JPH071835B2 - Electronic device cooling method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cooling an electronic device, and more particularly to a method for optimizing the capacity of a blower when the electronic device is forcibly cooled by a blower.

[Conventional technology]

Conventionally, in the case of forcibly air-cooling an electronic device such as an electronic unit mounted on a casing or a rack with a blower, one or a plurality of blowers are installed aimlessly according to the heat load of the electronic device. No consideration was given to reducing the pressure load and optimizing the capacity of the blower.

The forced cooling of the electronic device by using a plurality of blowers is described in, for example, Japanese Utility Model Laid-Open No. 60-92889.

[Problems to be solved by the invention]

Recent electronic devices are required to be miniaturized as the heat generation density increases as the density of electronic circuit units increases. In this case, the high heat generation density can be dealt with by increasing the number of fans, but it is contrary to the demand for downsizing of the device. For this reason, we have tried to reduce the plane space by installing blowers in the upper and lower stages of the electronic circuit unit mounting rack, etc., but a special silencer must be added because the sound of the upper fan directly goes up. However, there is a problem that the structure becomes complicated and the structure becomes expensive.

The object of the present invention is to make the capacity of the blower to the maximum when the electronic device is forcibly cooled by the blower, to minimize the number of the blowers, and to make the cooling structure of the electronic device small and low. It is to realize price reduction.

[Means for solving problems]

The above-mentioned object is to install the blower so that the distance between the suction surface of the blower and the wall surface of the housing or rack on which the electronic circuit unit is mounted is at least about half the diameter of the suction surface of the blower or more. It is achieved by installing it.

[Action]

By setting the distance between the suction part of the blower and the wall surface of the mounting rack to be at least about half the diameter of the suction part of the blower or more, the pressure load (pressure loss) on the blower
And the blower can be used at maximum capacity. As a result, the number of fans can be reduced, and the cooling structure of the electronic device can be downsized and the cost can be reduced.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front sectional view of an electronic device according to an embodiment of the present invention. In FIG. 1, a frame 2 is attached to a frame 1, and a large number of electronic circuit units 8 are mounted on the frame 2. Further, for safety, ceiling punching 9 and floor punching 3 are attached to the frame 1, and an air filter 4 is provided for cleaning the air.

In this embodiment, the sirocco type blower 6 is used for cooling the electronic circuit 8. The sirocco type blower 6 sucks air from the side surface of the impeller 7 and blows the air in a direction perpendicular to the axis of the impeller 7. The flow of wind in FIG. 1 is indicated by arrows.

Generally, the capacity of a blower is represented by the air volume and static pressure. In order to obtain the required air volume, it is necessary to minimize the pressure loss to the blower. FIG. 2 shows the relationship between the pressure loss and the distance 1 between the suction part of the impeller 7 of the blower 6 and the wall surface 5 of the rack 2. Here, D is the impeller. From Fig. 2, the distance l
Is about half (D / 2) of the inner diameter D of the impeller 7 of the blower 6 or more, the pressure loss at the suction portion of the blower 6 can be minimized.

As a result, the blower 6 can be used with the maximum capacity, and the blower 6 can be downsized and minimized. Further, the width of the rack 2 can be reduced, and an economical cooling structure for the electronic device can be realized. Needless to say, the dimensional arrangement between the blowers 6 is also optimized.

〔The invention's effect〕

As is clear from the above description, according to the present invention, the forced air blower installed in the electronic device can be downsized and reduced in number, and the electronic device can have a small and inexpensive cooling structure. There is.

[Brief description of drawings]

FIG. 1 is a front sectional view of an embodiment of an electronic device according to the present invention, and FIG. 2 is a view showing a relationship between a distance between a suction part of a blower and a mounting wall surface and pressure loss. 1 ... Frame, 2 ... Rack, 3 ... Floor punching, 4 ...
... Air filter, 5 ... wall surface, 6 ... blower, 7 ... impeller, 8 ... electronic circuit unit, 9 ... ceiling punching.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fumiyuki Kobayashi 1 Horiyamashita, Hadano, Kanagawa Pref., Kanagawa Plant, Hiritsu Manufacturing Co., Ltd. (72) Ikichi Ozaki 1 Horiyamashita, Hadano, Kanagawa (72) Inventor Tetsuo Ogata 1479, Kamimizuhonmachi, Kodaira-shi, Tokyo In-house Hitachi Microcomputer Engineering Co., Ltd. (56) Bibliography Sho 60-92889 (JP, U)

Claims (1)

[Claims] 1. In an electronic device in which an electronic circuit unit is mounted on a casing, a rack, etc., a distance between a suction part of the blower and a wall surface of the casing, the rack, etc. is at least half the diameter of the suction part of the blower. Alternatively, a method for cooling an electronic device is characterized in that the blower is installed and the electronic circuit unit is forcibly air-cooled so as to have a temperature of more than that.