JPS63140627U - - Google Patents

Info

Publication number
JPS63140627U
JPS63140627U JP3429687U JP3429687U JPS63140627U JP S63140627 U JPS63140627 U JP S63140627U JP 3429687 U JP3429687 U JP 3429687U JP 3429687 U JP3429687 U JP 3429687U JP S63140627 U JPS63140627 U JP S63140627U
Authority
JP
Japan
Prior art keywords
wired
mount
circuit board
around
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3429687U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3429687U priority Critical patent/JPS63140627U/ja
Publication of JPS63140627U publication Critical patent/JPS63140627U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一部切欠平面図、第２図は第
１図の―線断面図である。 尚、図中Ａ：回路基板、１：基板、２：マウン
ト部、３：ＩＣチツプ、５：導線、６：連結線、
５ａ，５ｂ：リード部、ｍ：間隙部を夫々示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上面に配線された導線とマウント部周囲の
    所定位置に配線したリード部とを、マウント部に
    固着されたＩＣチツプとマウント部の周囲に配線
    された導線との間隙部に配線された連結線を介し
    て連結したことを特徴とする回路基板。
JP3429687U 1987-03-07 1987-03-07 Pending JPS63140627U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3429687U JPS63140627U (ja) 1987-03-07 1987-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3429687U JPS63140627U (ja) 1987-03-07 1987-03-07

Publications (1)

Publication Number Publication Date
JPS63140627U true JPS63140627U (ja) 1988-09-16

Family

ID=30842708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3429687U Pending JPS63140627U (ja) 1987-03-07 1987-03-07

Country Status (1)

Country Link
JP (1) JPS63140627U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214187A (ja) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd プリント配線板
JPH0438043U (ja) * 1990-07-25 1992-03-31

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261146A (ja) * 1984-06-07 1985-12-24 Toshiba Corp 半導体装置の内部リ−ド部

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261146A (ja) * 1984-06-07 1985-12-24 Toshiba Corp 半導体装置の内部リ−ド部

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214187A (ja) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd プリント配線板
JPH0438043U (ja) * 1990-07-25 1992-03-31

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