JPS63138701A - Manufacture of ptc device - Google Patents

Manufacture of ptc device

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Publication number
JPS63138701A
JPS63138701A JP28546686A JP28546686A JPS63138701A JP S63138701 A JPS63138701 A JP S63138701A JP 28546686 A JP28546686 A JP 28546686A JP 28546686 A JP28546686 A JP 28546686A JP S63138701 A JPS63138701 A JP S63138701A
Authority
JP
Japan
Prior art keywords
polymer
ptc
melting point
ptc element
kneading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28546686A
Other languages
Japanese (ja)
Inventor
秀明 田中
荒井 光男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP28546686A priority Critical patent/JPS63138701A/en
Publication of JPS63138701A publication Critical patent/JPS63138701A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Thermistors And Varistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気素子の製造法に関し、より詳細には、温
度上昇に伴って比較的狭い温度領域で電気抵抗が急増す
る性質(PTC特性CPo5t口vetemperat
ure coef’f’1cient ) )を有する
素子、すなわち、PTC素子の製造法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an electric element, and more specifically, the present invention relates to a method for manufacturing an electric element, and more particularly, the present invention relates to a method for manufacturing an electric element, and more particularly, to CPo5t mouth veteran
The present invention relates to a method for manufacturing a device having a PTC device, that is, a PTC device.

〔従来の技術〕[Conventional technology]

PTC組成物は、一定の温度に上昇すると発熱が止まる
ヒータ、正特性サーミスタ(PTCTHERMISTE
I?) 、感熱センサ、電池などを含む回路が短絡した
ときジュール熱に基づく自己発熱により抵抗値が増大し
て過電流を所定の電流以下に制限し他方その短絡が取除
かれたとき回路が復帰する回路保護素子などに利用する
ことができる。PTC組酸物として、現在種々の物質が
開発され、例えば、ポリエチレン、エチレン−アクリル
酸共重合体など少なくとも1種の重合体の樹脂にカーボ
ンブラックなどの導電性粒子が均一に分散されたものが
ある。
PTC compositions are used in heaters that stop generating heat when the temperature rises to a certain level, and positive characteristic thermistors (PTC THERMISTE).
I? ) When a circuit containing a thermal sensor, battery, etc. is short-circuited, the resistance value increases due to self-heating based on Joule heat, limiting the overcurrent to a predetermined current or less, and the circuit returns to normal when the short circuit is removed. It can be used as a circuit protection element, etc. Currently, various materials have been developed as PTC composite acids, such as those in which conductive particles such as carbon black are uniformly dispersed in at least one polymer resin such as polyethylene or ethylene-acrylic acid copolymer. be.

従来、PTC組成物の調製は、一般的に、重合体として
用いる1種またはそれ以上の樹脂に必要量のカーボンブ
ラックを添加し、例えば、ニーグーおよび/または2本
ロールで混練して製造されている。このPTC組成物か
らPTC素子が、例えば、次の様に製造されている。こ
のPTC組成物をフィルム状に成形し、フィルムの上下
に金属箔の電極を熱圧着して積層体を形成し、この積層
体を所望の寸法に切断し、電極表面のリードを電気的に
接続して製造されている。
Conventionally, the preparation of PTC compositions is generally made by adding the required amount of carbon black to one or more resins used as polymers and kneading them, for example, in a niegu and/or two-roll mill. There is. A PTC element is manufactured from this PTC composition, for example, in the following manner. This PTC composition is formed into a film, metal foil electrodes are thermocompressed on the top and bottom of the film to form a laminate, this laminate is cut into desired dimensions, and the leads on the electrode surfaces are electrically connected. It is manufactured by

[発明が解決しようとする問題点] PTC素子として、また、PTc組成物として好ましい
特性は、高温で抵抗値(ピーク抵抗)が゛  大きいこ
とと共に、室温で100 mΩ以下の低い抵抗値(室温
抵抗)を有すること、すなわち、ビーク抵抗/室温抵抗
の高い比を得ることである。
[Problems to be Solved by the Invention] Preferred characteristics for a PTC element and a PTc composition are a high resistance value (peak resistance) at high temperatures and a low resistance value of 100 mΩ or less at room temperature (room temperature resistance). ), that is, to obtain a high ratio of peak resistance/room temperature resistance.

