JPS631344U - - Google Patents
Info
- Publication number
- JPS631344U JPS631344U JP9321686U JP9321686U JPS631344U JP S631344 U JPS631344 U JP S631344U JP 9321686 U JP9321686 U JP 9321686U JP 9321686 U JP9321686 U JP 9321686U JP S631344 U JPS631344 U JP S631344U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- hermetically sealed
- mounting part
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 230000004927 fusion Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000001788 irregular Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321686U JPS631344U (enExample) | 1986-06-20 | 1986-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321686U JPS631344U (enExample) | 1986-06-20 | 1986-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631344U true JPS631344U (enExample) | 1988-01-07 |
Family
ID=30955607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9321686U Pending JPS631344U (enExample) | 1986-06-20 | 1986-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631344U (enExample) |
-
1986
- 1986-06-20 JP JP9321686U patent/JPS631344U/ja active Pending