JPS63136365U - - Google Patents

Info

Publication number
JPS63136365U
JPS63136365U JP2743987U JP2743987U JPS63136365U JP S63136365 U JPS63136365 U JP S63136365U JP 2743987 U JP2743987 U JP 2743987U JP 2743987 U JP2743987 U JP 2743987U JP S63136365 U JPS63136365 U JP S63136365U
Authority
JP
Japan
Prior art keywords
hill
concave
solder
display device
led display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2743987U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2743987U priority Critical patent/JPS63136365U/ja
Publication of JPS63136365U publication Critical patent/JPS63136365U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP2743987U 1987-02-27 1987-02-27 Pending JPS63136365U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2743987U JPS63136365U (zh) 1987-02-27 1987-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2743987U JPS63136365U (zh) 1987-02-27 1987-02-27

Publications (1)

Publication Number Publication Date
JPS63136365U true JPS63136365U (zh) 1988-09-07

Family

ID=30829468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2743987U Pending JPS63136365U (zh) 1987-02-27 1987-02-27

Country Status (1)

Country Link
JP (1) JPS63136365U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291905A (ja) * 2000-04-11 2001-10-19 Nichia Chem Ind Ltd 光半導体素子
JP2011044752A (ja) * 2010-12-02 2011-03-03 Nichia Corp 光半導体素子の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291905A (ja) * 2000-04-11 2001-10-19 Nichia Chem Ind Ltd 光半導体素子
JP4677653B2 (ja) * 2000-04-11 2011-04-27 日亜化学工業株式会社 光半導体素子
JP2011044752A (ja) * 2010-12-02 2011-03-03 Nichia Corp 光半導体素子の製造方法

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