しく短縮する爲の装置に関する・
従来エポキシ樹脂やポリエステル樹脂等の熱硬化性樹脂
は絶縁等の成形材として広く使用されているが、硬化時
間が長い霜、作業性が悪い欠点がある。これは硬化時、
熱風やシーズヒターの加熱を使用する爲に、被加熱物全
体技r、ij硬化炉内全域を加熱しなければ々らず、熱
効率が悪く長時間の加熱を要する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for efficiently and significantly shortening the curing reaction of a thermosetting resin in the molding of a thermosetting resin. Conventionally, thermosetting resins such as epoxy resins and polyester resins have been It is widely used as a molding material, but it has the disadvantages of long curing time and poor workability. When this hardens,
When heating with hot air or a sheath heater, it is necessary to heat the entire area inside the curing furnace, which results in poor thermal efficiency and requires long heating times.
この発明は高周波誘導加熱を利用することで導電体の表
面が急速に発熱され、導電体に接する樹脂を直接加熱す
ることにより、効率良く、極めて短時間に加熱硬化がで
きる。This invention utilizes high-frequency induction heating to rapidly generate heat on the surface of the conductor, and by directly heating the resin in contact with the conductor, heat curing can be performed efficiently and in an extremely short time.
この発明をステッピングモーターの回転子外面成形に応
用した例を図面に基すいて説明すわば次の通りである。An example in which the present invention is applied to molding the outer surface of a rotor of a stepping motor will be described below with reference to the drawings.
第1図は導電体でできている回転子1とそれに外面成形
された熱硬化性樹脂2の製品断面図である。第2図にお
いて、セラミック又は、フッ素樹脂等の絶縁材で作られ
た下型3に銅バイプのコイルで作られた誘導子4が内臓
されている。その下型3には液状の熱硬化性樹脂を注入
する爲の注入口5が形成されている。FIG. 1 is a product sectional view of a rotor 1 made of a conductor and a thermosetting resin 2 molded on the outer surface thereof. In FIG. 2, an inductor 4 made of a copper pipe coil is housed in a lower mold 3 made of an insulating material such as ceramic or fluororesin. The lower mold 3 has an injection port 5 for injecting liquid thermosetting resin.
同様に、絶縁材で作られた上型6には空気抜き穴7が形
成されている。Similarly, an air vent hole 7 is formed in the upper die 6 made of an insulating material.
」−型(1全開き、硬化物の離形を良くする場合は離形
剤を塗布し、回転子lを挿入し、上型6を閉じる。樹脂
吐出ポンプ8によって注入口5より液状の熱硬化性樹脂
を加部注入する。誘導子4に高周波発生装置9から10
K H2以上の高周波電流を印加すると回転子10表
面に渦電流が誘起され急激に発熱し、液状の熱硬化性樹
脂2が硬化される・この時、誘導子4の銅パイプ内径に
は冷却水を流し誘導子4を冷却する1、次に被IJn熱
物に4重体がない場合、もしくはあっても発熱利用がで
きにくい場合の硬化方法を第4図以下で説明する。” - Mold (1 fully opened; if you want to improve the mold release of the cured product, apply a mold release agent, insert the rotor l, and close the upper mold 6. Liquid heat is poured from the injection port 5 by the resin discharge pump 8. Inject hardening resin into the inductor 4. High frequency generators 9 to 10 are injected into the inductor 4.
When a high frequency current of KH2 or more is applied, eddy currents are induced on the surface of the rotor 10, which rapidly generates heat, and the liquid thermosetting resin 2 is hardened. At this time, cooling water is applied to the inner diameter of the copper pipe of the inductor 4. 1, in which the inductor 4 is cooled by cooling the inductor 4. Next, a curing method will be described below with reference to FIG.
第4図は熱硬化性樹脂で作られた硬化後の製品の側断面
図ケ示す。FIG. 4 shows a side cross-sectional view of a cured product made of thermosetting resin.
第5図において、絶縁材で作られた下型12に誘導子1
3が内臓されていて、更に樹脂硬化部には導電体で作ら
れた板14が取り付けられている。又、注入口15が形
成さtlている。In FIG. 5, an inductor 1 is placed in a lower mold 12 made of an insulating material.
3 is built-in, and a plate 14 made of a conductor is attached to the resin hardening section. Also, an injection port 15 is formed.
同様に、絶縁材で作られた上型■6には誘導子■8及び
導電体の板19及び空気抜き穴17がそれぞれ取り付け
られている。Similarly, an inductor (8), a conductor plate (19), and an air vent hole (17) are attached to the upper mold (6) made of an insulating material.
作用は前述した回転子への応用例に準じ、上型及び下型
をセッ゛トシ、注入口15から液状の、熱硬化性樹脂を
加部注入する。The operation is similar to the above-mentioned example of application to a rotor, in which the upper mold and the lower mold are set, and a portion of liquid thermosetting resin is injected from the injection port 15.
その後、誘導子13及び18に高周波電流を印加すると
導電体の板14及び19が発熱し。Thereafter, when a high frequency current is applied to the inductors 13 and 18, the conductive plates 14 and 19 generate heat.
熱硬化性樹脂が加熱硬化する。その時、誘導子13及び
18の銅パイプ内部に冷却水を流し誘導子を冷却する。The thermosetting resin is cured by heating. At that time, cooling water is flowed inside the copper pipes of the inductors 13 and 18 to cool the inductors.
この発明は以上説明したように熱硬化性樹脂の成形にお
いて、成形内に誘導子を内臓し高周波室カケ与えること
によって、効率良く又、極めて短時間で硬化成型する効
果がある。As explained above, in molding a thermosetting resin, the present invention has the effect of efficiently hardening and molding in an extremely short time by incorporating an inductor into the mold and providing a high-frequency chamber break.
