JPS63138727U - - Google Patents
Info
- Publication number
- JPS63138727U JPS63138727U JP3138487U JP3138487U JPS63138727U JP S63138727 U JPS63138727 U JP S63138727U JP 3138487 U JP3138487 U JP 3138487U JP 3138487 U JP3138487 U JP 3138487U JP S63138727 U JPS63138727 U JP S63138727U
- Authority
- JP
- Japan
- Prior art keywords
- back sides
- piezoelectric
- resonant electrodes
- resin molded
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 150000001879 copper Chemical class 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図、第２図は本考案の一実施例による圧電
磁器波器を示す図、第３図は従来の圧電磁器
波器を示す図である。
１０……出力用端子、１１……アース用端子、
１２……入力用端子、１３……Ｐ板又は樹脂成形
品、１４……切欠部。
1 and 2 are diagrams showing a piezoelectric ceramic waver according to an embodiment of the present invention, and FIG. 3 is a diagram showing a conventional piezoelectric ceramic waver. 10... Output terminal, 11... Earth terminal,
12... Input terminal, 13... P plate or resin molded product, 14... Notch.
Claims (1)
子の表裏に相対する共振電極を２対有しかつ、上
記共振電極の一端が素子の周辺部までに到達した
圧電素子を、樹脂成形基板もしくは、プリント配
線用積層銅板の表裏に接続された端子上に、導電
性接着剤もしくは、はんだ等で接着した圧電磁器
波器。 A piezoelectric element that has two pairs of resonant electrodes facing each other on the front and back sides of a double-shaped element that utilizes thickness shear vibration of piezoelectric ceramics, and one end of the resonant electrodes reaching the periphery of the element, is mounted on a resin molded substrate or printed. A piezoelectric ceramic waveguide that is bonded with conductive adhesive or solder to the terminals connected to the front and back sides of a laminated copper plate for wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3138487U JPS63138727U (en) | 1987-03-04 | 1987-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3138487U JPS63138727U (en) | 1987-03-04 | 1987-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63138727U true JPS63138727U (en) | 1988-09-13 |
Family
ID=30837061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3138487U Pending JPS63138727U (en) | 1987-03-04 | 1987-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63138727U (en) |
-
1987
- 1987-03-04 JP JP3138487U patent/JPS63138727U/ja active Pending
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