JPS63154551A - Plate-shaped member feeding device - Google Patents

Abstract

PURPOSE:To prevent a plate-shaped member from being damaged and permit the certain transport by installing a fork at an upper part position so that the plate-shaped member is received before the drop from a terminal curved surface of a conveyor and separating the fork from the conveyor by raising the fork, when the center of gravity shifts. CONSTITUTION:When a substrate 2 in the most front row which is sent on a conveyor 1 reaches a terminal edge, said substrate 2 is transferred onto a fork 3 in waiting at the upper position before the start of drop from a curved surface, and the rear edge is pushed and transferred onto the upper surface of the fork 3 by the friction generated between the conveyor 1. When the center of gravity of the substrate 2 shifts onto the fork 3, a sensor 16 detects the position, and the fork 3 is pushed up, having a pin 8 as center, by the extension of a raising cylinder 13, and the rear edge part of the substrate 2 is separated from the conveyor 1. Therefore, when the substrate 2 in the most front row is transferred onto the fork 3, tilt, collision, and superposition can be prevented, and the substrate 2 is prevented from being damaged, and certain transport is secured.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides a method for conveying a large number of plates in line on a conveyor.
The present invention relates to a feeding device for plate materials that transfers the material onto a fork at the end of the feeding.

(Prior art) For example, thick film IC substrates are dried and baked on the substrate and glint surfaces in a heating furnace. In this case, a large number of substrates are lined up on a heat-resistant conveyor, and this conveyor is The above-mentioned respective substrates are heat-treated by passing them through a heating furnace. At the end of the conveyor that has exited the heating furnace, the substrate is transferred onto a fork and unloaded.

Conventionally, the structure shown in FIGS. 4 and 5 has been adopted to transfer the substrate from the conveyor to the fork. That is, 1 is a conveyor made of heat-resistant metal mesh, etc., and runs in the direction indicated by the arrow. A large number of substrates 2 are placed on the conveyor 1 in a plurality of rows,
It is fed continuously or intermittently as the conveyor 1 runs.

A fork 3 is provided at the end of the conveyor 1, and when the board 2 reaches the end surface of the conveyor 1, the board 2 begins to fall under its own weight and waits at the bottom. Move onto Fork 3. The fork 3 moves backward, separates the substrate 2 from the conveyor 1, and transfers it to the next unillustrated delivery device.

(Problems to be Solved by the Invention) In such a heat treatment apparatus for thick film IC substrates, if the heating conditions of the substrates passing through the heating furnace are not constant, the quality of each substrate will vary. are arranged on the conveyor 1 with the pitch narrowed. In this way, the thermal conditions between the substrates arranged on the conveyor 1 are uniform, so quality is stabilized, and there are advantages such as energy efficiency and shortening of process time due to large-volume processing.

However, when the substrates 2, which have been aligned by reducing the pitch between the substrates 2, are transferred to the forks 3, the following problem occurs. In other words, in the conventional case,
The substrates 2 in the front row were placed on the bend 3 at the end of the conveyor 1. However, the surface of the mesh of the conveyor 1 is not uniform over the entire surface, and due to thermal deformation while passing through the heating furnace, the surface is rough, has minute irregularities, and has variations. .

Therefore, the timing at which each of the substrates 2 in the front row starts to descend under its own weight may vary, and moreover, the substrates 2 in the front row may tilt and slip within one stroke during the descent. Due to this descent, the pitch between adjacent boards 2... is small, so adjacent boards collide with each other, damaging the printed circuit on the board surface, and causing disadvantages such as two boards stacking up. There is.

Note that it is possible to transfer the board by sucking the top surface of the IC board with a vacuum chuck, but since the circuit pattern is printed on the top surface of the IC board, there is no risk of damaging the pattern if the vacuum chuck contacts it. Also, there is a risk that vacuum suction may become uncertain due to the unevenness of the gloss turn, causing the product to fall.

The present invention aims to provide a board material feeding device that can take out board materials, such as IC boards, from a container dredge without colliding with each other or overlapping each other. □ [Structure of the Invention] (Means for Solving the Problems) The present invention has the fork set at the upper part of the conveyor in order to receive the plate material before it starts to fall due to its own weight on the end curved plane of the conveyor. However, in this case, there is no falling inertia, so the edge of the plate remains in contact with the conveyor surface, and the edge may get caught on the conveyor, so the center of gravity of the plate is The present invention is characterized in that when the fork is moved to the fork, the fork is raised and the board is moved away from the conveyor.

(Function) According to the present invention, when the plate material in the front row is transferred to the fork, it is not tilted or overlapped, and it is possible to prevent damage and ensure reliable transfer.

(Example) The present invention will be described below based on an example shown in FIGS. 1 to 3.

In the figure, 1 is a conveyor similar to the conventional one, and 2 . . . are thick film IC substrates that are arranged and sent on the conveyor 1.

3... are forks arranged at the end of the conveyor 1, facing each of the aligned substrates 2....

The rear end of the fork 3 is rotatably attached to a bracket 9 via a pin 8, and this bracket 9 is fixed to a slide cylinder 10.

The slide cylinder 1θ is slidably attached to a guide rod 11, and when the slide cylinder 10 is operated, the slide cylinder 10 moves back and forth in the direction of arrow C against the guide rod 11. by fork 3
... is moved forward and backward.

An elevating cylinder 13 equipped with a roller 12 is installed below the front end of the fork 3..., and as the elevating cylinder 13 is extended, the fork 3... is moved upward around the bin 8. .

