JPS63153574U - - Google Patents
Info
- Publication number
- JPS63153574U JPS63153574U JP4640287U JP4640287U JPS63153574U JP S63153574 U JPS63153574 U JP S63153574U JP 4640287 U JP4640287 U JP 4640287U JP 4640287 U JP4640287 U JP 4640287U JP S63153574 U JPS63153574 U JP S63153574U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- conductive pattern
- printed circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4640287U JPS63153574U (no) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4640287U JPS63153574U (no) | 1987-03-27 | 1987-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153574U true JPS63153574U (no) | 1988-10-07 |
Family
ID=30866032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4640287U Pending JPS63153574U (no) | 1987-03-27 | 1987-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153574U (no) |
-
1987
- 1987-03-27 JP JP4640287U patent/JPS63153574U/ja active Pending
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