JPS62174344U - - Google Patents
Info
- Publication number
- JPS62174344U JPS62174344U JP6342786U JP6342786U JPS62174344U JP S62174344 U JPS62174344 U JP S62174344U JP 6342786 U JP6342786 U JP 6342786U JP 6342786 U JP6342786 U JP 6342786U JP S62174344 U JPS62174344 U JP S62174344U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- mounting
- circumferential surface
- outer circumferential
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案のカンタイプトランジス
タ実装用のパツドの実施例を示す断面図、第２図
ａ，ｂは本考案のカンタイプトランジスタ実装用
のパツドを示す斜視図、第３図ａ，ｂは従来のカ
ンタイプトランジスタの実装方式を示す断面図で
ある。
１……カンタイプトランジスタ本体、２……リ
ード線、３……絶縁材料よりなるパツド、４……
印刷配線基板、５……リード線折り曲げ用溝。
1A and 1B are cross-sectional views showing an embodiment of the pad for mounting a can-type transistor of the present invention, FIGS. 2A and 2B are perspective views showing the pad for mounting a can-type transistor of the present invention, and FIG. FIGS. 2A and 2B are cross-sectional views showing a conventional can-type transistor mounting method. 1... Can-type transistor body, 2... Lead wire, 3... Pad made of insulating material, 4...
Printed wiring board, 5... Groove for bending lead wires.
Claims (1)
刷配線基板上に実装するためのパツドであつて、
該パツドは絶縁材料よりなり、円筒状外周面を有
し、該外周面には軸方向に延長する前記リード線
の本数に応じたリード線折り曲げ溝が形成されて
いることを特徴とするカンタイプトランジスタ実
装用パツド。 A pad for mounting a can type transistor having a lead wire on a printed wiring board,
The pad is made of an insulating material and has a cylindrical outer circumferential surface, and the outer circumferential surface is formed with lead wire bending grooves corresponding to the number of the lead wires extending in the axial direction. Pad for transistor mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6342786U JPS62174344U (en) | 1986-04-25 | 1986-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6342786U JPS62174344U (en) | 1986-04-25 | 1986-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174344U true JPS62174344U (en) | 1987-11-05 |
Family
ID=30898643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6342786U Pending JPS62174344U (en) | 1986-04-25 | 1986-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174344U (en) |
-
1986
- 1986-04-25 JP JP6342786U patent/JPS62174344U/ja active Pending
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