JPS63143817A - Exposure apparatus - Google Patents

Abstract

PURPOSE:To enable a pattern of a semiconductor device having a size larger than that of an exposure range of a light source and a lens of an exposure apparatus to be transferred, by arranging a mask having a size larger than that of the projectable range and moving also mask, in addition to a semiconductor substrate which would be moved along according to prior arts, in synchronization with movement of the semiconductor substrate. CONSTITUTION:In a reducing projection exposure apparatus having an ultraviolet radiation light source 11, a mask holder 12, a reducing projection lens 13 and a sample material stage 14, a holder 12 has a size larger than that of the visual field of the lens by integral times. Predetermined regions of the holder 12 are moved by steps successively onto the visual field of the lens by a mask moving mechanism 15. The sample stage 14 is moved by steps by a moving mechanism 16 synchronously with the step movement of the holder 12, so that all the regions on the holder 12 are projected on the material stage by the light source. Further, the stage is adapted in the manner such that it can be moved in the X- and Y-directions by the same or different moving mechanisms 15 and 16, independently from the movement of the holder 12.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an exposure apparatus capable of transferring patterns of semiconductor devices having a large area.

Prior Art A conventional example will be explained based on FIG. In a reduction projection exposure apparatus having an ultraviolet irradiation light source 1, a mask holder 2, a reduction projection lens 3, and a sample stage 4, a mask having a pattern that is several times larger than the pattern of a semiconductor device is fixedly installed on a mask holder. The mask pattern is projected and exposed onto the semiconductor substrate using a reduction projection lens.

Next, with the mask fixed, the semiconductor substrate is sequentially moved by the moving mechanism 6, and the mask pattern is stubbornly projected onto the semiconductor substrate to form a mask pattern on the entire surface of the semiconductor substrate.

Problems to be Solved by the Invention In the conventional apparatus described above, once the mask is installed, it remains fixed, so the size of the projection area is limited by the lens, and as the projection area is increased, the aberration of the lens becomes larger. There was a problem that the resolution deteriorated.Therefore, in order to project a high resolution pattern, there was a problem that the size of the projection area, that is, the semiconductor device must be controlled.

Means for Solving the Problems In order to solve the problems of the conventional art, the present invention installs a mask larger than the projectable area on the mask holder, and synchronizes the movement of the semiconductor substrate in addition to the conventional movement of only the semiconductor substrate. By moving the mask, it is also possible to transfer a pattern of a semiconductor device that is larger than the exposure area of the light source and lens of the exposure device.

Operation According to the apparatus of the present invention, the mask and the semiconductor substrate are synchronized and moved to form a mask pattern in an area larger than the exposure area.
Projection exposure can be performed onto a semiconductor substrate. Therefore, if the chip size of the semiconductor device is larger than the exposure area, a plurality of chips are formed on a mask by dividing them, and the mask is sequentially moved to sequentially move the plurality of chips to the exposure area. Expose onto the semiconductor substrate. At this time, by sequentially moving the semiconductor substrate by a predetermined distance in synchronization with the movement of the mask, a semiconductor device larger than the exposed area can be formed on the semiconductor substrate. An example of this will be described. In a reduction projection exposure apparatus having an ultraviolet irradiation light source 11, a mask holder 12, a reduction projection lens 13, and a sample stage 14, the mask holder 12 is formed to have a size larger than an integral multiple of the field field 18 of the lens. do.

A predetermined area of the mask holder 12 is sequentially stepped onto the viewing field of the lens by a mask moving mechanism 16. The sample stage 14 includes the mask holder 1
In synchronization with the second step movement, the moving mechanism 16 moves step by step, and the entire area on the mask holder 12 is irradiated onto the sample stage by the light source. Further, the sample stage 14 is movable in the X-Y direction independently of the mask holder 12 by step movement mechanisms 16 and 16 that are the same as or different from those described above.

A second embodiment of the present invention will be described based on FIG.

In an I-ray projection exposure apparatus having an X-ray irradiation light source 21, a mask holder 22, and a sample stage 23, the mask holder 22 is connected to the irradiation area 26 of the X-ray irradiation light source 21.
A larger mask (not shown) can be supported, and the entire mask pattern can be moved and irradiated to the irradiation area 26 by continuous movement and step movement. The mask holder 22
are moved by moving mechanisms 24 and 26, respectively, in synchronization with the movement of the sample stage. The irradiation method using this device will be explained below. A mask held by the mask holder is placed in the X-ray irradiation area. After aligning the mask pattern and the pattern of the sample held on the sample stage, the mask holder and sample stage are held fixed and moved and scanned so that the entire mask is irradiated with X-rays, Next, the X-ray irradiation is blocked by a shutter, etc., and the sample stage is moved step by step, and the mask holder is moved to the initial position, and the predetermined pattern on the mask and the sample are transferred again. The pattern at a different location on the sample stage is aligned, and the same movement and scanning as above is performed to transfer the mask pattern to the entire surface of the sample stage.

Effects of the Invention As described above, according to the present invention, exposure can be performed not only by moving the semiconductor substrate but also by moving the mask. It is possible to transfer a mask pattern with a large area onto a semiconductor substrate.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of an exposure apparatus according to an embodiment of the present invention, FIG. 2 is a schematic diagram of an apparatus according to another embodiment of the invention, and FIG. 3 is a schematic diagram of a conventional exposure apparatus. 11.21... Light source, 12.22...
Mask holder, 14.23...Sample stage, 15°24...Mask holder moving mechanism, 1
6.25...Sample stage movement mechanism. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
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Claims (1)

[Claims] a mechanism for installing an irradiation light source, a mask holder, a sample stage, and a mask having a pattern in an area larger than the irradiation area of the light source on the mask holder, and sequentially moving the pattern on the mask to the irradiation area of the light source;
After aligning the mask pattern with the pattern on the semiconductor substrate placed on the sample stage, the semiconductor substrate is sequentially moved in synchronization with the movement of the mask holder, and the predetermined pattern of the mask is placed on the semiconductor substrate. moving only the mechanism for irradiating and the sample stage independently;
The method further comprises a mechanism for realigning a different pattern on the semiconductor substrate and the mask pattern, moving the mask and the semiconductor substrate synchronously in the same manner as described above, and transferring a predetermined pattern of the mask onto the semiconductor substrate. Exposure equipment.