JPS63136551A - Removing device for substrate - Google Patents

Abstract

PURPOSE:To extract a substrate positively and automatically without damaging the substrate and a conductor pin implanted to the substrate by arranging an extruding jig with an extruding pin corresponding to a pin inserting hole for a pallet and upwardly moving the extruding jig in at least two stages. CONSTITUTION:Extruding pins 31 for an extruding jig 30 on a susceptor 21 are inserted into each pin inserting hole H of a corresponding pallet P by upwardly moving the susceptor 21 disposed to the lower section of a carrying path 210 by a working mechanism 20, and substrates 51 on the pallet P are pushed up slightly. The side section of the substrate 51 under the state in which the substrate is levilated a little from the upper section of the pallet P is held by an extracting arm 41 for an extracting mechanism 40, and the substrate 51 is lifted upward as it is and shifted onto an external carrying path 220, thus automatically taking out the substrate 51, to which a large number of conductor pins 52 are implanted, positively to the outside of a device.

Description

[Detailed Description of the Invention] (Industrial Application Field) The undeveloped IJI is a so-called pin-grid array in which a large number of conductor pins are embedded in a board, and is used in the manufacture of boards for mounting electronic components. There are information regarding equipment.
In particular, the present invention relates to a board removal device that safely and reliably takes out the electronic component mounting board from a pallet being conveyed on a conveyance path, and also cleans bottle insertion holes formed in the pallet.

(Conventional technology) A board for mounting electronic components called a bin grid array is
A conductor bottle having conductivity is installed in each of the many through holes etc. of a board having a conductive layer, and #5a is placed on the board.
This is used to mount electronic components on a large board while ensuring electrical continuity between the electronic parts and the conductor layer of another large board called a motherboard using the conductor pins described above. Normally, the conductor pins must be installed at right angles to the substrate, so the substrate and the conductor pins cannot be formed integrally, so this type of electronic component mounting substrate is called a pin grid array.

After a flat substrate having a conductor layer is formed, conductor pins are implanted in through holes of the substrate, and the conductor pins are fixed by half-F openings or the like.

However, in recent years, as the demand for higher density electronic components mounted on electronic component mounting boards called bin grid arrays and higher density mounting on large boards has increased, the mounting of conductor pins has also become more difficult. Extremely high density is required.

For this reason, the conductor pins have to be mechanically implanted into the substrate. Particularly in recent years, where there has been an increasing demand for small-volume production of other types of bin grid arrays, the work of embedding conductor pins on the board has no choice but to be done mechanically. It is coming.

In order to meet such demands, the inventors developed an automatic manufacturing device as shown in FIG. 9 for manufacturing a board (50) for mounting electronic components by automatically implanting conductor pins into the board. (
200) has already been proposed. This automatic manufacturing equipment (2
00), while sequentially conveying a pallet (P) as shown in Fig. 8, which has a large number of pin insertion holes (II) corresponding to the conductor bin insertion points such as through holes of the board, on its plurality of conveyance paths. , the electronic component mounting board (50) is automatically and continuously manufactured. That is, this automatic manufacturing device (ZGO) for the electronic component mounting board (50) automatically inserts a large number of required conductor pins into the pin insertion holes (II) of the pallet (P) being transported. Check if the insertion is insufficient, and if it is insufficient, supply the corresponding conductor pin again, and supply the specified board to the pallet (P) in which the conductor pin is completely inserted. By pressing this against the pallet (P), the conductor pins are automatically planted on the board.

In such an automatic manufacturing device (20 ports) for electronic component mounting substrates (50), the substrate on which the conductor pins are implanted must be taken out of the device. What is needed for this purpose is the substrate removal device according to the present invention. However, in order to mechanically take out a board on which conductor pins are embedded, the following conditions must be met.

■Normally, the board itself is about 1.5mm thin.
Sometimes it is made of plastic,
It is not possible to increase the clamping force to take this out.

(1) Since the board is integrated with the conductor pins by being pressed against the pallet (P), it is generally in close contact with the surface of the pallet (P). In order to take this out from the pallet (P) with a small clamping force, some ingenuity is required.

■The pallet (P) is the automatic manufacturing device (200) mentioned above.
Since it circulates inside the
) If it enters the pin insertion hole (11) of the pallet (P), it will be cycled many times and only defective products will be produced from the pallet (P). The inside of each pin insertion hole (11) must be constantly cleaned and kept free of foreign matter.

■Since the conductor pins are extremely thin, the pallet (P)
) The conductor pin must be pulled straight upward from the pin insertion hole (11).