しかしながら、従来のPTC素子の製造法では、必ずし
も低い室温抵抗値が得られず、しかも、製造ロフトごと
に室温抵抗が大きく異なるという問題点がある。
However, the conventional method of manufacturing a PTC element does not necessarily provide a low room temperature resistance value, and furthermore, there is a problem that the room temperature resistance value varies greatly depending on the manufacturing loft.

本発明は、上述の背景に基づいてなされたものであり、
その目的とするところは、100 mΩ以下の低い室温
抵抗を有すると共に、製造ロフトごとの室温抵抗のバラ
ツキがないPTC素子を製造することのできる方法を提
供することである。   ″〔問題点を解決するための
手段〕 本発明者は、上述の目的達成のために種々の試験・研究
の結果、混練から得られた混線物を加熱及び急冷却の熱
履歴に付すことにより良好なPTC特性を有する素子が
得られるとの知見を得て、本発明を完成するに至った。
The present invention has been made based on the above background,
The purpose is to provide a method for manufacturing a PTC element that has a low room temperature resistance of 100 mΩ or less and has no variation in room temperature resistance from manufacturing loft to manufacturing loft. ``[Means for solving the problem] In order to achieve the above-mentioned purpose, the present inventor has conducted various tests and researches to solve the problem by subjecting the mixed material obtained from kneading to a thermal history of heating and rapid cooling. The present invention was completed based on the knowledge that an element having good PTC characteristics can be obtained.

すなわち、本発明のPTC素子の製造法は、少なくとも
2枚の金属電極と、その電極に接合されたPTC組成物
とからなるPTC素子を製造する方法であって、該PT
C,[酸物が少なくとも1種の重合体およびカーボンブ
ラックなどの導電性粒子を混練し該重合体中に該粒子を
均一に分散してなるものであり、PTC組成物を、混線
に用いる重合体のうち融点の低い重合体の融点近傍の温
度に加熱し更にこの加熱混線物を零度以下の温度に急冷
却する加熱および急冷却工程に付すことを特徴とするも
のである。
That is, the method for manufacturing a PTC element of the present invention is a method for manufacturing a PTC element comprising at least two metal electrodes and a PTC composition bonded to the electrodes,
C, [The acid compound is made by kneading at least one kind of polymer and conductive particles such as carbon black, and the particles are uniformly dispersed in the polymer, and the PTC composition is mixed with the polymer used for crosstalk. It is characterized by heating to a temperature close to the melting point of the polymer having the lower melting point among the coalesced materials, and then subjecting the heated mixture to a heating and rapid cooling step of rapidly cooling it to a temperature below zero degrees.

この発明の好ましい態様において、融点の低い重合体の
融点近傍の温度を融点の低い重合体の融点±20℃にす
ることができる。
In a preferred embodiment of the present invention, the temperature near the melting point of the low melting point polymer can be adjusted to ±20° C. of the melting point of the low melting point polymer.

この発明の好ましい態様として、急冷却をマイナス20
〜60℃に冷却して行うことができる。
In a preferred embodiment of this invention, rapid cooling is carried out by -20
This can be carried out by cooling to ~60°C.

この発明の好ましい態様として、加熱および急冷却工程
の熱履歴を繰返すことができる。
In a preferred embodiment of this invention, the thermal history of the heating and rapid cooling steps can be repeated.

以下、この発明を、より詳細に説明する。This invention will be explained in more detail below.

