JPS63134166A - Wafer holding mechanism - Google Patents
Wafer holding mechanismInfo
- Publication number
- JPS63134166A JPS63134166A JP61276511A JP27651186A JPS63134166A JP S63134166 A JPS63134166 A JP S63134166A JP 61276511 A JP61276511 A JP 61276511A JP 27651186 A JP27651186 A JP 27651186A JP S63134166 A JPS63134166 A JP S63134166A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding member
- elastic film
- vacuum suction
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 29
- 239000012528 membrane Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 abstract description 21
- 239000004744 fabric Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はウェハ研磨機の保持機構に係り、ｆＦにウェハ
のうねり、くぼみ等の外観不良を防止することに好適な
ウェハ保持機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a holding mechanism for a wafer polishing machine, and more particularly, to a wafer holding mechanism suitable for preventing appearance defects such as waviness and depressions of the wafer in fF.
従来の装置は、ウェハ外観不良防止のために。 Conventional equipment is used to prevent wafer appearance defects.
実開昭５９−５９１５９号公報に記載のように、ウェハ
保持機構部に弾性膜を有し、ウェハを真空吸着していた
。しかしこの方法では、ウェハと弾性膜間に研磨液の吸
引が生じ、ウェハの保持面側への研磨液の付着の点につ
いて配慮されていなかった。As described in Japanese Utility Model Application Publication No. 59-59159, the wafer holding mechanism has an elastic membrane to vacuum-suction the wafer. However, in this method, suction of the polishing liquid occurs between the wafer and the elastic film, and no consideration is given to the adhesion of the polishing liquid to the holding surface of the wafer.
本発明の目的は、ウェハの保持面側への研磨液の回り込
みによる付着を防止し、しかも、ウェハに蒸着した弾性
膜とウェハ保持部材間への研磨液の吸引を防止すること
にある。An object of the present invention is to prevent the polishing liquid from flowing around and adhering to the holding surface of the wafer, and also to prevent the polishing liquid from being sucked between the elastic film deposited on the wafer and the wafer holding member.
ウェハの保持面への研磨液付着防止の目的に対して、ウ
ェハに弾性膜を装着し、ウェノ・と弾性膜の間に真空吸
引層を形成しないことにより達成される。The purpose of preventing the polishing liquid from adhering to the holding surface of the wafer is achieved by attaching an elastic membrane to the wafer and not forming a vacuum suction layer between the wafer and the elastic membrane.
さらに１弾性膜と保持部材間への研磨液の吸引防止の目
的に対して、保持部材の真空吸引用空孔部を保持部の端
部に形成することによって達成される。Furthermore, the purpose of preventing suction of polishing liquid between the elastic membrane and the holding member is achieved by forming vacuum suction holes in the holding member at the ends of the holding member.
ウェハと弾性膜は一体となり１弾性膜と保持部材間で真
空吸着させるために２研磨液を吸引する危険性を弾性膜
と保持部材間に限定でき、ウェハの保持面側に研磨液の
付着を防止できる。The wafer and the elastic membrane are integrated, 1) vacuum suction is carried out between the elastic membrane and the holding member, 2) the risk of suctioning the polishing liquid can be limited between the elastic membrane and the holding member, and the polishing liquid is prevented from adhering to the holding surface of the wafer. It can be prevented.
さらに１弾性膜と保持部材間の真空吸引空孔を接触面端
部に設けることによって１弾性膜と保持部材間の気液流
は中央部から端部へ吹出流とできるので、保持部材に研
磨液の付着を防止できる様になる。Furthermore, by providing a vacuum suction hole between the elastic membrane 1 and the holding member at the end of the contact surface, the gas-liquid flow between the elastic membrane 1 and the holding member can be made into a blowout flow from the center to the end, so that the holding member can be polished. This will prevent liquid from adhering.
以下１本発明の一実施例を第１図により説明する。まず
構成を説明する。保持部材１の端部に幅０．５〜０．７
ｍｓの環状溝の空孔部２があり、真空源と圧縮気体源
に切換弁を介して連通している。保持部材１の中央部に
径φ０．２〜０．７ｍ＋＋の孔が分散した多孔質空孔部
３があり、加圧水流源と連通している。ウェハ４は、粘
着剤によって弾性膜５と一体になっている。弾性膜に張
力を与え、３０〜５０゛０の加熱状態でウェハにローラ
加圧し張り付けし、ウェハ４上に弾性膜５の膜淳均−化
を計っている弾性膜５と保持部材１とは対向している。An embodiment of the present invention will be described below with reference to FIG. First, the configuration will be explained. Width 0.5 to 0.7 at the end of the holding member 1
ms annular groove cavity 2, which communicates with a vacuum source and a compressed gas source via a switching valve. There is a porous hole part 3 in the center of the holding member 1 in which pores with a diameter of 0.2 to 0.7 m++ are dispersed, and the porous hole part 3 is in communication with a pressurized water flow source. The wafer 4 is integrated with the elastic membrane 5 by adhesive. What is the elastic film 5 and the holding member 1 that apply tension to the elastic film and apply pressure to the wafer in a heated state of 30 to 50゛0 to stick it on the wafer to evenly spread the elastic film 5 on the wafer 4? They are facing each other.