The inventors have not been able to find a device for taking out a substrate that satisfies the various conditions described above in the prior art.
``As a result of intensive research to develop a device that could solve this problem, we found that the pin insertion holes (H) of the pallet (P) that support the board with the conductor pins implanted were placed below the pallet (P). It is newly discovered that by arranging an extrusion jig having an extrusion pin corresponding to the extrusion jig and moving the extrusion jig upward in at least two stages, it is possible to complete a device that satisfies each of the above conditions. They discovered this and completed the present invention.

(Problems to be solved by the invention) The present invention has been made based on the above circumstances.
The problem to be solved is the satisfaction of the above-mentioned conditions (1) to (3) when taking out a board on which conductor pins are implanted.

An object of the present invention is to provide a simple structure of a board removal device that can reliably and automatically increase the number of boards without damaging the board or the conductor pins implanted therein. The aim is to provide the following information. Another object of the present invention is to automatically remove foreign matter that has entered the pin insertion hole (11) of the pallet (P) while taking out the board. An object of the present invention is to provide a substrate removal device.

(Means for Solving the Problems) In order to solve the above problems, the means taken by the present invention are explained with reference to FIG. 1 and Section 2 corresponding to the embodiment. Pallet (P) with conductor pins (52) planted
A substrate removal device for taking out the upper substrate (51) from the conveyance path (210), the device being disposed below the conveyance path (210) and disposed on the pallet (P).
The conveyance path (21
A support plate (10) that is moved up and down in multiple steps relative to 0)
and is removably supported on this support plate (10).

A large number of push-out pins (31) corresponding to the pin insertion holes (11) of the pallet (P) being transported on the transport path (210).
An extrusion jig (30) is arranged on the upper side of the conveyance path (P) opposite to this extrusion jig (30), and the extrusion jig (30)
0) The pallet (P) being conveyed above and the operating mechanism (
20), a take-out mechanism (40) that takes out the board (51) on which the conductor pins (52) are implanted out of the device using the take-out arm (41).
(100) J.

That is, in this substrate removal device (100), when each pallet (P) being conveyed on the conveyance path (210) of the automatic manufacturing device (2H) stops at a predetermined position,
8. A support stand (
21) The push-out pin (31) of the push-out Pd tool (30) on this support base (21) or each pin insertion hole ( It is inserted into the board (It) and placed on the pallet (P).
51) by slightly pushing up this pallet (P
) The board (51), which is slightly lifted from the top, is held by the take-out arms (41) of the take-out mechanism (40) on the side, and the board (51) is lifted upwards and transferred to the outer transport path. By moving the board (220) upward, the board (51) on which a large number of conductor pins (52) are implanted can be reliably and automatically extended out of the device.

(Operation of the Invention) Next, the operation of the substrate removal device (+00) of the present invention employing the above means will be explained.

First, a large number of conductor bins (52) are inserted into each pin insertion hole (H), and the board (5I) is kept fitted to the head of each of these conductor bins (52). ,
Each pallet (P) is conveyed toward the substrate removal device 7Z (100) while supporting a large number of conductor bins (52) or implanted substrates (51) on the conveyance path (210).

(Refer to the pallet (P) located at the upper left of the figure of 1st [A]) The conveyance path (2
]0) (Yo, the pallet located in the center of Figure 1 (
When it reaches the position δ of P,), it is stopped by an automatic position detection means (not shown). As a result, the substrate removal device (100
) actuating mechanism (20) performs the first stage of upward movement relative to the support base (21). In other words, this support stand (2
1) The tip of each extrusion pin (31) of the extrusion jig (30) supported on
) The cylinder (23) of the actuating mechanism (20) is placed on the support base (21) so that it stops midway through the pin insertion hole (H) of the pin insertion hole (H) and is slightly floating on the board (51) or pallet (P). It pushes up.

When the board (51) on the pallet (P) is in the state shown in Fig. 3, the take-out arm (4) of the take-out mechanism (40)
1) moves downward, and as shown in Figure 4, the board (51
) on both the left and right sides. At this time, a protrusion (42) is formed on the inner part facing the pair of the take-out arms (41).
is formed, this protrusion (42) or the substrate (51)
The take-out arm (41) reliably clamps the substrate (51) even if it does not have that much clamping force. That is, even if each walking arm (41) does not directly contact the side edge of each substrate (51),
2 & plate (51), the extraction arm (4)
1) will not damage the substrate (51).

