JPS63153572U - - Google Patents
Info
- Publication number
- JPS63153572U JPS63153572U JP4528487U JP4528487U JPS63153572U JP S63153572 U JPS63153572 U JP S63153572U JP 4528487 U JP4528487 U JP 4528487U JP 4528487 U JP4528487 U JP 4528487U JP S63153572 U JPS63153572 U JP S63153572U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- component mounting
- solder resist
- diameter
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4528487U JPS63153572U (de) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4528487U JPS63153572U (de) | 1987-03-27 | 1987-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63153572U true JPS63153572U (de) | 1988-10-07 |
Family
ID=30863883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4528487U Pending JPS63153572U (de) | 1987-03-27 | 1987-03-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63153572U (de) |
-
1987
- 1987-03-27 JP JP4528487U patent/JPS63153572U/ja active Pending