JPS63136327U - - Google Patents
Info
- Publication number
- JPS63136327U JPS63136327U JP2818987U JP2818987U JPS63136327U JP S63136327 U JPS63136327 U JP S63136327U JP 2818987 U JP2818987 U JP 2818987U JP 2818987 U JP2818987 U JP 2818987U JP S63136327 U JPS63136327 U JP S63136327U
- Authority
- JP
- Japan
- Prior art keywords
- wafer holder
- reaction tube
- cylindrical
- wafer
- etch tunnel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001020 plasma etching Methods 0.000 claims description 3
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図ａは本考案の円筒型プラズマエツチング
装置の第１の実施例の断面図、第１図ｂは同側面
図、第２図ａは本考案の第２の実施例を示す断面
図、第２図ｂは同平面図、第３図ａは従来の円筒
型プラズマエツチング装置の断面図、第３図ｂは
同側面図である。
１１，２１……反応管、１２，２２……電極板
、１３，２３……エツチトンネル、１４，２４…
…ウエハーホルダ、１５，２５……ウエハー、１
６，２６……ガス導入管、１７，２７……排気管
、１８，２８……蓋体。
FIG. 1a is a sectional view of a first embodiment of a cylindrical plasma etching apparatus of the present invention, FIG. 1b is a side view of the same, and FIG. 2a is a sectional view of a second embodiment of the present invention. FIG. 2b is a plan view of the same, FIG. 3a is a sectional view of the conventional cylindrical plasma etching apparatus, and FIG. 3b is a side view of the same. 11, 21... Reaction tube, 12, 22... Electrode plate, 13, 23... Etch tunnel, 14, 24...
...Wafer holder, 15, 25...Wafer, 1
6, 26... Gas introduction pipe, 17, 27... Exhaust pipe, 18, 28... Lid body.
Claims (1)
エツチヤントとを分離する同筒状エツチトンネル
と、該円筒状エツチトンネル内に挿入されるウエ
ハー搭載用ウエハーホルダとを有し、ウエハーホ
ルダとエツチトンネルの内面との間を一定間隔に
保つて該ウエハーホルダを前記反応管の蓋体に保
持させたことを特徴とする円筒型プラズマエツチ
ング装置。 It has a reaction tube, a cylindrical etch tunnel installed in the reaction tube to separate plasma and etchant, and a wafer holder for mounting a wafer inserted into the cylindrical etch tunnel. A cylindrical plasma etching apparatus characterized in that the wafer holder is held by the lid of the reaction tube with a constant distance between the wafer holder and the inner surface of the wafer holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818987U JPS63136327U (en) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818987U JPS63136327U (en) | 1987-02-27 | 1987-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136327U true JPS63136327U (en) | 1988-09-07 |
Family
ID=30830920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2818987U Pending JPS63136327U (en) | 1987-02-27 | 1987-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136327U (en) |
-
1987
- 1987-02-27 JP JP2818987U patent/JPS63136327U/ja active Pending