重合体 この発明に於いて用いる重合体として、ポリエチレン、
ポリエチレンオキシド、t−4−ポリブタジェン、ポリ
エチレンアクリレート、エチレン−エチルアクリレート
共重合体、エチレン−アクリル酸共重合体、ポリエステ
ル、ポリアミド、ポリエーテル、ポリカプロラクタム、
フッ素化エチレン−プロピレン共重合体、塩素化ポリエ
チレン、クロロスルホン化エチレン、エチレン−酢酸ビ
ニル共重合体、ポリプロピレン、ポリスチレン、スチレ
ン−アクリロニトリル共重合体、ポリ塩化ビニル、ポリ
カーボネート、ポリアセタール、ポリアルキレンオキシ
ド、ポリフェニレンオキシド、ポリスルホン、フッ素樹
脂、およびこれ等のうちから選ばれた少なくとも2種の
ブレンドポリマー等がある。この発明のおいて、重合体
の種類、組成比などは、所望の性能、用途などに応じて
適宜選択することができる。
Polymer The polymer used in this invention includes polyethylene,
Polyethylene oxide, t-4-polybutadiene, polyethylene acrylate, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, polyester, polyamide, polyether, polycaprolactam,
Fluorinated ethylene-propylene copolymer, chlorinated polyethylene, chlorosulfonated ethylene, ethylene-vinyl acetate copolymer, polypropylene, polystyrene, styrene-acrylonitrile copolymer, polyvinyl chloride, polycarbonate, polyacetal, polyalkylene oxide, polyphenylene Examples include oxides, polysulfones, fluororesins, and blend polymers of at least two selected from these. In this invention, the type of polymer, composition ratio, etc. can be appropriately selected depending on desired performance, use, etc.

導電性粒子および添加物 重合体に分散される導電性粒子としては、カーボンブラ
ック、黒鉛、スズ、銀、金、銅などの導電性物質の粒子
、および銀めっき粒子などを用いることができる。
Conductive Particles and Additives As the conductive particles dispersed in the polymer, particles of conductive substances such as carbon black, graphite, tin, silver, gold, copper, and silver-plated particles can be used.

PTC組成物の調製に際して、上記の重合体、導電性粒
子以外に、必要に応じて種々の添加剤を混合することが
できる。そのような添加剤として、例えば、アンチモン
化合物、リン化合物、塩素化化合物、臭素化化合物など
の難燃剤、酸化防止剤、安定剤などがある。
In preparing the PTC composition, in addition to the above-mentioned polymer and conductive particles, various additives can be mixed as necessary. Examples of such additives include flame retardants, antioxidants, stabilizers, etc., such as antimony compounds, phosphorus compounds, chlorinated compounds, and brominated compounds.

このPTC組成物は、その原材料、重合体、導電性粒子
、その他添加剤を所定の割合いで配合・混練して調製さ
れる。
This PTC composition is prepared by blending and kneading the raw materials, polymers, conductive particles, and other additives in predetermined proportions.

混練 この発明において、重合体と導電性粒子との混線に際し
、例えば、ニーダ−および/または2本ロールで重合体
中に導電性粒子を取込ませ、更に、重合体中に導電性粒
子を均一に分散させる。この発明において一段階で混練
することもできるが、二段階に分けて混練することもで
きる。
Kneading In this invention, when mixing the polymer and conductive particles, for example, the conductive particles are incorporated into the polymer using a kneader and/or two rolls, and then the conductive particles are uniformly mixed into the polymer. to be dispersed. In this invention, kneading can be carried out in one stage, but it can also be kneaded in two stages.

