JPS63147397A - Electronic parts assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component assembly suitable for use in an electronic component mounting apparatus for mounting electronic components onto a board.

2. Description of the Related Art Conventionally, as an electronic component mounting device for mounting electronic components on a board, as shown in FIG. 8, a tape-shaped electronic component holder 3 is used.
Electronic components 31 are placed in a housing space 33 formed in a line in 2.
Using an electronic component assembly 30 that accommodates a There is a known structure in which the semiconductor devices are sequentially taken out and mounted on a board. Furthermore, there is also known an electronic component holder in which an adhesive tape is used instead of the storage space 33 to adhesively hold electronic components. It is also known that the material can be taken out using a nozzle. Further, as shown in FIG. 9, the electronic component 31 is held on a holding sheet 36 that is stretchable and adhesive and is stretched over the moving frame 37.
An electronic component mounting device is also known in which the electronic component 31 is pushed up with a push-up needle 38 to be separated from the holding sheet 36, and the electronic component is sucked with a suction nozzle 35 to take out the electronic component.

Furthermore, Japanese Patent Publication No. 61-30737 discloses a method of attaching and fixing electronic components having bump electrodes to the leads of a board by metal-to-metal bonding, in which the electronic components are held in a stretchable adhesive sheet, and the adhesive sheet is Push down the electronic component with the hollow tool to make the bump electrode contact the lead of the board, make the needle inside the hollow tool protrude, penetrate the adhesive sheet and press the electronic component, and from that state, press down the electronic component with the hollow tool. The adhesive sheet is peeled off from the electronic component by lifting the adhesive sheet, and the electronic component is separated from the adhesive sheet without being accidentally moved by separating the adhesive sheet from the electronic component, and then the bonding tool is applied to the electronic component. A method for metal-to-metal bonding of bump electrodes and leads is disclosed.

Problems to be Solved by the Invention However, as described above, the electronic component 31 is
In a configuration in which it is adsorbed and transferred with a VC and then attached to a board by VC, the number of operation steps during installation is large, which makes it less efficient.
In addition, especially in the case of minute electronic components, there is a high possibility of suction failure.

In addition, the method disclosed in Japanese Patent Publication No. 61-3.0737 mounts electronic components directly from the adhesive sheet to the board without using a suction nozzle, so the number of operation steps during mounting is small, and there are no problems such as suction failures. There is no need to worry, but this applies only to attachment methods using metal-to-metal bonding (wa, what's more, if the adhesive sheet is pierced by an elastic movable object or a needle during attachment, the holding of other electronic components may become unstable and the position may become unstable). There is also the problem that accuracy deteriorates.

In view of these problems, the present invention provides an electronic component assembly in which electronic components can be held reliably and with high positional accuracy, the number of operation steps during mounting is small, and electronic component mounting failures are less likely to occur. The purpose is to

Means for Solving the Problems In order to achieve the above object, the present invention provides a rigid holding plate with a large number of holding holes penetrating through the holding plate, and one electronic component is inserted into each holding hole. an adhesive layer is provided on one side of the holding plate corresponding to the side opposite to the surface on which the electronic components are mounted on the board, and the electronic component is held in the holding hole by this adhesive layer. It is characterized by

Function Since the present invention has the above configuration, the electronic component is held with high positional accuracy by the rigid holding plate and reliably and stably by the adhesive layer. Further, the holding plate is placed on the substrate,
With the adhesive layer of the holding plate located on the opposite side of the board and facing each other, the electronic parts held with adhesive in the holding holes are pushed out using appropriate means, and the electronic parts are mounted directly onto the board. This allows the device to be installed accurately and reliably without failure with a small number of operation steps during installation.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3. Reference numeral 2 denotes a disc-shaped holding plate made of a rigid plate material such as a stainless steel plate, and a large number of holding holes 3 into which electronic components 1 can be fitted are aligned.
It is drilled through. One 111 of this holding plate 2
As shown in detail in the third section 1, an adhesive sheet 4 is attached to the 11th surface 2a. Then, an electronic component 1 is fitted into each of the holding holes 3 with the surface to be mounted on the board facing the opposite side from the adhesive sheet 4, and the side surface of the electronic component 1 on the adhesive sheet 4 side is attached to the adhesive sheet 4. 4 to hold the electronic component 1. These electronic components 1 and holding plate 2
and the adhesive sheet 4 constitute an electronic component assembly 5.

In this embodiment, a semi-cylindrical positioning portion 1a is formed on a pair of opposing sides of the electronic component 1, and a corresponding semi-cylindrical notch 3a is formed on the opposing surface of the holding hole 3. .

In addition, this electronic component assembly 5 is made by pasting an adhesive sheet 4 on one side of the holding plate 2 in which holding holes 3 are punched, and placing the adhesive sheet 4 on the support surface with the adhesive sheet 4 facing down as shown in FIG. 6
It is formed by inserting and fitting the electronic component 1 into each holding hole 3 of this holding plate 2 with its mounting surface facing downward.

Next, the electronic component mounting apparatus 4 using the electronic component assembly 5 and its mounting operation will be explained.

