JPS631344U - - Google Patents
Info
- Publication number
- JPS631344U JPS631344U JP9321686U JP9321686U JPS631344U JP S631344 U JPS631344 U JP S631344U JP 9321686 U JP9321686 U JP 9321686U JP 9321686 U JP9321686 U JP 9321686U JP S631344 U JPS631344 U JP S631344U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- hermetically sealed
- mounting part
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 230000004927 fusion Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000001788 irregular Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例を示す気密封止
形半導体装置の要部分解斜視図、第２図は従来の
気密封止形半導体装置の断面図、第３図は第２図
のＡ―Ａ断面図、第４図は第２図の要部分解斜視
図、第５図は第１図の気密封止形半導体装置のリ
ードと溶融樹脂との融着状況を示す融着状態図、
第６図は本考案の第２の実施例のリード要部平面
図および第７図は本考案の第３の実施例のリード
要部平面図である。
１１……リードフレーム、１１―２……リード
、１１―３……凹凸部、１４……中空パツケージ
、１４―１……下部パツケージ、１４―２……上
部パツケージ、１４―３……下部パツケージ接合
面、１４―４……上部パツケージ接合面、１５…
…間隙部、１６……溶融樹脂。
1 is an exploded perspective view of essential parts of a hermetically sealed semiconductor device showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional hermetically sealed semiconductor device, and FIG. 3 is a sectional view of a conventional hermetically sealed semiconductor device. 4 is an exploded perspective view of the main part of FIG. 2, and FIG. 5 is a fusion state showing the state of fusion between the leads and molten resin of the hermetically sealed semiconductor device of FIG. 1. figure,
FIG. 6 is a plan view of the main part of the lead according to the second embodiment of the present invention, and FIG. 7 is a plan view of the main part of the lead according to the third embodiment of the present invention. 11...Lead frame, 11-2...Lead, 11-3...Irregular portion, 14...Hollow package, 14-1...Lower package cage, 14-2...Upper package, 14-3...Lower package Joint surface, 14-4... Upper package joint surface, 15...
...Gap, 16... Molten resin.
Claims (1)
ドフレームと、前記素子搭載部を囲みかつ前記リ
ードフレームを挾持する接合部をそれぞれもつ２
つの熱可塑性樹脂パツケージ部材とを備え、前記
各接合部を、その間に前記リードフレームを介在
させて相互に加熱融着した気密封止形半導体装置
において、 前記リードフレームの前記各接合部間に挾まれ
る部分に凹凸部を設けたことを特徴とする気密封
止形半導体装置。[Claims for Utility Model Registration] A lead frame having an element mounting part on which a semiconductor element is mounted, and a joint part surrounding the element mounting part and holding the lead frame.
a hermetically sealed semiconductor device comprising: a thermoplastic resin package member, the respective joint portions being heat-fused to each other with the lead frame interposed therebetween; What is claimed is: 1. A hermetically sealed semiconductor device characterized by having a concavo-convex portion in a portion that is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321686U JPS631344U (en) | 1986-06-20 | 1986-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321686U JPS631344U (en) | 1986-06-20 | 1986-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631344U true JPS631344U (en) | 1988-01-07 |
Family
ID=30955607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9321686U Pending JPS631344U (en) | 1986-06-20 | 1986-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631344U (en) |
-
1986
- 1986-06-20 JP JP9321686U patent/JPS631344U/ja active Pending