JPS63147847U - - Google Patents
Info
- Publication number
- JPS63147847U JPS63147847U JP3984987U JP3984987U JPS63147847U JP S63147847 U JPS63147847 U JP S63147847U JP 3984987 U JP3984987 U JP 3984987U JP 3984987 U JP3984987 U JP 3984987U JP S63147847 U JPS63147847 U JP S63147847U
- Authority
- JP
- Japan
- Prior art keywords
- package
- hole
- semiconductor element
- optical semiconductor
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案の光半導体素子収納用パツケー
ジの一実施例を示す断面図、第２図は第１図の丸
部拡大断面図、第３図は従来の光半導体素子収納
用パツケージの断面図である。
１：絶縁基体、２：蓋体、３：光半導体素子、
７：光フアイバー、８：接着材、Ｇ：貫通孔、Ｙ
：凹部。
Fig. 1 is a sectional view showing an embodiment of the optical semiconductor device storage package of the present invention, Fig. 2 is an enlarged sectional view of the circle portion of Fig. 1, and Fig. 3 is a cross section of a conventional optical semiconductor device storage package. It is a diagram. 1: Insulating base, 2: Lid, 3: Optical semiconductor element,
7: Optical fiber, 8: Adhesive, G: Through hole, Y
: Concavity.
Claims (1)
イバーを挿着するための貫通孔を有する絶縁基体
と蓋体とから成る光半導体素子収納用パツケージ
において、前記貫通孔を孔径がパツケージ内部側
から外部側に向かつて大となるようなテーパー状
と成したことを特徴とする光半導体素子収納用パ
ツケージ。 In a package for housing an optical semiconductor element, which is composed of an insulating base and a lid, the through hole has a recess for accommodating an optical semiconductor element and a through hole for inserting an optical fiber, the diameter of the through hole is from the inside of the package to the outside of the package. A package for storing an optical semiconductor element, which is characterized by being tapered so as to become larger toward the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3984987U JPS63147847U (en) | 1987-03-18 | 1987-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3984987U JPS63147847U (en) | 1987-03-18 | 1987-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63147847U true JPS63147847U (en) | 1988-09-29 |
Family
ID=30853406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3984987U Pending JPS63147847U (en) | 1987-03-18 | 1987-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63147847U (en) |
-
1987
- 1987-03-18 JP JP3984987U patent/JPS63147847U/ja active Pending
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