JPS63137997U - - Google Patents

Info

Publication number
JPS63137997U
JPS63137997U JP2906987U JP2906987U JPS63137997U JP S63137997 U JPS63137997 U JP S63137997U JP 2906987 U JP2906987 U JP 2906987U JP 2906987 U JP2906987 U JP 2906987U JP S63137997 U JPS63137997 U JP S63137997U
Authority
JP
Japan
Prior art keywords
heat
electronic component
tongue piece
lead terminal
generating electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2906987U
Other languages
English (en)
Other versions
JPH0343756Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2906987U priority Critical patent/JPH0343756Y2/ja
Publication of JPS63137997U publication Critical patent/JPS63137997U/ja
Application granted granted Critical
Publication of JPH0343756Y2 publication Critical patent/JPH0343756Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Details Of Resistors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第1図〜第3図はこの考案の一実施例を示すも
のであり、第1図、第2図はいずれも要部の斜視
図、第3図A,Bは発熱型電子部品の取り付け作
業を示す要部断面図、第4図はこの考案の第2実
施例を示すものであり、第4図Aは斜視図、第4
図Bは基板に装着する前のFPC板の斜視図、第
5図はこの考案のさらに変形を加えた実施例を示
す要部斜視図、第6図はこの考案の他の実施例を
示すものであり、第6図Aは斜視図、第6図Bは
側面図、第7図は従来例を示す断面図である。 1……発熱型電子部品、2……リード端子、3
……導電部、4……FPC板、7……基板、8…
…舌片、9……リブ、11,16……隔壁、19
b……側壁(基板)。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発熱型電子部品に設けるリード端子と、このリ
    ード端子を支持するリブと、このリブを立設する
    基板と、前記リード端子を電気的接続する導電部
    が設けられた舌片を一体形成するFPC板と、前
    記発熱型電子部品と間隔を有すると共に前記舌片
    が当接し、かつ前記発熱型電子部品と前記舌片と
    の間で前記基板に立設する隔壁とを有することを
    特徴とする発熱型電子部品の取付装置。
JP2906987U 1987-02-28 1987-02-28 Expired JPH0343756Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2906987U JPH0343756Y2 (ja) 1987-02-28 1987-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2906987U JPH0343756Y2 (ja) 1987-02-28 1987-02-28

Publications (2)

Publication Number Publication Date
JPS63137997U true JPS63137997U (ja) 1988-09-12
JPH0343756Y2 JPH0343756Y2 (ja) 1991-09-12

Family

ID=30832621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2906987U Expired JPH0343756Y2 (ja) 1987-02-28 1987-02-28

Country Status (1)

Country Link
JP (1) JPH0343756Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612202B2 (en) * 2000-12-15 2003-09-02 Siemens Vdo Automotive Corporation Mechatronics sensor

Also Published As

Publication number Publication date
JPH0343756Y2 (ja) 1991-09-12

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