保持部材１上方には図示していない研磨圧力負荷装置が
ある。保持部材１下方には、研磨布６を装着した回転盤
７がある。回転盤７上方に研磨液供給源８がある。次に
動作を説明する。空孔部２を真空源と連通し、ウェハ４
を弾性膜５を介在して真空吸着させる。吸着後、保持部
材１は上方の図示していない研磨圧力負荷装置で下方の
研磨布６に押しつけ、回転盤７を回転させ、研磨液供給
源８から研磨液を研磨布６上に滴下し、ウェハ４と研磨
布６を相対摺動させて研磨を行なう。所定の研磨時間後
、保持部材１を研磨布６から上方に持ちあげ。Above the holding member 1 is a polishing pressure applying device (not shown). Below the holding member 1 is a rotary disk 7 equipped with a polishing cloth 6. A polishing liquid supply source 8 is located above the rotary disk 7. Next, the operation will be explained. The cavity 2 is communicated with a vacuum source, and the wafer 4 is
is vacuum-adsorbed through the elastic membrane 5. After adsorption, the holding member 1 is pressed against the lower polishing cloth 6 by an upper polishing pressure applying device (not shown), the rotary disk 7 is rotated, and the polishing liquid is dripped onto the polishing cloth 6 from the polishing liquid supply source 8. Polishing is performed by sliding the wafer 4 and polishing cloth 6 relative to each other. After a predetermined polishing time, the holding member 1 is lifted upward from the polishing cloth 6.
保持部材の中央部の多孔質空孔部３から加圧水流を噴出
させ、さらに、端部の空孔部２を切換弁を介して圧縮気
体源と連通させ、空孔部２からウェハ４の保持面側の弾
性膜５に圧縮気体を噴出させて、ウェハ４と弾性膜５を
一体のまま、保持部材１から剥離し、研磨を完了する。A pressurized water stream is ejected from the porous pores 3 in the center of the holding member, and the pores 2 at the ends are communicated with a compressed gas source via a switching valve to hold the wafer 4 from the pores 2. Compressed gas is ejected to the elastic film 5 on the surface side, and the wafer 4 and the elastic film 5 are peeled off from the holding member 1 while remaining integral, and the polishing is completed.
本実施例では以下の効果がある。研磨状態では真空吸引
は弾性膜５と保持部材１の端部の空孔部２で行なわれ、
この空孔部２へ中央部から気液流が生じ、中央部への気
液流の流れ込みを防止でき保持部材１に研磨液は回り込
むことを防止できる。This embodiment has the following effects. In the polishing state, vacuum suction is performed by the elastic membrane 5 and the cavity 2 at the end of the holding member 1,
A gas-liquid flow is generated from the central portion into the hole portion 2, and the gas-liquid flow can be prevented from flowing into the central portion, and the polishing liquid can be prevented from going around to the holding member 1.
また、ウェハ４と弾性膜５の間は粘着作用より一体であ
り、真空吸引していないために、ウェハ４の保持側には
研磨液の回り込みを防止できろ。したがって、ウェハ形
状劣化要因となるウェハ４の保持側への研磨液の付着を
防止できる。Further, since the wafer 4 and the elastic membrane 5 are integrally formed due to adhesive action and are not vacuum-suctioned, it is possible to prevent the polishing liquid from getting around to the side where the wafer 4 is held. Therefore, it is possible to prevent the polishing liquid from adhering to the holding side of the wafer 4, which would cause deterioration of the wafer shape.
他の実施例として５弾性膜５を保持部材１に粘着剤によ
って一体とし、保持部材空孔穴位置に連通した空孔を弾
性膜に設け、ウェハを保持する機構としても効果がある
。As another embodiment, the elastic membrane 5 is integrated with the holding member 1 using an adhesive, and the elastic membrane is provided with holes communicating with the holding member hole positions, which is also effective as a mechanism for holding a wafer.