A stopper 14 is installed in the middle of the fork 3, and the board 2 placed on the fork 3 comes into contact with this stopper 14 as the fork 3 moves backward. When the fork 3 further retreats after this contact, the substrate 2 falls from the fork 3.

The fallen substrate 2 is placed on a delivery conveyor 15 provided below, and is sent out in a direction perpendicular to the plane of the paper.

A sensor 16 is provided above the front end of the fork 3 to detect that the board 2 is placed on the fork 3. This sensor 16 detects the position at which it is detected that the center of gravity of the board 2 has been shifted onto the fork 3. Upon detection by this sensor 16, the elevating cylinder 13 is operated to extend.

At the rear upper part of the slide cylinder 10, another sensor 17 is installed.
is provided, and this sensor 17 detects that the slide cylinder 10 has been retreated, and when this slide cylinder 10 passes, the elevating cylinder 13 is shortened.

Therefore, when the tip of the fork 3 approaches the surface facing the end of the conveyor 1, it is necessary to receive the substrate 2... before the substrate 2... on the conveyor 1 starts to fall due to its own weight. , located at a relatively upper position.

The operation of the embodiment with such a configuration will be explained.

Board 2 in the front row sent by conveyor 1...
When it reaches the end of the conveyor 1, it moves onto the waiting fork 3... Even if the front end of the board 2 rests on the tip of the fork 3, the rear end rests on the top surface of the conveyor 1, so the friction with the conveyor 1 causes the fork 3 to
is pushed to the top of the

When the center of gravity of the board 2 moves above the fork 3, the sensor 16 detects that position, and the lifting cylinder 13
expands. As a result, the fork 3 is pushed up centering on the bin 8 and rises.

Therefore, the rear end of the substrate 2 separates from the conveyor 1. That is, even if the center of gravity of the substrate 2 pushed onto the fork 3 by the conveyor 1 moves to the fork 3, the rear edge of the substrate 2 does not move away from the conveyor 1, so the rear edge of the substrate 2 and the conveyor 1 is in sliding contact, and when the conveyor 1 is in sliding contact with
Since the surface of the mesh is not smooth, there is a risk that the rear edge of the board 2 will be carried by the conveyor 1 and the board 2 will fall from the fork 3, causing damage to the rear end, but as soon as the center of gravity shifts, the fork 3 is raised to separate the rear edge of the substrate 2 from the conveyor 1, thereby preventing the above-mentioned problem.

When the fork 3 is raised, the slide cylinder 10 is moved backward to move the fork 3 backward.

When the slide cylinder 10 passes directly under the rear sensor 17, this sensor 17 causes the lifting cylinder 13 to contract. This causes the fork 3 to be lowered.

After this, the slide cylinder 10 further moves backward, causing the fork 3 to move backward. When the tip of the fork 3 passes through the stopper 14, the substrate 2 placed on the tip of the fork 3 hits the stopper 14. After this, the fork 3 moves back further, but the board 2
4 and is prevented from moving backward, the fork 3 will eventually be pulled out, and the board 2 will therefore fall. The dropped substrate 2 is placed on the delivery conveyor 15 and sent out. The stopper 14 is the second
As shown in the figure, the fork 3 has a pair of stop walls 14a and 14t located on both sides, and therefore the tip of the base plate 2 is connected to these stop walls 14a.

14a and is stopped. In this case, even if the substrate 2 is placed on the fork 3 in an inclined position as shown in FIG. will be moved to

According to the embodiment described above, when the substrate 2... is transferred from the conveyor 1 onto the fork 3, the substrate 2... is not allowed to fall due to its own weight, so the substrate 2... is not tilted. Adjacent substrates 2 do not overlap each other when they come into contact with each other. Therefore, problems such as damage to the patterns formed on the substrates 2 can be prevented, and the yield rate can be improved.

In addition, although the above embodiment has been described as being applied to a conveyor for heat treatment of thick film IC substrates, the present invention is not limited to this, and can be applied to conveyors in which a large number of plate materials are arranged on a conveyor at a small pitch. It is possible to implement.

[Effects of the Invention] As explained above, according to the present invention, when a plate is transferred from a conveyor onto a fork, the center of gravity of the plate is transferred to the fork, and then the fork is raised to transfer the rear edge of the plate onto the conveyor. This allows the board to be moved to the fork without significantly changing its posture.
Therefore, adjacent plates can be transferred without coming into contact with each other or overlapping each other.

[Brief explanation of the drawing]

1 to 3 show one embodiment of the present invention, in which FIG. 1 is an overall side view, FIG. 2 is a plan view of the stopper portion, and FIG.
The figure is a cross-sectional view taken along the line 1--1 in FIG. 2, and FIGS. 4 and 5 show the conventional structure, with FIG. 4 being a plan view and FIG. 5 being a side view. 1... Conveyor, 2... Board, 3... Fork,
10...Slide cylinder, 13...Elevating cylinder, 14...Stopper, 16.17...Sensor.

Claims (2)

[Claims] (1) In a sheet material feeding device that arranges sheet materials on a conveyor, sends them backward as the conveyor runs, and transfers the sheet materials onto forks waiting at the end of the conveyor, the conveyor Positioning the fork near the upper surface of the conveyor to receive the board before the board falls under its own weight, and
A plate material feeding device characterized in that a fork lifting device is provided for raising the fork to separate the edge of the plate from the conveyor after the center of gravity of the plate has shifted to the fork. (2) The board material feeding device according to claim 1, wherein the board material is a thick film IC substrate, and the conveyor is a conveyor that passes through a heating furnace that heats the board.