JPS63135452A - Sealing resin material - Google Patents
Sealing resin materialInfo
- Publication number
- JPS63135452A JPS63135452A JP28241486A JP28241486A JPS63135452A JP S63135452 A JPS63135452 A JP S63135452A JP 28241486 A JP28241486 A JP 28241486A JP 28241486 A JP28241486 A JP 28241486A JP S63135452 A JPS63135452 A JP S63135452A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- filler
- sealing
- sealing resin
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 title claims abstract description 32
- 238000007789 sealing Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 title claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 230000003287 optical effect Effects 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体チップを塔載するプラスチックパッケ
ージの封止用樹脂材に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin material for sealing a plastic package on which a semiconductor chip is mounted.
従来の技術
従来の半導体チップ塔載用プラスチックパッケージの封
止樹脂材は、ベースレジン（エポキシ系）充填剤である
フィラー、さらに、遮光剤、硬化剤。Conventional technology The sealing resin material of conventional plastic packages for mounting semiconductor chips includes a base resin (epoxy type) filler, a light shielding agent, and a hardening agent.
硬化促進剤、難燃剤、接着剤および離型剤等から溝成さ
れている。The groove is made of a curing accelerator, flame retardant, adhesive, mold release agent, etc.
なかでも、フィラーとして用いられているシリカは、天
然の大きな塊を粉砕して、数μｍ−数１００μｍの直径
のもの得、これを適当に組合わせたもの、天然のシリカ
を一担溶融させたのち固化させ、これを粉砕したもの、
あるいは、人工的に合成したものなどが主流である。Among these, the silica used as a filler is obtained by crushing large natural lumps to obtain diameters of several μm to several 100 μm, and combining them appropriately, or by melting a single layer of natural silica. It is then solidified and crushed,
Alternatively, artificially synthesized materials are the mainstream.
ところで、これらのシリカは、いづれも無定形をしてい
る。また最近では製法に工夫金加えて球形にしたものも
ある。By the way, all of these silicas are amorphous. Recently, some innovations have been added to the manufacturing process to make them spherical.
発明が解決しようとする問題点
従来技術により得られたフィラー（シリカ）を用いて混
合したエポキシ樹脂中から、遮光剤（カーボンブラック
）を除き、光を透過させる目的等に使われるプラスチッ
ク板を成形した場合、上記のようにフィラーが無定形で
あるために、一方の面から入射した光の吸収や乱反射が
生じる。したがって入射した光を他方の面まで高効率で
透過させることは期待できない。このことから明らかな
ように、フィラーとしてノリ力を用いた樹脂を光応用半
導体装置の封止間脂材として使用することはできない。Problems to be solved by the invention A plastic plate used for the purpose of transmitting light is formed by removing the light shielding agent (carbon black) from an epoxy resin mixed with a filler (silica) obtained by the prior art. In this case, since the filler is amorphous as described above, light incident from one surface is absorbed or diffusely reflected. Therefore, it cannot be expected that the incident light will be transmitted to the other surface with high efficiency. As is clear from this, a resin using glue force as a filler cannot be used as a sealing adhesive material for optical semiconductor devices.
例えば、光による情報消去型半導体チップを塔載した半
透明窓板等には適用できないことを意味している。For example, this means that it cannot be applied to a translucent window plate on which a semiconductor chip that erases information by light is mounted.
問題点を解決するだめの手段
本発明は、上記の問題点を排除できる封止用樹脂材を提
供するものであり、本発明の封止用樹脂材は、熱硬化性
または熱可塑性樹脂に、フレーク状のシリカを充填剤と
して混合したものである。Means for Solving the Problems The present invention provides a sealing resin material that can eliminate the above problems, and the sealing resin material of the present invention comprises a thermosetting or thermoplastic resin, It is a mixture of flaky silica as a filler.
作用
本発明の封止用樹脂材では、フレーク状のシリカが配向
配列し、入射する光の乱反射が減少する。Function: In the sealing resin material of the present invention, flaky silica is aligned and diffused reflection of incident light is reduced.
また、光の入射面と平行な方向の熱膨張率も小さくなる
。Furthermore, the coefficient of thermal expansion in the direction parallel to the light incident plane is also reduced.