この発明において、この二段階混練を、予備混線と本混
線とにわけて行う場合、用いる重合体を少なくとも2種
とし、その重合体と導電性粒子との混線を、各重合体毎
に、その重合体と導電性粒子と予備混練し、次いで各予
備混練物を所定の割合いで本混練することもできる。こ
の発明において予備混練および本混練は、各重合体毎に
、その重合体と導電性粒子とを混練して行われる。重合
体と粒子との配合割合は、目的組成物の粒子含量、重合
体の種類、ニーダ−または2本ロールなどの混線機の種
類などに応じて適宜選択することができる。この発明に
おいて、予備混練および本混練前に粉砕、加熱、混合な
どの前処理をしてもよい。
In this invention, when this two-stage kneading is performed separately into preliminary mixing and main mixing, at least two types of polymers are used, and the mixing between the polymer and the conductive particles is performed separately for each polymer. It is also possible to pre-knead the polymer and conductive particles, and then main-knead each pre-kneaded product in a predetermined ratio. In the present invention, preliminary kneading and main kneading are performed for each polymer by kneading the polymer and conductive particles. The blending ratio of the polymer and particles can be appropriately selected depending on the particle content of the target composition, the type of polymer, the type of mixer such as a kneader or two rolls, and the like. In this invention, pretreatments such as pulverization, heating, and mixing may be performed before preliminary kneading and main kneading.

混線に際する温度は、混練する重合体の融点より高い温
度の温度範囲である。これは、その範囲で、混練する重
合体がゲル化して導電性粒子を均一に分散させることが
できるからである。
The temperature at which the wires are mixed is in a temperature range higher than the melting point of the polymer to be kneaded. This is because within this range, the polymer to be kneaded gels and the conductive particles can be uniformly dispersed.

混線前に重合体の加熱の前処理をする場合、重合体をそ
の融点より高い温度範囲に予め加熱し軟化させた後、導
電性粒子を添加して混練することが好ましい。
When the polymer is pretreated by heating before being mixed, it is preferable to heat the polymer to a temperature range higher than its melting point to soften it, and then add conductive particles and knead it.

この発明において、一段階で混練する場合、混線前に、
前混合、加熱、添加物混入などの前処理を行うことがで
きる。この混練に用いられる装置は、ニーダ−および2
本ロール等の混練機である。
In this invention, when kneading in one step, before mixing,
Pretreatments such as premixing, heating, and addition of additives can be performed. The equipment used for this kneading is a kneader and two
This is a kneading machine such as this roll.

この混練に際する温度は、任意であるが、好ましくは、
用いる重合体の融点より高い温度範囲である。したがっ
て、用いる重合体の種類によってその温度範囲が異なる
。混練に際し予め加熱・軟化させる態様では、用いる重
合体の融点のうち最も高い融点高い温度で混練すること
が好ましい。
The temperature during this kneading is arbitrary, but preferably,
The temperature range is higher than the melting point of the polymer used. Therefore, the temperature range varies depending on the type of polymer used. In the embodiment in which the mixture is heated and softened in advance during kneading, it is preferable to knead at a temperature higher than the highest melting point of the polymers used.

添加剤をPTC組成物に混入させる場合、この添加剤を
混線の前後に、または、混練と同時に添加してもよい。
When an additive is mixed into the PTC composition, the additive may be added before or after mixing, or at the same time as kneading.

PTC素子の調製 この発明においてPTC組成物と電極とを接合してPT
C素子を製造する方法は、通常の方法で行うことができ
る。例えば、PTC組成物をフィルム状に成形し、フィ
ルムの上下に金属箔の電極を熱圧着して積層体を形成し
、この積層体を所定の寸法に切断し、電極表面にリード
線を半田付け、スポット溶接法などで接合してPTC素
子を製造することができる。
Preparation of PTC element In this invention, a PTC composition and an electrode are bonded to form a PTC element.
The C element can be manufactured by a conventional method. For example, a PTC composition is formed into a film, metal foil electrodes are thermocompression bonded to the top and bottom of the film to form a laminate, the laminate is cut to a predetermined size, and lead wires are soldered to the electrode surface. A PTC element can be manufactured by joining by a spot welding method or the like.

熱履歴 この発明の特徴は、混線により得られたPTC組成物を
熱履歴に付すことである。
Thermal History A feature of this invention is that the PTC composition obtained by cross-crossing is subjected to thermal history.

