JPH0385682U - - Google Patents
Info
- Publication number
- JPH0385682U JPH0385682U JP14726189U JP14726189U JPH0385682U JP H0385682 U JPH0385682 U JP H0385682U JP 14726189 U JP14726189 U JP 14726189U JP 14726189 U JP14726189 U JP 14726189U JP H0385682 U JPH0385682 U JP H0385682U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connection pad
- circuit board
- printed circuit
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726189U JPH0385682U (de) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726189U JPH0385682U (de) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385682U true JPH0385682U (de) | 1991-08-29 |
Family
ID=31693786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14726189U Pending JPH0385682U (de) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385682U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008196664A (ja) * | 2007-02-15 | 2008-08-28 | Obitsu Seisakusho:Kk | 弁構造およびその弁構造を適用した軟質膨張物 |
-
1989
- 1989-12-20 JP JP14726189U patent/JPH0385682U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008196664A (ja) * | 2007-02-15 | 2008-08-28 | Obitsu Seisakusho:Kk | 弁構造およびその弁構造を適用した軟質膨張物 |
| JP4526089B2 (ja) * | 2007-02-15 | 2010-08-18 | 株式会社オビツ製作所 | 弁構造およびその弁構造を適用した軟質膨張物 |