JPS63153889U - - Google Patents
Info
- Publication number
- JPS63153889U JPS63153889U JP4720687U JP4720687U JPS63153889U JP S63153889 U JPS63153889 U JP S63153889U JP 4720687 U JP4720687 U JP 4720687U JP 4720687 U JP4720687 U JP 4720687U JP S63153889 U JPS63153889 U JP S63153889U
- Authority
- JP
- Japan
- Prior art keywords
- roll
- support member
- convex surface
- roll support
- yoke
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Unwinding Webs (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4720687U JPS63153889U (th) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4720687U JPS63153889U (th) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153889U true JPS63153889U (th) | 1988-10-07 |
Family
ID=30867588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4720687U Pending JPS63153889U (th) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153889U (th) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9397063B2 (en) | 2010-07-27 | 2016-07-19 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
| US9496236B2 (en) | 2010-12-10 | 2016-11-15 | Tessera, Inc. | Interconnect structure |
| US12027487B2 (en) | 2022-12-22 | 2024-07-02 | Adeia Semiconductor Technologies Llc | Structures for low temperature bonding using nanoparticles |
-
1987
- 1987-03-30 JP JP4720687U patent/JPS63153889U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9397063B2 (en) | 2010-07-27 | 2016-07-19 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
| US9496236B2 (en) | 2010-12-10 | 2016-11-15 | Tessera, Inc. | Interconnect structure |
| US12027487B2 (en) | 2022-12-22 | 2024-07-02 | Adeia Semiconductor Technologies Llc | Structures for low temperature bonding using nanoparticles |
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