この発明において熱履歴は、加熱および急冷却の工程か
らなり、この熱履歴を一回若しくは複数回繰返してもよ
い。熱履歴の加熱は、混線に用いる重合体のうち融点の
低い重合体の融点近傍の温度に加熱して行われる。好ま
しい加熱温度は、混純に用いる重合体のうち融点の低い
重合体の融点の±20℃の温度範囲である。この温度範
囲に維持、放置する時間は、用いる重合体の種類、組成
などに応じて適宜変更することができるが、例えば、2
〜20分、好ましくは、5〜10分間である。
In this invention, the thermal history consists of heating and rapid cooling steps, and this thermal history may be repeated once or multiple times. The heating of the thermal history is performed by heating to a temperature near the melting point of a polymer having a low melting point among the polymers used for the crosstalk. A preferable heating temperature is within a temperature range of ±20° C. of the melting point of a polymer having a low melting point among the polymers used for mixing and purification. The time for maintaining and leaving in this temperature range can be changed as appropriate depending on the type and composition of the polymer used, but for example,
-20 minutes, preferably 5-10 minutes.

熱履歴の急冷却は、零度以下の温度に、好ましくは、マ
イナス20〜60℃に急激に冷却して行う。この低温状
態に維持する時間は、用いる重合体の種類、組成などに
応じて適宜変更することができるが、例えば、2〜20
分、好ましくは、5〜10分間である。この急冷却は、
例えば、液体窒素、ドライアイス、液体酸素、液体ヘリ
ウムなどを用いて行うことができる。
The rapid cooling of the thermal history is performed by rapidly cooling to a temperature below zero degrees, preferably to -20 to 60 degrees Celsius. The time for maintaining this low temperature state can be changed as appropriate depending on the type and composition of the polymer used, but for example, 2 to 20
minutes, preferably 5 to 10 minutes. This rapid cooling
For example, liquid nitrogen, dry ice, liquid oxygen, liquid helium, etc. can be used.

上記の説明において、この発明の熱履歴は、PTC素子
の調製後に引続いて実施されたが、この発明にお11゛
では、前記のPTC素子の調製前、また・・は1製中に
熱履歴を行うこともできる。
In the above description, the thermal history of the present invention was carried out subsequent to the preparation of the PTC element, but in this invention, the thermal history was carried out before or during the preparation of the PTC element. You can also do a history.

〔作 用〕[For production]

この発明が上記のように構成されているので、下記のよ
うに作用する。
Since this invention is configured as described above, it operates as follows.

この発明における熱履歴のメカニズムは、必ずしも明ら
かではないが、次のように作用するものと考えられる。
Although the mechanism of thermal history in this invention is not necessarily clear, it is thought to work as follows.

熱圧着によりPTC組成物と電極とが巨視的には一応接
合するが、微視的にはPTC組成物と電極との界面では
不均一に接合している。この発明の熱履歴によってその
不均一が解消すると考えられる。さらに、ニーダ−若し
くは2本ロールなどの混練機での混練で導電性粒子は巨
視的には重合体中にほぼ均一に分散されるが、微視的に
はカーボンブラックなどの導電性粒子と重合体との界面
において不均一に接触していると考えられる。加熱によ
って重合体が軟化して導電性粒子と重合体との接触距離
を狭め、急冷却によってマトリックスの重合体が微細に
破断し、その破断片が空隙に入って更にその接触距離を
短縮する。
Although the PTC composition and the electrode are macroscopically bonded to some extent by thermocompression bonding, microscopically they are bonded non-uniformly at the interface between the PTC composition and the electrode. It is believed that the thermal history of this invention eliminates the non-uniformity. Furthermore, when kneaded with a kneader or two-roll kneading machine, the conductive particles are macroscopically dispersed almost uniformly in the polymer, but microscopically they overlap with conductive particles such as carbon black. It is thought that there is non-uniform contact at the interface with the coalescence. Heating softens the polymer and narrows the contact distance between the conductive particles and the polymer, and rapid cooling causes the matrix polymer to break finely, and the broken pieces enter the voids, further shortening the contact distance.