実施例
以下に本発明の封止用樹脂材の充填剤となるフィラーの
製法を第１図〜第３図を参照して詳しく説明する。先ず
、第１図で示すように、ポット１の中に入れたシリカ２
を溶融させ、この溶融シリカを加熱された状態にあるア
ルミナセラミック等の高融点、スリット板３全通してシ
リカの薄板４を作る。EXAMPLES Below, a method for producing a filler which is a filler for a sealing resin material of the present invention will be explained in detail with reference to FIGS. 1 to 3. First, as shown in Figure 1, silica 2 placed in pot 1
A thin plate 4 of silica is made by melting this molten silica and passing it through the slit plate 3 using a high melting point material such as heated alumina ceramic.
この時の温度は１５００’Ｃ以上とし、雰囲気はアルゴ
ン等の希ガス６を用いる。なお、シリカの薄板３は、溶
融したシリカ２が溜められているポット１の上部から導
入される希ガス６でシリカを加圧し、高融点スリット板
３のスリットの幅で規定される厚みでシリカを押し出す
ことによって形成される。ところで、スリットの幅Ｗは
１０〜１００μｍ程度に設定しておき、シリカの薄板４
の厚みがスリットの幅Ｗとほぼ等しい１０〜１００μｍ
の厚みとなるようにする。The temperature at this time is 1500'C or more, and the atmosphere is a rare gas 6 such as argon. Note that the silica thin plate 3 is made by pressurizing the silica with a rare gas 6 introduced from the upper part of the pot 1 in which molten silica 2 is stored, and forming the silica to a thickness determined by the width of the slit of the high melting point slit plate 3. formed by extruding. By the way, the width W of the slit is set to about 10 to 100 μm, and the thin silica plate 4
The thickness of the slit is approximately equal to the width W of the slit, 10 to 100 μm.
The thickness should be as follows.
次いで、形成されたノリ力の薄板４を適当な大きさに切
断したのち、第２図で示すように薄板４の表面上にダイ
ヤモンドの刃先を有するスクライバ−６で格子状の傷７
をつける。こののち、第３図で示すように薄板４の裏面
から硬いローラー８で押圧すると、薄板４は格子状の傷
７に沿って割れ、フレーク状のシリカ９が形成される。Next, the formed thin plate 4 is cut into an appropriate size, and then, as shown in FIG.
Attach. Thereafter, as shown in FIG. 3, when the thin plate 4 is pressed from the back side with a hard roller 8, the thin plate 4 is broken along the grid-shaped scratches 7, and flaky silica 9 is formed.
このようにして得られたフレーク状のシリカ９を充填剤
として例えばエポキシ樹脂中に混合するとともに、遮光
剤であるカーボンブラツクを混合物から外すことにより
、半透明の封止用樹脂材が得られる。このように形成さ
れた本発明の封止用樹脂材では、これの成形時に低粘度
化したベースレジンが成形金型内へ注入される際に、充
填剤であるフィラーがフレーク状のシリカであるため、
流体の流れに対して可能な限り抵抗が小さくなるように
配列するため、成形された樹脂中におけるフィラーは、
配向配列されて位置するところとなる。したがって、こ
の現象を利用することで成形樹脂の特定面とフィラーの
配向配列面との間に所望の位置関係を成立させることが
できる。By mixing the flaky silica 9 thus obtained as a filler into, for example, an epoxy resin and removing carbon black as a light shielding agent from the mixture, a translucent sealing resin material can be obtained. In the sealing resin material of the present invention formed in this way, when the base resin whose viscosity has been reduced is injected into the molding die during molding, the filler is flaky silica. For,
The fillers in the molded resin are arranged in such a way that the resistance to fluid flow is as small as possible.
This is where they are oriented and arranged. Therefore, by utilizing this phenomenon, a desired positional relationship can be established between the specific surface of the molded resin and the orientation and arrangement surface of the filler.
ところで、フレーク状のシリカの厚みと大きさは、配向
配列状態の成否すなわち、光透過性の良否に関係する。By the way, the thickness and size of flaky silica are related to whether the alignment state is successful or not, that is, whether the light transmittance is good or not.
厚みを１００μｍ以下とし、また、大きさを１０μｍ角
〜１ｏ００μｍ角の範囲に選定したとき、良好な光透過
特性を有する封止用樹脂材が得られた。When the thickness was set to 100 μm or less and the size was selected within the range of 10 μm square to 100 μm square, a sealing resin material having good light transmission characteristics was obtained.
