JPS63142850U

JPS63142850U -

Info

Publication number: JPS63142850U
Application number: JP3478987U
Authority: JP
Priority date: 1987-03-10
Filing date: 1987-03-10
Publication date: 1988-09-20

Description

[Brief explanation of the drawing]

第１図は本考案の電子部品の放熱器具の一実施
例を示す全体斜視図、第２図はその分解斜視図、
第３図は要部の拡大平面図、第４図は第２図に対
応する分解斜視図、第５図は従来の放熱器具の一
例を示す分解斜視図である。１……ヒートシンク、２……ＰＧＡパツケージ
、３……ＰＧＡ用ソケツト、６……通し溝、８…
…係着溝、１１……係着ばね。 FIG. 1 is an overall perspective view showing an embodiment of the heat dissipation device for electronic components of the present invention, and FIG. 2 is an exploded perspective view thereof.
FIG. 3 is an enlarged plan view of essential parts, FIG. 4 is an exploded perspective view corresponding to FIG. 2, and FIG. 5 is an exploded perspective view showing an example of a conventional heat dissipation device. 1... Heat sink, 2... PGA package, 3... PGA socket, 6... Through groove, 8...
...Latching groove, 11...Latching spring.

Claims

[Claims for Utility Model Registration] Both free ends of a spring wire are formed into horizontally extending locking parts 14, 14, and both side rod parts are bent from the respective locking parts 14, 14 and rise vertically. 15
. A pair of springs 11, a heat sink 1 having through grooves 6, 6, 6, 6, which are grooves for passing the side rod portions 15, formed at each of the four corners, and the side rod portions 15 at each of the four corners. A heat dissipation device for electronic components, comprising a PGA socket 3 having locking grooves 8, 8, 8, 8, which are grooves for passing through the PGA socket.