この熱履歴を繰返すことにより微視的にも導電性粒子と
重合体との界面において均一に接触する。
By repeating this thermal history, the conductive particles and the polymer come into even microscopic contact at the interface.

以上の説明はこの発明のよりよい理解のためであり、こ
の発明の範囲を制限するものではない。
The above description is for a better understanding of the invention and is not intended to limit the scope of the invention.

〔実施例〕〔Example〕

この発明を、例示によって具体的に説明する。 This invention will be specifically explained by way of example.

比較例 下記組成のPTC特性を有する物質を調製した。Comparative example A material having PTC properties having the following composition was prepared.

重量% 重合体・・・高密度ポリエチレン     ・・・26
(東洋曹達製、HDPE  5100)エチレン−アク
リル酸共重合体・・・26(エクソン社製、EAA50
00) 導電性粒子・・・カーボンブラック    ・・・47
(キャボット社製スターリングV) 酸化防止剤・・・イルガノックス1010 ・・・ I
PTCPTC組成物を2本ロール(株式会社安田精機制
作所製、191−TM)に装入し、180℃、30分で
混練した。得られたPTC組成物をフィルム状に成形し
、フィルムの上下に厚さ100μmのニッケル箔の電極
を載せ、加熱しながら圧着して電極と組成物を接触し、
圧力をがけながら冷却して接合して積層体を作製し、次
いで10.5a層X10.5厘鳳に切断して厚さ0.4
5+uのPTC素子を製造した。
Weight% Polymer...High density polyethylene...26
(Manufactured by Toyo Soda, HDPE 5100) Ethylene-acrylic acid copolymer...26 (Manufactured by Exxon, EAA50
00) Conductive particles...carbon black...47
(Cabot Sterling V) Antioxidant...Irganox 1010...I
The PTCPTC composition was charged into two rolls (manufactured by Yasuda Seiki Seisakusho Co., Ltd., 191-TM) and kneaded at 180°C for 30 minutes. The obtained PTC composition was formed into a film, nickel foil electrodes with a thickness of 100 μm were placed on the top and bottom of the film, and the electrodes and the composition were brought into contact with each other by pressure bonding while heating.
A laminate was produced by cooling and bonding while applying pressure, and then cut into 10.5 a layer x 10.5 layer to a thickness of 0.4
A 5+u PTC element was manufactured.

この様にして得られたPTC素子1865個について、
室温抵抗を測定した。その結果、平均室温抵抗は48.
67mΩであり、バラツキはσ−4,64である。
Regarding the 1865 PTC elements obtained in this way,
Room temperature resistance was measured. As a result, the average room temperature resistance was 48.
It is 67 mΩ, and the variation is σ-4.64.

実施例1 比較例で得られたPTC素子を、加熱して80℃で10
分間放置し、次いでマイナス40℃へ急冷却し、その温
度で10分間放置し、更に加熱して80℃で5分間放置
し、次いで室温に戻した。
Example 1 The PTC element obtained in the comparative example was heated at 80°C for 10
The mixture was left to stand for a minute, then rapidly cooled to minus 40°C, left at that temperature for 10 minutes, further heated and left at 80°C for 5 minutes, and then returned to room temperature.

得られたPTC素子について室温抵抗を測定した結果、
平均室温抵抗は5mΩだけ下がった。
As a result of measuring the room temperature resistance of the obtained PTC element,
The average room temperature resistance decreased by 5 mΩ.

実施例2 実施例1で得られたPTC素子のうち室温抵抗が46m
Ω以上のPTC素子を、実施例1と同様の熱履歴に付し
た結果、室温抵抗は更に3.5mΩだけ下がった。次い
で、この熱履歴後のPTC素子のうち室温抵抗が46m
Ω以上のPTC素子を、実施例1と同様の熱履歴に付し
た結果、室温抵抗は更に2.OmΩだけ下がった。その
結果、1792個のPTC素子について、平均室温抵抗
は43.4mΩであり、バラツキはσ−2,66であっ
た。
Example 2 Among the PTC elements obtained in Example 1, the room temperature resistance was 46 m
As a result of subjecting the PTC element of Ω or more to the same thermal history as in Example 1, the room temperature resistance further decreased by 3.5 mΩ. Next, the PTC element after this thermal history has a room temperature resistance of 46 m.
As a result of subjecting the PTC element of Ω or more to the same thermal history as in Example 1, the room temperature resistance was further reduced to 2. It went down by OmΩ. As a result, the average room temperature resistance of 1792 PTC elements was 43.4 mΩ, and the variation was σ-2.66.

