JPS63133008A - Mounting inspection equipment for chip part - Google Patents

Abstract

PURPOSE:To judge mounting state of a chip part instantaneously and at a high accuracy by projecting four lines on the chip part to detect the position of the lines varying with the mounting condition thereof. CONSTITUTION:Lines projected on a chip part 5 to be inspected and a line pattern on a printed circuit board 6 are read out with a photographing section 7 set thereabove. Then, an image signal thus obtained is subjected to an image processing, for example, mesh method and a line pattern alone is taken out by digital conversion with an A/D converting section 8. Then, computation is performed with a detection circuit section 9 based on the position of a desired code existing in an assumed range from the line pattern to judge mounting state of the chip part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an inspection apparatus for semiconductor devices, and more particularly to an inspection apparatus for determining the mounting status of chip components mounted on a printed circuit board.

[Prior Art] Conventionally, when inspecting the mounting of chip components on a printed circuit board, the actual situation is that an operator uses a magnifying glass to inspect the mounting status of each chip component.

Another inspection method is to shine light onto the printed circuit board diagonally from above and determine the mounting status based on the shadows created by the chip components.

Furthermore, another inspection method has been developed in which the printed circuit board or slit light is moved slightly in the vertical and horizontal directions with respect to the chip using an actuator. There are ways to read the changes and inspect the edges.

[Problems to be Solved by the Invention] The conventional inspection methods described above each have the following problems.

■ It is necessary to inspect each chip component for which the work is clearly done, which results in extremely poor work efficiency and is prone to inspection omissions and inspection errors.

(2) Judging by the state of the shadow caused by the chip component, for example, if there are variations in the dimensions of the chip component, the length of the shadow will change due to the shadow from one direction, which may lead to false detection.

(2) Inspection using minute movements of printed circuit boards or slit light improves inspection accuracy, but it takes a long time to detect each chip component, and the equipment is expensive.

The present invention has been made to solve these problems, and an object of the present invention is to provide a chip component mounting inspection device with high accuracy and high throughput.

[Means for Solving the Problems] The mounting inspection device according to the present invention detects at least two lines intersecting one opposite side of the upper plane of a rectangular parallelepiped chip component mounted on a printed circuit board, and another line that intersects with one opposite side of the upper plane. It is said to form at least two lines that intersect opposite sides. Furthermore, means for reading and outputting the intersection positions of the at least four lines with the opposite sides, and means for determining the mounting status of the chip component based on the output intersection positions are provided.

[Function] In this invention, the positions of the four lines projected on the chip component change depending on the thickness and positional deviation of the chip component, so the mounting state of the chip component is determined based on the change in the position. Detect.

[Example] FIG. 1 is a perspective view showing an embodiment of the present invention.

In the figure, a printed circuit board 6 on which chip components 5 are mounted is placed on an X-Y table 11 that is movable on the surface. The light sources that form two orthogonal lines on the surface of the printed circuit board 6 include a Y-axis slit light source 1, an x-axis slit light source 2, and a Y@right slit light source 3.
An X-axis direction slit 1 and a light source section 4 are installed obliquely above the X-Y table 11. In addition, chip parts 5
For example, one of the four slit beams receives the projection of the four slit lights and creates a fi image of the projection part and its surroundings. T.

(2) An m-image unit 7 such as a camera is installed above.

The dance image section 7, the Δ/D1a conversion section 8, the detection circuit section 9, and the control section 10 are connected to each other, and the control section 10 is connected to the X-Y
・X-axis direction drive unit 13 that moves the Hable 11 on the surface
J3 and the Y-axis direction drive circuit section 15 and Y-axis direction drive circuit section 14, respectively, which are connected to the Y-axis direction drive section 12 and control the driving thereof.

FIG. 2 is an enlarged perspective view of the line portion of one embodiment of the present invention.

In the figure, the XllllIh direction window 20 is formed as one line on the printed circuit board by the X-axis slit light 17 and the X-axis slit/light 19 emitted from the slit light source section shown in FIG. The two slit beams form the printed circuit board surface and the angle is α0. Similarly, the Y-axis direction window 21 is the Y-axis direction slit light 1.
6 and the Y-axis direction slit light 18 are similarly formed as a single tree line on the printed circuit board, and the angles that both these slit lights make with the printed circuit board surface are the same α0. FIG. 3 is an enlarged perspective view of lines projected onto a chip component according to an embodiment of the present invention, and FIG. 4 is a plan view thereof.

In both figures, the X-axis groove A22 and the X-axis groove 82.3 are formed by the projection of the two slit lights shown in FIG. is formed, and YIIIi11 is also formed in the Y-axis direction.
By projecting the two slit lights forming the direction line 21, a Y-axis indentation Δ24 and a Y-axis indentation 825 are formed. Code △1~A.

2 is a code indicating the position at the end of the chip component 5 of each line.