箇だ、ウェハ形状に転写する弾性膜厚分布を均一化させ
ろための弾性膜形成法として、スピンコーティングやス
プレーによる塗膜方法がある。さらに膜形成後、剥離性
の良いシートを介してオプチカルフラットの様に高平面
度の平板で加圧すると塗膜面は均一な膜厚となり効果が
ある。In addition, spin coating and spray coating methods are available as elastic film forming methods for uniformizing the elastic film thickness distribution transferred to the wafer shape. Furthermore, after the film is formed, applying pressure with a flat plate with high flatness such as an optical flat through a sheet with good releasability is effective because the coating surface becomes uniform in thickness.
１だ、保持部材１の中央部の剥離気流用空孔部は多孔質
体に限らす、らせん溝や同心円溝９を用いてもウェハ剥
離効果がある。1. The separation air flow hole in the center of the holding member 1 is limited to a porous material; even if a spiral groove or a concentric groove 9 is used, the wafer separation effect can be achieved.
本発明によれば、ウェハを真空吸着方式で保持具に着脱
することができ、ウエノ・保持面に研磨液の付着を防止
し、保持部材に研磨液の吸引を防止できるので、ウェハ
の外観不良となるうねりやくほみのないウェハを得るこ
とができる。According to the present invention, the wafer can be attached to and removed from the holder using a vacuum suction method, and it is possible to prevent the polishing liquid from adhering to the wafer and the holding surface, and to prevent the polishing liquid from being sucked into the holding member, resulting in poor appearance of the wafer. It is possible to obtain a wafer with no waviness or roughness.
第１図は本発明の一実施例の断面図、第２〜第４包は実
施例の平面図である。
１・・・・・・・・・・・・保持部材
２・・−・・・・・・・・空孔部
４・・−・・・・・・・・ウェハ
５・・・・・・・・・・・・弾性膜
代理人 弁理士 小 川 勝 男
３ １ 図
１ イ保キ望ト部せ ４− ぐン、
昌呈 ２図
−３図FIG. 1 is a sectional view of one embodiment of the present invention, and the second to fourth packages are plan views of the embodiment. 1...... Holding member 2... Hole portion 4... Wafer 5... ...Elastic membrane agent Patent attorney Masao Ogawa 3 1 Figure 1 Ihoki Motobe 4- Gun,
Changsei Figures 2-3
Claims (1)
いは保持部材に弾性膜を装着し、保持部材のウェハ保持
面の外縁部と中央部にウェハの装着、剥離用の空孔部を
設けたことを特徴とするウェハ保持機構。1. In the holding mechanism of a wafer polishing device, an elastic membrane is attached to the wafer or the holding member, and holes for mounting and peeling the wafer are provided at the outer edge and center of the wafer holding surface of the holding member. Characteristic wafer holding mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61276511A JPS63134166A (en) | 1986-11-21 | 1986-11-21 | Wafer holding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61276511A JPS63134166A (en) | 1986-11-21 | 1986-11-21 | Wafer holding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63134166A true JPS63134166A (en) | 1988-06-06 |
Family
ID=17570485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61276511A Pending JPS63134166A (en) | 1986-11-21 | 1986-11-21 | Wafer holding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134166A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130152U (en) * | 1991-05-21 | 1992-11-30 | スピードフアム株式会社 | Pressure head for surface polishing |
| WO1995029039A1 (en) * | 1994-04-22 | 1995-11-02 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
| US5514025A (en) * | 1991-05-24 | 1996-05-07 | Shin-Etsu Handotai Co. Ltd. | Apparatus and method for chamfering the peripheral edge of a wafer to specular finish |
| JP2005306582A (en) * | 2004-04-23 | 2005-11-04 | Murata Mfg Co Ltd | Transfer method for card-like sheet and transfer device |
| CN108115551A (en) * | 2016-11-29 | 2018-06-05 | 东京毅力科创株式会社 | Substrate processing device, processing method for substrate and storage medium |
-
1986
- 1986-11-21 JP JP61276511A patent/JPS63134166A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130152U (en) * | 1991-05-21 | 1992-11-30 | スピードフアム株式会社 | Pressure head for surface polishing |
| US5514025A (en) * | 1991-05-24 | 1996-05-07 | Shin-Etsu Handotai Co. Ltd. | Apparatus and method for chamfering the peripheral edge of a wafer to specular finish |
| WO1995029039A1 (en) * | 1994-04-22 | 1995-11-02 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
| US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
| JP2005306582A (en) * | 2004-04-23 | 2005-11-04 | Murata Mfg Co Ltd | Transfer method for card-like sheet and transfer device |
| CN108115551A (en) * | 2016-11-29 | 2018-06-05 | 东京毅力科创株式会社 | Substrate processing device, processing method for substrate and storage medium |
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