In FIG. It is configured. This X-
An annular frame 23 is disposed above the Y table 21 so as to be movable in the horizontal direction and rotatable around the central axis, and the electronic component assembly 5 is fixedly supported on the annular frame 23 by a fixture 24. ing. A push-down shaft 25 is disposed above the annular frame 23 and above the central portion of the X-Y table 21, and is movable up and down as well as rotatable around its axis. It's being served. As shown in FIG. 5(a), the push-out pin 26 is formed at both ends of the electronic component 1 via a downward step portion 26a that engages and presses the top surface of the electronic component 1 at its lower end. The electronic component 1 is engaged with the semi-cylindrical positioning portion 1a that has been
It has a tapered portion 26b for positioning.

In the above configuration, first, the X-Y table 21 is operated, and the position on which the electronic component 1 of the board 22 placed and fixed thereon is to be mounted is positioned below the axial center of the push-down shaft 25. Next, an adhesive is applied to the electronic component mounting position of the board 22 using an adhesive application device (not shown). Next, the annular frame 23 is moved to align the center of the electronic component 1 to be mounted with the lower axis of the push-down pongee 25, and the annular frame 23 is rotated to determine the mounting posture of the electronic component 1. Then, rotate the push-down shaft 25 to match the attitude of the push-down pongee 25 with the attitude of the electronic component 1.

Then, the push-down pongee 25 is lowered, and the pushing pin 26 breaks through the adhesive sheet 4 and presses the electronic component 1, so that the electronic component 1 is held by the adhesive sheet 4 as shown in FIG. 5(b). The electronic component 1 can be pushed out from the holding hole 3 and mounted directly on the board 22.

In addition, in the case of this embodiment, the step portion 26a of the push-out bottle 26
Press the top surface of the electronic component 1 to push the electronic component 1 out of the holding hole 3 against the holding force of the adhesive sheet 4, and
The tapered portion 26b is connected to the semi-cylindrical positioning portion 1 of the electronic component 1.
By positioning the electronic component 1 through engagement, the electronic component 1 can be mounted on the board 22 while being positioned. If the distance between the substrate 22 and the holding plate 2 is wide, a suction nozzle for suctioning the electronic component 1 may be attached to the push-down shaft 25, or a semi-cylindrical positioning portion 1al may be engaged with the electronic component 1. An idbin may be provided to guide the descent.

Next, a second embodiment of the present invention will be described based on FIGS. 6 and 7(a) and 7(b). This embodiment is an example in which an adhesive layer is used in place of the adhesive sheet 4 in the first embodiment. That is, in Fig. 6, 12 is a holding plate;
A large number of holding holes 13 are drilled through. and,
The electronic component 1 is fitted into each holding hole 13 and is held by a support agent layer 14 coated on one side 12 a of the holding plate 12 .

As shown in FIG. 6, this electronic component assembly 15 has a holding plate 12 formed by punching holding holes 13 on a supporting surface 16.
Insert and fit the electronic component 1 into each holding hole 13 with the mounting surface for the board facing the support surface 16 side, and then insert the top surface of the holding plate 12 into the It is formed by forming an adhesive layer 14 with cloth 1- and holding electronic component 1 with this adhesive layer 14.

Furthermore, when mounting the electronic component 1 using the electronic component assembly 15, the adhesive layer 14 is positioned on the opposite side of the substrate 22, as shown in FIG. The electronic component assembly 15 can be disposed in the same manner as in the first embodiment, and the electronic component 1 can be mounted by pushing out the electronic component 1 using the pushing bottle 26 against the holding force of the adhesive layer 111, as in the first embodiment.

Further, in this embodiment, even after mounting on the board 22, the surface of each electronic component 1 opposite to the mounting surface is covered with adhesive shavings 14, and this adhesive layer 14 acts as a protective film.
) There are also advantages.

Effects of the Invention According to the electronic component assembly of the present invention, as described above, the electronic component can be positioned with high positional accuracy by the rigid holding plate.
Moreover, the electronic component can be reliably and stably held by the adhesive layer 3, and by pushing out the electronic component held by the adhesive layer into the holding hole by an appropriate means, the electronic component can be directly attached to 2F+Fi. , Xλ7 [j, l? It has great effects, such as being able to attach it accurately and without failure with a small number of operating steps.

[Brief explanation of the drawing]

1 to 3 show a first embodiment of the present invention, and FIG.
a) is a plan view of the electronic component assembly, (11) is a front view of the same, Figure 'jS2 is an enlarged plan view of the same main part, Figure tjS3 is the second
4 is a partially sectional front view of the electronic component assembly, and FIGS. 5(a) and 5(I) are longitudinal sections showing the mounting process of electronic components in the first embodiment. 6 and 7 show a second embodiment of the present invention, FIG. 6 is a sectional view similar to FIG. 3 of the main part of the electronic component assembly, FIG. 7(a),
FIG. 9(b) is a sectional view showing the mounting process of electronic components in the FT42 embodiment, and FIGS. 1・・・・・・・・・・・・・・・Electronic parts 2.
12......Retaining plate 3.13......Retaining hole 4......Adhesive sheet 5
.........Electronic component assembly 14......Adhesive layer. Agent Nohe 6 Patent Attorney Toshio Nakao and 1 other person I
4 Figure 4 Figure 5 (a) Figure 5 b) Figure 7 (a) Figure 7 (b) Figure 8 Figure 9

Claims (1)

[Claims] A large number of holding holes are formed in a rigid holding plate so as to pass through the holding plate, and electronic components are fitted into each holding hole. An electronic component assembly characterized in that an adhesive layer is provided on one side of the holding plate corresponding to the holding plate, and the electronic component is held in the holding hole by the adhesive layer.