JPS63136656A - 電子回路パツケ−ジの放熱構造 - Google Patents
電子回路パツケ−ジの放熱構造Info
- Publication number
- JPS63136656A JPS63136656A JP61283245A JP28324586A JPS63136656A JP S63136656 A JPS63136656 A JP S63136656A JP 61283245 A JP61283245 A JP 61283245A JP 28324586 A JP28324586 A JP 28324586A JP S63136656 A JPS63136656 A JP S63136656A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- tube
- lsis
- cooling
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61283245A JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61283245A JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63136656A true JPS63136656A (ja) | 1988-06-08 |
| JPH0573268B2 JPH0573268B2 (enExample) | 1993-10-14 |
Family
ID=17662967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61283245A Granted JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136656A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992994A (ja) * | 1995-09-21 | 1997-04-04 | Asia Electron Inc | 冷却板 |
| WO2013011636A1 (ja) * | 2011-07-20 | 2013-01-24 | ダイキン工業株式会社 | 冷媒配管の取付構造 |
| EP2122745B1 (de) * | 2007-02-22 | 2014-09-03 | Rohde & Schwarz GmbH & Co. KG | Hochlastkoppler |
-
1986
- 1986-11-28 JP JP61283245A patent/JPS63136656A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992994A (ja) * | 1995-09-21 | 1997-04-04 | Asia Electron Inc | 冷却板 |
| EP2122745B1 (de) * | 2007-02-22 | 2014-09-03 | Rohde & Schwarz GmbH & Co. KG | Hochlastkoppler |
| WO2013011636A1 (ja) * | 2011-07-20 | 2013-01-24 | ダイキン工業株式会社 | 冷媒配管の取付構造 |
| US9784506B2 (en) | 2011-07-20 | 2017-10-10 | Dakin Industries, Ltd. | Refrigerant pipe attachment structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573268B2 (enExample) | 1993-10-14 |
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