The take-out arm (
41) moves upward in the same state as shown in FIG. At the same time or after this, this board (5
The operating mechanism (20) of the board removal device fi (100) located under the pallet (P) that was supporting 1) performs the second stage of upward movement with respect to the support base (21). It is. That is, the tip of each extrusion pin (31) of the extrusion jig (30) supported on this support stand (21) is further moved upward, and as shown in FIG. It is located at the upper end of the pin insertion hole (I) and exposed on the pallet (p). At this time, due to some reason,
As shown in Figure 6, some of the pin insertion holes (H) of the pallet (P) contain conductor bins (52) that are in an inconvenient state (1, for example, bent) with respect to the board (51). In this case, it is not possible to remove the conductor bottle (52) by simply lifting the board (51) into the air with the removal arm (41), but each extrusion pin (31) of the extrusion jig (0) cannot be removed.
), as described above, and if you do the second step so that its tip is exposed on the pallet (P), it will be bent in the pin insertion hole (]1). The conductor bottle (52) is pushed upwards. This means that
The same applies not only to the bent conductor bottle (52) but also to foreign objects that have entered the pin insertion holes (11) of the pallet (P) for some reason. That is, by the second stage upward movement of this extrusion jig (30), the pallet (P)
The inside of each pin insertion hole (II) is completely cleaned. The bent conductor bottle (52) and foreign matter discharged onto this pallet (P) are removed from the machine by high pressure air from the air nozzle (43) as shown in Figure 7 or by a brush (not shown). .

The corresponding board (51) is also marked as a defective product and removed.

On the other hand, if the board (51), which is a good product taken out from the pallet (P) as described above, is completed by fitting the conductor bin (52) to the board (51), this is the one for mounting electronic components. The substrate (50) is transferred onto the outward conveyance path (220) shown in the first factor by the take-out arm (41) of the take-out mechanism (40). This outward conveyance path (220) is connected to the completed electronic component mounting board (50).
) are transported to the next process such as boxing and inspection. In addition, the conveyor path (21(1)) is circulated to the next process without any installation (see pallet (P) at the lower right of Figure 1). will be described in detail based on the embodiment shown in the drawings.

(Example) FIG. 1 is a perspective view showing a part of the automatic manufacturing apparatus (200) shown in FIG. The overall configuration of the substrate removal device (+00) according to the present invention is shown based on the outer transport path (220) disposed perpendicular to the transport path (210).

The substrate removal device (100) is located below the conveyance path (210), and when moved up and down by the actuation mechanism (20),
The press rL detachably supported on this support plate (10):
ff+Jjl, <30) and Kono extrusion #? jL-
(3[]) D and a protrusion (42) disposed on the upper side of the m feed path (210) to face each other. This board I pleasure device 22 (too) corresponds to a predetermined stopping position of a pallet (P) supported by a large number of conductor pins (52) inserted into each pin insertion hole (II). When the pallet (P) stops at a predetermined position, it starts operating, and after the take-out arm (41) of the board removal bag m (100) takes out the board (51). When the pallet is oriented, the conveyance path (210) is operated again to wait for the next pallet (P) to arrive.

The support plate (10) supports an extrusion jig (30), which will be described later, in a fixed position and horizontally using its positioning pin (11). It is something that is moved down. The operating mechanism (2o) supports the support plate (10) horizontally and movably up and down by a pair of guide members (22) provided on the support base (21), and also supports the support plate (10) horizontally and vertically. Lower cylinder (23
) to move the support plate (lO) up and down as described above. The cylinder (23) moves the support plate (10) up in the following two steps, and also moves the support plate (10) down all at once from the upper end to the lower end. That is, this cylinder (23) has a first stage of upward movement in which the tip of the extrusion pin (31) provided on the extrusion jig (30) stops halfway inside the pin insertion hole (11) of the pallet (P). ,
The extrusion jig (
The second step is to expose the ejector pin (31) to the pallet (P) so that the tip of the ejector pin (31) of 30) is positioned up to the upper end of the pin insertion hole (11) of the pallet (P). Two types of upward movements of the eyes are performed in this order.

The extrusion jig (30) is formed to correspond to the pallet (P) being conveyed on the conveyance path (21D), and has holes on its top surface for each pin insertion hole (H) of the pallet (P). It has a corresponding number of extrusion pins (31). That is,
As shown in FIG. 3 and m4UA, this extrusion jig (30) is mounted on a support base (21) by a cylinder (23).
When the opening (2) of the conveyance path (210)
10) and facing the pallet (P) exposed downward through the pallet (P), each of its extrusion pins (31) is erected so as to completely correspond to each pin insertion hole (I) of the pallet (P). . Therefore, if the type of pallet (P) conveyed on the conveyance path (210) is different, the type of extrusion jig A (30) can be changed accordingly.

A take-out mechanism (40) disposed on the upper side of the conveyance path (210) facing the extrusion jig (30) is provided with at least It has a pair of take-out arms (41), ie.

This take-out mechanism (40) extends each take-out arm (41) onto the conveyance path (210) when or before the first stage of upward movement of the support plate (10) is completed, and then The substrate (51) is held between the respective take-out arms (41) and carried out onto the outer transport path (220). Sea fences for the movement of each of these take-out arms (41) are set to correspond to the movements of each cylinder (23) and conveyance path (210).