なお、実施例では、ペースレジンとしてエポキ／樹脂を
示したが、これに限定されるものではなく、Ｓ硬化性あ
るいは熱可塑性の樹脂を用いることによって実現可能で
ある。In the examples, epoxy/resin is shown as the pace resin, but it is not limited to this, and it can be realized by using S-curable or thermoplastic resin.
発明の効果
本発明の封止用樹脂材は、これを用いた成形体に対して
特定の方向から入射する光の吸収および乱反射が少ない
ものであり、この封止用樹脂材を用いて光応用半導体装
置の封止樹脂材として使用が可能な半透明な成形体ある
いは成形板を形成することができる。また、光の入射面
と平行な方向の熱膨張率が小さく、シかも、通常の封止
成形樹脂と組成がほぼ同じとなるため、通常の封止成形
樹脂中に本発明の封止用樹脂材からなる成形体を埋め込
み、これを封止成形樹脂の一部として用いても両者の境
界に熱膨張率の差に起因する剥離あるいはクシツクの生
じない封止成形状態を得ることができる効果も奏される
。Effects of the Invention The sealing resin material of the present invention has low absorption and diffuse reflection of light incident on a molded article from a specific direction, and can be used for optical applications. A translucent molded body or molded plate that can be used as a sealing resin material for semiconductor devices can be formed. In addition, the coefficient of thermal expansion in the direction parallel to the light incidence plane is small, and the composition of the resin is almost the same as that of ordinary sealing resin, so the sealing resin of the present invention can be added to ordinary sealing resin. By embedding a molded body made of material and using it as a part of the sealing molding resin, it is possible to obtain a sealed molded state in which no peeling or cracking due to the difference in thermal expansion coefficient occurs at the boundary between the two. It is played.
第１図〜第３図は、本発明の封止用樹脂材の充填材とな
るフレーク状のシリカの製法を説明するための図である
。
１・・・・ポット、２・・・・・ンリコ、３・・・・・
・高融点スリット板、４・・・・・ノリ力の薄板、５・
・・・・・希ガス、６−・・・スクライバ−１７・・・
・傷、８・・・・・・ローラ、９ ・・・・フレーク状
のシリカ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名＋
−−、ｒ、”・／力
２−−シリカ
８”°ローラーFIGS. 1 to 3 are diagrams for explaining a method for producing flaky silica, which is a filler for the sealing resin material of the present invention. 1...Pot, 2...Nriko, 3...
・High melting point slit plate, 4...Thin plate with glue strength, 5.
...Noble gas, 6-...Scriber-17...
- Scratch, 8...Roller, 9...Flake-like silica. Name of agent: Patent attorney Toshio Nakao and 1 other person +
--, r,"/force 2--silica 8"° roller
Claims (2)
合するフィラーをフレーク状のシリカとしたことを特徴
とする封止用樹脂材。(1) A sealing resin material characterized in that flaky silica is used as a filler mixed as a filler into a thermosetting or thermoplastic resin.
きさ１０μｍ角〜１０００μｍ角に選定されたものであ
ることを特徴とする特許請求の範囲第１項に記載の封止
用樹脂材。(2) The sealing resin material according to claim 1, wherein the flaky silica is selected to have a thickness of 100 μm or less and a size of 10 μm square to 1000 μm square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28241486A JPS63135452A (en) | 1986-11-26 | 1986-11-26 | Sealing resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28241486A JPS63135452A (en) | 1986-11-26 | 1986-11-26 | Sealing resin material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63135452A true JPS63135452A (en) | 1988-06-07 |
Family
ID=17652099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28241486A Pending JPS63135452A (en) | 1986-11-26 | 1986-11-26 | Sealing resin material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63135452A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056372A1 (en) * | 2001-01-10 | 2002-07-18 | Silverbrook Research Pty. Ltd. | Use of infrared radiation in molding of protective caps |
| US7777352B2 (en) | 2005-10-05 | 2010-08-17 | Infineon Technologies Ag | Semiconductor device with semiconductor device components embedded in plastic package compound |
-
1986
- 1986-11-26 JP JP28241486A patent/JPS63135452A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056372A1 (en) * | 2001-01-10 | 2002-07-18 | Silverbrook Research Pty. Ltd. | Use of infrared radiation in molding of protective caps |
| US7777352B2 (en) | 2005-10-05 | 2010-08-17 | Infineon Technologies Ag | Semiconductor device with semiconductor device components embedded in plastic package compound |
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