JPS63156905U - - Google Patents
Info
- Publication number
- JPS63156905U JPS63156905U JP4987087U JP4987087U JPS63156905U JP S63156905 U JPS63156905 U JP S63156905U JP 4987087 U JP4987087 U JP 4987087U JP 4987087 U JP4987087 U JP 4987087U JP S63156905 U JPS63156905 U JP S63156905U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- tape
- embossed carrier
- carrier tape
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Package Closures (AREA)
Description
第１図はこの考案に係る加圧ローラの一例を示
す説明図、第２図は第１図に示す加圧ローラによ
る粘着テープの接着状態を示す説明図、第３図、
第４図はそれぞれこの考案に係る他の構成の加圧
ローラによる接着テープの接着状態を示す説明図
、第５図はこの考案に係る他の構造の加圧ローラ
の一例を示す説明図、第６図は従来のこの種のテ
ーピング装置の一例を示す説明図、第７図ａ，ｂ
は第６図に示すテーピング装置による接着テープ
の接着状態を示す説明図である。
１…キヤリアテープ供給ローラ、２…エンボス
キヤリアテープ、３…半導体素子挿入ヘツド、４
…半導体素子自動供給部、５…粘着テープ供給ロ
ーラ、６…粘着テープ、６ａ，６ｂ，６ｃ，６ｄ
…接着部分、７，１７ａ，１７ｂ，２７ａ…加圧
ローラ、８…キヤリアテープ巻取りローラ、１１
…半導体素子、なお各図中同一符号は同一または
相当する部分を示す。
FIG. 1 is an explanatory diagram showing an example of the pressure roller according to this invention, FIG. 2 is an explanatory diagram showing the state of adhesion of the adhesive tape by the pressure roller shown in FIG. 1, and FIG.
4 is an explanatory diagram showing the adhesion state of the adhesive tape by a pressure roller having another structure according to this invention, and FIG. 5 is an explanatory diagram showing an example of a pressure roller having another structure according to this invention. Figure 6 is an explanatory diagram showing an example of a conventional taping device of this type, and Figures 7a and b
FIG. 7 is an explanatory diagram showing the state of adhesion of the adhesive tape by the taping device shown in FIG. 6; DESCRIPTION OF SYMBOLS 1...Carrier tape supply roller, 2...Embossed carrier tape, 3...Semiconductor element insertion head, 4
...Semiconductor element automatic supply unit, 5...Adhesive tape supply roller, 6...Adhesive tape, 6a, 6b, 6c, 6d
... Adhesive portion, 7, 17a, 17b, 27a... Pressure roller, 8... Carrier tape winding roller, 11
...Semiconductor element, and the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
窪みに半導体素子を挿入し、該エンボスキヤリア
テープの表面に粘着テープを接着して上記窪みに
蓋をし、エンボスキヤリアテープに半導体素子を
収納、固定する半導体素子のテーピング装置にお
いて、粘着テープの両側辺部をエンボスキヤリア
テープに圧着する加圧ローラの粘着テープに圧接
する接触面を接着面が幅の狭い帯状となる形状に
するとともに、該接触面が粘着テープに圧接して
いる時間と粘着テープから遊離している時間を任
意に調節できる構成としたことを特徴とする半導
体素子のテーピング装置。 Semiconductor elements are inserted into each depression of the embossed carrier tape sent out by a roller, adhesive tape is adhered to the surface of the embossed carrier tape to cover the depressions, and the semiconductor element is housed and fixed in the embossed carrier tape. In this taping device, the contact surface of the pressure roller that presses the adhesive tape on both sides of the adhesive tape to the embossed carrier tape is shaped so that the adhesive surface is in the shape of a narrow band, and the contact surface is shaped like a narrow strip. 1. A semiconductor device taping device characterized by a structure in which the time during which the adhesive tape is in pressure contact with the adhesive tape and the time during which it is released from the adhesive tape can be arbitrarily adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4987087U JPH0411924Y2 (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4987087U JPH0411924Y2 (en) | 1987-04-03 | 1987-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63156905U true JPS63156905U (en) | 1988-10-14 |
| JPH0411924Y2 JPH0411924Y2 (en) | 1992-03-24 |
Family
ID=30872723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4987087U Expired JPH0411924Y2 (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0411924Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01279015A (en) * | 1988-04-26 | 1989-11-09 | Sanken Electric Co Ltd | Production of pack in a row |
| JP2009102025A (en) * | 2007-10-22 | 2009-05-14 | Hirose Electric Co Ltd | Electronic component packaging body |
-
1987
- 1987-04-03 JP JP4987087U patent/JPH0411924Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01279015A (en) * | 1988-04-26 | 1989-11-09 | Sanken Electric Co Ltd | Production of pack in a row |
| JP2009102025A (en) * | 2007-10-22 | 2009-05-14 | Hirose Electric Co Ltd | Electronic component packaging body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0411924Y2 (en) | 1992-03-24 |
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