In addition, each extraction arm (
As shown in FIGS. 2 and 3, protrusions (42) are formed on the inside of each of the protrusions (41) to face each other. As shown in FIG. 3, each of these protrusions (42) is connected to the pallet CP) at the end of the first stage of upward movement of the support plate (10).
A gap is formed between the conveyance path (210) and the conveyance path (210), and the gap is made large enough to fill this gap. When both ends of the conveyance path (210) floating above the pallet (P) are held between the respective take-out arms (41),
Each protrusion (42) is engaged with the lower surface of the conveyance path (210).

In addition, in the embodiment shown in FIG. 1, an embodiment in which two conveyance paths (210), that is, electronic component mounting boards (50) are placed on one pallet (P) is not illustrated. Alternatively, each pallet (P) may be such that one or three or more electronic component mounting boards (50) are placed thereon at the same time.

(Effect of the invention) As detailed above, in unexploded 11, as exemplified in the above embodiment, "a pallet (P) in which a large number of conductor pins (52) are implanted"
Substrate removal by taking out the upper substrate (51) from the transport path (210)! The pallet (P) is located at the lower side of the conveyance path (210).
The conveyance path (21
A support plate (10) that is moved up and down in multiple steps relative to 0)
And, it is supported on this support plate (10) in a detachable and convoluted manner.

A large number of push-out pins (31) corresponding to the pin insertion holes (II) of the pallet (P) being transported on the transport path (210)
an extrusion jig (30) having
It is arranged above the conveyance path (P) opposite to the conveyance path (2).
10) In conjunction with the pallet (P) and the actuation mechanism (20) that are being conveyed above.

A take-out mechanism (4) that takes out the board (51) on which the conductor bottle (52) is implanted out of the device using its take-out arm (41).
Its characteristic lies in the fact that it is composed of 0) and .
A substrate (51) and conductor pins (52) implanted therein.
) without causing damage to the 2! Board removal device (100) that can reliably and automatically take out the board (51)
can be provided with a simple configuration.

Further, according to the substrate removal device (100) according to the present invention,
While taking out the board (51) as described above,
Foreign matter that has entered the pin insertion hole (H) of the bullet (P) can be automatically cleaned each time.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the substrate removal device according to the present invention, and Fig. 2 is a partially enlarged longitudinal section taken along the line ■-■ in Fig. 1, showing a state in which the support plate does not move upward in the first stage. The top view and Figure 3 are ■-■ in Figure 1 showing the support plate in the first stage of upward movement.
FIG. 4 is a sectional view showing the IE with the substrate held between the ejection arms; FIG. 5 is a sectional view showing the IE with the ejection arm lifting the substrate; FIG.
The figure is a sectional view showing a state in which a foreign object such as a bent conductor pin is inserted into the pin insertion hole, FIG. 7 is a sectional view corresponding to FIG. 8
The figure is an enlarged perspective view of a pallet, No. 9 [71 is a perspective view of an automatic manufacturing apparatus for electronic component mounting boards, and FIG. 10 is a perspective view of a completed electronic component Ns Sadagawa board seen from below. Explanation of symbols 100...Substrate removal device, 10...Support plate, 11
...Positioning pin, 20...Operating mechanism, 21...
Support stand, 23... cylinder, 30... extrusion jig,
31... Push-out pin, 40... Take-out mechanism, 41...
Removal arm, 42...Protrusion, 50...P1 [Sub component mounting board, 51... Board, 52...Conductor pin, 2
00...Automatic manufacturing equipment for electronic component mounting boards, 21
0...Conveyance path, P...Pallet, H...Pin insertion hole. that's all

Claims (1)

[Claims] 1) A board removal device for taking out a board on a pallet on which a large number of conductor pins are implanted from a conveyance path thereof, the device being disposed below the conveyance path and capable of controlling the movement of the pallet. a support plate that is moved up and down in multiple stages with respect to the conveyance path by an actuation mechanism that is linked to the conveyance path; An extrusion jig having a corresponding number of extrusion pins, and a conductor pin disposed above the conveyance path opposite to the extrusion jig in conjunction with the pallet conveyed on the conveyance path and the operating mechanism. and a take-out mechanism for taking out the substrate implanted with the substrate to the outside of the device using the take-out arm. 2) The vertical movement of the support plate includes a stage in which the tip of the extrusion pin of the extrusion jig supported on the support plate stops midway within the pin insertion hole of the pallet, and a further upward movement from the midway stop stage. 2. The substrate removing device according to claim 1, further comprising two steps: exposing the tip of the ejector pin onto the pallet. 3) The ejecting arm of the ejecting mechanism has a protrusion on its mutually opposing inner portions that engages with the lower side of the edge of the substrate. The substrate removal device according to item 2.