〔発明の効果〕〔Effect of the invention〕

この発明によって次の効果を得ることができる。 The following effects can be obtained by this invention.

実施例で実証されるように、従来法によるPTC索子に
比べて、室温抵抗の小さくかつバラツキの少ないPTC
素子を得ることができる。
As demonstrated in the examples, PTC has lower room temperature resistance and less variation than PTC cords made by conventional methods.
element can be obtained.

Claims (1)

【特許請求の範囲】 1、少なくとも2枚の金属電極と、その電極と接合した
PTC組成物とからなるPTC素子の製造法であつて、
該PTC組成物が少なくとも1種の重合体及び導電性粒
子を混練して該重合体中に該粒子を均一に分散してなる
ものであり、PTC組成物を、混練に用いる重合体のう
ち融点の低い重合体の融点近傍の温度に加熱する工程お
よび零度以下の温度に急冷却する工程に付することを特
徴とするPTC素子の製造法。 2、融点の低い重合体の融点近傍の温度が、融点の低い
重合体の融点±20℃である、特許請求の範囲第1項記
載のPTC素子の製造法。 3、マイナス20〜60℃に急冷却する、特許請求の範
囲第1項または第2項記載のPTC素子の製造法。 4、該加熱工程および該急冷却工程の熱履歴を複数回繰
返す、特許請求の範囲第1項乃至第3項のいずれかに記
載のPTC素子の製造法。
[Claims] 1. A method for manufacturing a PTC element comprising at least two metal electrodes and a PTC composition bonded to the electrodes, comprising:
The PTC composition is made by kneading at least one kind of polymer and conductive particles and uniformly dispersing the particles in the polymer. 1. A method for producing a PTC element, which comprises heating the polymer to a temperature near the melting point of the polymer and rapidly cooling it to a temperature below zero. 2. The method for producing a PTC element according to claim 1, wherein the temperature near the melting point of the low melting point polymer is ±20° C. of the melting point of the low melting point polymer. 3. A method for manufacturing a PTC element according to claim 1 or 2, which comprises rapid cooling to -20 to 60°C. 4. The method for manufacturing a PTC element according to any one of claims 1 to 3, wherein the thermal history of the heating step and the rapid cooling step is repeated multiple times.
JP28546686A 1986-11-29 1986-11-29 Manufacture of ptc device Pending JPS63138701A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28546686A JPS63138701A (en) 1986-11-29 1986-11-29 Manufacture of ptc device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28546686A JPS63138701A (en) 1986-11-29 1986-11-29 Manufacture of ptc device

Publications (1)

Publication Number Publication Date
JPS63138701A true JPS63138701A (en) 1988-06-10

Family

ID=17691878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28546686A Pending JPS63138701A (en) 1986-11-29 1986-11-29 Manufacture of ptc device

Country Status (1)

Country Link
JP (1) JPS63138701A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212760A (en) * 1988-06-30 1990-01-17 Matsushita Electric Ind Co Ltd Manufacture of ptc device for cell

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6159701A (en) * 1984-08-31 1986-03-27 出光興産株式会社 Method of producing polymer positive temperature coefficientresistor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6159701A (en) * 1984-08-31 1986-03-27 出光興産株式会社 Method of producing polymer positive temperature coefficientresistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212760A (en) * 1988-06-30 1990-01-17 Matsushita Electric Ind Co Ltd Manufacture of ptc device for cell

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