JPS63144600A - Cooling method for electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for cooling an electronic device, and more particularly to a method for optimizing the capacity of a blower when an electronic device is forcibly cooled by a blower.

[Conventional technology]

Conventionally, when using a blower to force-air-cool electronic devices such as electronic units mounted on a case or rack, one or more blowers are installed in a haphazard manner to accommodate the heat load of the electronic device. No consideration was given to reducing the pressure load and optimizing the capacity of the blower.

Note that forced cooling of an electronic device using a plurality of blowers is described in, for example, Japanese Utility Model Application Publication No. 60-92889.

[Problem that the invention seeks to solve]

In recent electronic devices, as the density of electronic circuit units increases, there is a demand for miniaturization in order to achieve high heat generation density. In this case, high heat generation density can be dealt with by increasing the number of blowers, but this conflicts with the demand for miniaturization of the device. For this reason, efforts are being made to reduce the planar space by installing blowers on the upper and lower tiers of electronic circuit unit mounting racks, etc.

Since the sound from the upper fan is emitted directly upwards, a special silencer must be added, resulting in a complicated structure and an expensive lateral movement.

An object of the present invention is to enable the maximum capacity of the blower to be used for forced cooling of electronic devices using a blower, to reduce the number of blowers to the necessary minimum, and to downsize and reduce the size of the cooling structure of electronic devices. The goal is to realize pricing.

[Means for solving problems]

The purpose of the above is to operate the blower so that the distance between the suction surface of the blower and the wall surface of the casing, rack, etc. in which the electronic circuit unit or the like is mounted is at least half the diameter of the suction surface of the blower or more. This is achieved by installing the

[For production]

By setting the distance between the suction part of the blower and the wall surface of the mounting rack to at least half the diameter of the suction part of the blower or more, the pressure load (pressure loss) on the blower can be reduced.
is minimized and the blower can be used at its maximum capacity. As a result, the number of blowers can be reduced, and the cooling structure of electronic devices can be made smaller and lower in price.6 [Embodiment] An embodiment of the present invention will be described below with reference to drawings.6 Figure 1 shows the present invention. 1 shows a front cross-sectional view of an embodiment of an electronic device according to FIG. In FIG. 1, a rack 2 is attached to a frame 1, and a large number of electronic circuit units 8 are mounted on this rack 2. Further, for safety reasons, a ceiling punching 9 and a floor punching 3 are attached to the frame 1, and an air filter 4 is also provided to purify the air.

In this embodiment, a sirocco type blower 6 is used for cooling the electronic circuit 8. Sirocco type blower 6.

Air is sucked in from the side of the impeller 7 and blown in a direction perpendicular to the axis of the impeller 7. Figure 1 shows the wind flow with arrows.

Generally, the capacity of a blower is expressed in terms of air volume and static pressure.

To obtain the required xi, the pressure loss to the blower must be minimized. FIG. 2 shows the relationship between the distance α between the suction part of the impeller 7 of the blower 6 and the wall surface 5 of the rack 2 and the pressure loss. Here, D is an impeller. From Figure 2,
The distance Q is approximately half the inner diameter of the impeller 7 of the blower 6 CD/
2) or more, the pressure loss at the suction section of the blower 6 can be minimized.

As a result, the blower 6 can be used at its maximum capacity, making it possible to downsize the blower 6 and minimize its quantity. Furthermore, the width of the rack 2 can be reduced, resulting in an economical cooling structure for electronic devices. It goes without saying that the dimensional arrangement between the blowers 6 should also be optimized.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to downsize and reduce the number of forced air blowers installed in electronic devices, and the effect is that electronic devices can be provided with a compact and inexpensive cooling structure. There is.

[Brief explanation of the drawing]

FIG. 1 is a front sectional view of an embodiment of an electronic device according to the present invention, and FIG. 2 is a diagram showing the relationship between the distance between the suction part of the blower and the mounting wall surface and the pressure loss. 1... Frame, 2... Frame, 3... Floor punching, 4... Air filter, 5... Wall surface, 6...
...Blower, 7... Impeller, 8... Electronic circuit unit. Figure 1

Claims (1)

[Claims] (1) In an electronic device in which an electronic circuit unit is mounted on a housing, a rack, etc., the distance between the suction part of the blower and the wall surface of the housing, rack, etc. is at least half the diameter of the suction part of the blower or less. A method for cooling an electronic device, characterized in that the blower is installed to forcefully air-cool the electronic circuit unit so that the temperature is as high as the above level.