JPS63152260U - - Google Patents
Info
- Publication number
- JPS63152260U JPS63152260U JP16275686U JP16275686U JPS63152260U JP S63152260 U JPS63152260 U JP S63152260U JP 16275686 U JP16275686 U JP 16275686U JP 16275686 U JP16275686 U JP 16275686U JP S63152260 U JPS63152260 U JP S63152260U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- bendable
- bending
- bendable printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の屈曲可能なプリント基板の
実施例を示す斜視図、第２図は屈曲溝部を示す断
面図、第３図及び第４図はそれぞれ異なる屈曲溝
部を示す断面図、第５図は立体組立用の屈曲可能
なプリント基板の平面図、第６図は折り畳み用の
屈曲可能なプリント基板の別の実施例を示す斜視
図である。
１…屈曲可能なプリント基板、２…基板本体、
３…屈曲溝部。
FIG. 1 is a perspective view showing an embodiment of the bendable printed circuit board of this invention, FIG. 2 is a sectional view showing a bending groove, FIGS. 3 and 4 are sectional views showing different bending grooves, and FIG. This figure is a plan view of a bendable printed circuit board for three-dimensional assembly, and FIG. 6 is a perspective view showing another embodiment of a bendable printed circuit board for folding. 1... Flexible printed circuit board, 2... Board main body,
3...Bending groove.
補正 昭６３．４．２０
図面の簡単な説明を次のように補正する。
明細書中第１０頁第２行に「図である。」とあ
るを「図、第７図は従来のプリント基板の屈曲構
造を示す部分断面図である。」に訂正する。Amendment April 20, 1981 The brief description of the drawing is amended as follows. In the second line of page 10 of the specification, the phrase "It is a figure." is corrected to "The figure and FIG. 7 are partial cross-sectional views showing the bending structure of a conventional printed circuit board."
Claims (1)
基板本体と略同一面で一体に成形された薄肉状で
屈曲可能な可撓性を有する屈曲溝部とからなつて
、該屈曲溝部を屈曲線として隣接する基板本体を
折り曲げ自在とする屈曲可能なプリント基板。 (2) 屈曲可能なプリント基板が、屈曲溝部を屈
曲部として折り畳み自在に形成されていることを
特徴とする実用新案登録請求の範囲第１項記載の
屈曲可能なプリント基板。 (3) 屈曲可能なプリント基板が、屈曲溝部を屈
曲部として立体的に組立可能なことを特徴とする
実用新案登録請求の範囲第１項記載の屈曲可能な
プリント基板。[Claims for Utility Model Registration] (1) A thick-walled substrate body made of synthetic resin, and a thin-walled bendable bending groove integrally molded on substantially the same surface as the substrate body; A bendable printed circuit board comprising: a bendable printed circuit board that allows adjacent board bodies to be bent freely using the bending groove portion as a bending line. (2) The bendable printed circuit board according to claim 1, which is characterized in that the bendable printed circuit board is formed so that it can be folded freely using a bending groove as a bending part. (3) The bendable printed circuit board according to claim 1, wherein the bendable printed circuit board can be assembled three-dimensionally using the bending groove as the bending part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16275686U JPS63152260U (en) | 1986-10-23 | 1986-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16275686U JPS63152260U (en) | 1986-10-23 | 1986-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63152260U true JPS63152260U (en) | 1988-10-06 |
Family
ID=31090323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16275686U Pending JPS63152260U (en) | 1986-10-23 | 1986-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63152260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2701472A1 (en) * | 2011-04-19 | 2014-02-26 | Kabushiki Kaisha Toyota Jidoshokki | Wiring substrate |
-
1986
- 1986-10-23 JP JP16275686U patent/JPS63152260U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2701472A1 (en) * | 2011-04-19 | 2014-02-26 | Kabushiki Kaisha Toyota Jidoshokki | Wiring substrate |
| EP2701472A4 (en) * | 2011-04-19 | 2014-10-08 | Toyota Jidoshokki Kk | Wiring substrate |