図はこの発明の応用例を示すもので、第1図は第1応用
例の製品側断面図、第2図及び第3図は第1応用例の一
部断面側面図と平面断面図である。第4図は第2応用例
の製品側断面図である。第5図、第6図、第7因は第2
応用例のそれぞれ側断面図、上平面断面図、・上平面断
面図である。
1 回転子 ll 熱硬化性樹脂製品2
熱硬化性樹脂 12 下型
;3 下型 13 誘導子4 誘導子
14 導電体の板5 注入口
15 注入口6 ト型 16 上型
7 空気抜き穴 17 空気抜き穴8 吐出ポ
ンプ 18 誘導子9 高周波発振装置 1
9 導電体の板特許出顧大 小林睦己The figures show application examples of the present invention. Fig. 1 is a side sectional view of the product of the first application example, and Figs. 2 and 3 are a partially sectional side view and a plan sectional view of the first application example. . FIG. 4 is a side sectional view of the product of the second application example. Figure 5, Figure 6, the seventh cause is the second
They are a side sectional view, a top sectional view, and a top sectional view of an application example, respectively. 1 Rotor ll Thermosetting resin product 2
Thermosetting resin 12 Lower mold; 3 Lower mold 13 Inductor 4 Inductor
14 Conductor plate 5 Inlet
15 Inlet 6 G type 16 Upper mold 7 Air vent hole 17 Air vent hole 8 Discharge pump 18 Inductor 9 High frequency oscillator 1
9 Conductor plate patent sponsor Mutsumi Kobayashi
Claims (1)
において、 絶縁材で作られた成形型に、高周波加熱用コイル(誘導
子)が内臓されていて、その誘導子に、高周波電力を与
えることによって、導電体が発熱し、樹脂を硬化させる
ことを特徴とする熱硬化性樹脂成形装置。 2 絶縁材で作られた成形型に高周波加熱用コイル(誘
導子)が内臓されていて、更に成形型内の樹脂硬化部に
導電体の板が装着されており、誘導子に高周波電力を与
えることによって、導電体の板が発熱して樹脂を硬化さ
せることを特徴とする熱硬化性樹脂成形装置。[Claims] 1. In molding the outer surface of a conductor such as a metal with a thermosetting resin, a high-frequency heating coil (inductor) is built into the mold made of an insulating material, and the induction A thermosetting resin molding device characterized in that a conductor generates heat and hardens the resin by applying high frequency power to the conductor. 2 A high-frequency heating coil (inductor) is built into a mold made of insulating material, and a conductive plate is attached to the hardened resin part of the mold to apply high-frequency power to the inductor. A thermosetting resin molding apparatus characterized in that a conductive plate generates heat to harden the resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16039586A JPS6315707A (en) | 1986-07-08 | 1986-07-08 | Thermoset resin molding device having molding tool with built-in high-frequency inductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16039586A JPS6315707A (en) | 1986-07-08 | 1986-07-08 | Thermoset resin molding device having molding tool with built-in high-frequency inductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6315707A true JPS6315707A (en) | 1988-01-22 |
Family
ID=15714024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16039586A Pending JPS6315707A (en) | 1986-07-08 | 1986-07-08 | Thermoset resin molding device having molding tool with built-in high-frequency inductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6315707A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5266259A (en) * | 1991-09-17 | 1993-11-30 | Ford Motor Company | Molding a reinforced plastics component |
US6203731B1 (en) | 1997-10-17 | 2001-03-20 | Tohoku Munekata Company Limited | Method for injection molding of plastic products having excellent transcription properties |
JP2009000863A (en) * | 2007-06-20 | 2009-01-08 | Hitachi Industrial Equipment Systems Co Ltd | Molding mold and its controlling method |
WO2010099450A2 (en) * | 2009-02-26 | 2010-09-02 | Floodcooling Technologies, Llc | Mold insert for improved heat transfer |
US8079509B2 (en) | 2008-02-26 | 2011-12-20 | Floodcooling Technologies, Llc | Brazed aluminum laminate mold tooling |
KR101865327B1 (en) * | 2018-03-14 | 2018-06-07 | 정옥희 | High-frequency induction heating equipment for dissimilar metals connection |
-
1986
- 1986-07-08 JP JP16039586A patent/JPS6315707A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5266259A (en) * | 1991-09-17 | 1993-11-30 | Ford Motor Company | Molding a reinforced plastics component |
US6203731B1 (en) | 1997-10-17 | 2001-03-20 | Tohoku Munekata Company Limited | Method for injection molding of plastic products having excellent transcription properties |
JP2009000863A (en) * | 2007-06-20 | 2009-01-08 | Hitachi Industrial Equipment Systems Co Ltd | Molding mold and its controlling method |
US8079509B2 (en) | 2008-02-26 | 2011-12-20 | Floodcooling Technologies, Llc | Brazed aluminum laminate mold tooling |
WO2010099450A2 (en) * | 2009-02-26 | 2010-09-02 | Floodcooling Technologies, Llc | Mold insert for improved heat transfer |
WO2010099450A3 (en) * | 2009-02-26 | 2011-01-13 | Floodcooling Technologies, Llc | Mold insert for improved heat transfer |
US9701075B2 (en) | 2009-02-26 | 2017-07-11 | Floodcooling Technologies, Llc | Mold insert for improved heat transfer |
US10155350B2 (en) | 2009-02-26 | 2018-12-18 | Zen Project Llc | Mold insert for improved heat transfer |
KR101865327B1 (en) * | 2018-03-14 | 2018-06-07 | 정옥희 | High-frequency induction heating equipment for dissimilar metals connection |
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