JPH0351863U - - Google Patents

Info

Publication number
JPH0351863U
JPH0351863U JP11201789U JP11201789U JPH0351863U JP H0351863 U JPH0351863 U JP H0351863U JP 11201789 U JP11201789 U JP 11201789U JP 11201789 U JP11201789 U JP 11201789U JP H0351863 U JPH0351863 U JP H0351863U
Authority
JP
Japan
Prior art keywords
flexible printed
wiring board
printed wiring
wiring pattern
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11201789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11201789U priority Critical patent/JPH0351863U/ja
Publication of JPH0351863U publication Critical patent/JPH0351863U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この考案に係るフレキシブルプリン
ト配線板の全体の構成を示す平面図、第2図は、
第1図に示す実施例の折り曲げ後の状態を示す斜
視図である。 1……フレキシブルプリント配線板本体、2a
,2b,2c……配線パターン、3a,3b,3
c,3d……谷折りマーク、4a,4b,4c,
4d,4e,4f……山折りマーク。
FIG. 1 is a plan view showing the overall structure of the flexible printed wiring board according to this invention, and FIG.
FIG. 2 is a perspective view showing the state of the embodiment shown in FIG. 1 after being folded; 1...Flexible printed wiring board body, 2a
, 2b, 2c... Wiring pattern, 3a, 3b, 3
c, 3d... Valley fold mark, 4a, 4b, 4c,
4d, 4e, 4f... mountain fold marks.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅箔による配線パターンを形成したフレキシブ
ルプリント配線板本体の所定個所に上記配線パタ
ーンと同時に折り曲げ位置と折り曲げ方向を示す
マークを銅箔により形成してなることを特徴とす
るフレキシブルプリント配線板。
A flexible printed wiring board characterized in that a mark indicating a bending position and a bending direction is formed simultaneously with the wiring pattern at a predetermined location on a flexible printed wiring board main body having a wiring pattern made of copper foil formed thereon.
JP11201789U 1989-09-27 1989-09-27 Pending JPH0351863U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11201789U JPH0351863U (en) 1989-09-27 1989-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11201789U JPH0351863U (en) 1989-09-27 1989-09-27

Publications (1)

Publication Number Publication Date
JPH0351863U true JPH0351863U (en) 1991-05-20

Family

ID=31660470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11201789U Pending JPH0351863U (en) 1989-09-27 1989-09-27

Country Status (1)

Country Link
JP (1) JPH0351863U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123428A (en) * 2005-10-26 2007-05-17 Nec Electronics Corp Flexible circuit board
JP2009099837A (en) * 2007-10-18 2009-05-07 Panasonic Corp Flexible wiring board
JP2021002452A (en) * 2019-06-20 2021-01-07 矢崎総業株式会社 Flat harness

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123428A (en) * 2005-10-26 2007-05-17 Nec Electronics Corp Flexible circuit board
JP2009099837A (en) * 2007-10-18 2009-05-07 Panasonic Corp Flexible wiring board
JP2021002452A (en) * 2019-06-20 2021-01-07 矢崎総業株式会社 Flat harness

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