JPS63134545U - - Google Patents
Info
- Publication number
- JPS63134545U JPS63134545U JP2600387U JP2600387U JPS63134545U JP S63134545 U JPS63134545 U JP S63134545U JP 2600387 U JP2600387 U JP 2600387U JP 2600387 U JP2600387 U JP 2600387U JP S63134545 U JPS63134545 U JP S63134545U
- Authority
- JP
- Japan
- Prior art keywords
- component
- television camera
- stand
- parts
- recognizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2600387U JPH0547470Y2 (da) | 1987-02-24 | 1987-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2600387U JPH0547470Y2 (da) | 1987-02-24 | 1987-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63134545U true JPS63134545U (da) | 1988-09-02 |
| JPH0547470Y2 JPH0547470Y2 (da) | 1993-12-14 |
Family
ID=30826678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2600387U Expired - Lifetime JPH0547470Y2 (da) | 1987-02-24 | 1987-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547470Y2 (da) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0294530A (ja) * | 1988-09-30 | 1990-04-05 | Nec Yamagata Ltd | 半導体部品の位置決め方法 |
| WO2005086219A1 (ja) * | 2004-03-05 | 2005-09-15 | Towa Corporation | ダイボンド用粘着テープの貼付方法および電子部品の装着方法 |
-
1987
- 1987-02-24 JP JP2600387U patent/JPH0547470Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0294530A (ja) * | 1988-09-30 | 1990-04-05 | Nec Yamagata Ltd | 半導体部品の位置決め方法 |
| WO2005086219A1 (ja) * | 2004-03-05 | 2005-09-15 | Towa Corporation | ダイボンド用粘着テープの貼付方法および電子部品の装着方法 |
| JP2005252114A (ja) * | 2004-03-05 | 2005-09-15 | Towa Corp | ダイボンド用粘着テープの貼付方法 |
| JP4538843B2 (ja) * | 2004-03-05 | 2010-09-08 | 澁谷工業株式会社 | ダイボンド用粘着テープの貼付方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547470Y2 (da) | 1993-12-14 |