The operation of this mounting inspection device will be explained below based on FIGS. 1 to 4.

ibl control unit 10 to the X-axis direction drive circuit unit 15 and the Y
The X-axis direction drive section 13 and the Y-axis direction drive section 12 are driven by the signal given to the axial direction drive circuit section 14 to move the X-Y table 11 and align it with the X-axis direction line 20 on the printed circuit board 6. Set the regular depth part so that its center is at the intersection with the Y-axis direction line 21. The line pattern of the lines projected on the chip component 5 to be inspected and the lines on the printed circuit board 6 is as shown in FIG. 4, and is read by the imaging section 7 installed above.
The image signal is subjected to image processing such as the mesh method, and is digitally converted by the A/D converter 8 to extract only the line pattern. Next, the detection circuit section 9 detects the positions of symbols Δ, ~Δ, 2 shown in FIG. 4 from this line pattern,
Based on the value of the desired code position existing in the assumed range, the following calculation is performed to determine the mounting state of the chip component 5 at t7.

Depending on the processing status of the detection circuit section 9, the control section 1° to
A signal is sent to the driving section of the Y table 11, and by driving this, the next chip component 5 is inspected for mounting.

Next, the principle of detecting a specific mounting state of a chip component by reading a line pattern will be explained.

FIG. 5 is a diagram in which the chip component 5 is mounted in a rotationally misaligned state. Here, for example, the intersection of the X-axis direction line 20 and the Y-axis direction line 21 is set as the coordinate origin, and the X-axis is taken in the horizontal direction. Set a coordinate axis that takes the Y axis in the vertical direction, and for example, let the coordinates of code A1 be (X + , V + ),
Coordinates are similarly given to other symbols A2 to Δ and 2. next,
Line A1 Δ9, △, △7 N A4 AT 2 , A
Electric A. The midpoints of are B9.82, B-, and B4 respectively, and these coordinates are 81 (Xi, Yl) (1
-1 to 4) t''.

At this time, if the angle of rotational deviation of the chip component 5 is θ, then the coordinates of the center position ffo of the chip component 5 are (
X,,Y,), the center MO is the intersection of straight 6B+[32 and straight l1IB, [3, so appetizer=2fA
? ζθ width ÷ Y'4) ten no = θ own 4θ (×, food X1-
Xter×4〕17θtY, +Y,>? It is found as I. Roughly speaking, the height (not shown in FIG. 3) of the chip component 5 is -1. Therefore the lines A+ As, A* AT,
A=A,t,AG AT. By reading the position of the end of the center point 81 to B, the rotational deviation, positional deviation, and floating state of the chip component 5 are determined. The mounting state of the chip component 5 can be detected by comparing the position coordinates <x,, y,> with a predetermined reference value such as (0, O).

FIG. 6 shows the chip component 5 mounted in a floating state, and FIG. 7 shows the chip component 5 mounted in a floating state.

Reference numerals 5.20 to 25 in both figures are the same as in FIG. 4.

According to the above detection principle, by moving the X-Y table 11, the intersection points of the slit lights are made to coincide with each center position of the regular chip components stored in advance, and the inspection is performed one after another. The mounting state of all chip components on the board 6 can be inspected.

In the above embodiment, the slit lights were superimposed on the printed circuit board L, and two orthogonal lines were formed, and the angles between these slit lights and the printed circuit board surface were all the same. This is for calculation convenience, and even if these conditions are exceeded, it can be detected by considering the vIfIJ formula.

Further, in the above embodiment, the slit light is a bright light beam, but the same effect can be achieved even if the slit light is a dark light beam that brightens the slit portion.

Furthermore, in the above embodiment, X-Y
Individual chip components are inspected by moving the table, but multiple sets of lines and multiple decoy image sections are used to inspect X-Y
It is also possible to inspect the table while it is fixed or moving.

[Effects of the Invention] As explained above, the present invention projects four lines onto a chip component and detects the position of the line, which changes depending on the mounting state, and instantly performs a mounting inspection, which improves accuracy. Good quality and high throughput chip component mounting inspection °
It has the effect of becoming a device.

[Brief explanation of the drawing]

The drawings all show one embodiment of the present invention, and FIG. 1 is a perspective view of the configuration, FIG. 2 is an enlarged perspective view of a line portion, and FIG. 3 is an enlarged perspective view of a line projected onto a chip component. 4 to 7 are diagrams showing line patterns of chip components in various mounting states. In the figures, 5 is a chip component, 6 is a printed circuit board, 7 is a developing section, and 8 is a Δ/D conversion section. , 9 is a detection circuit section, 10 is a control section, 11 is an X-Y table, 1G is a slit light in the Y-axis direction, 17 is a slit light in the X-axis direction, 18 is a slit light in the Y@ direction, 19 is a slit light in the X-axis direction , 20 is a line in the X-axis direction, 21 is a line in the Y-axis direction, 22 is a line in the X-axis direction A123
is the X-axis back B 124 is the Y-axis back B, and 25 is the Y-axis back B. Note that the same reference numerals in each figure indicate the same or corresponding parts. Figure 2 19: x-axis force direction pickpocket 3. Toe Figure 3 5: Te..., 7°q? Product 20: X-axis h line 21: 17-axis line 22: To X-heavy line 23: X-vehicle weight line B 24; S・'lA20-×axis P; own line No. 7 Figure 21:Y-line 22:×base-i three! △

Claims (1)

[Scope of Claims] A mounting inspection device for a rectangular parallelepiped chip component mounted on a printed circuit board, comprising at least two lines on an upper plane of the chip component that intersect with a first opposite side of the upper plane. a second line forming means for forming at least two lines on the upper plane that intersect with a second opposite side different from the first opposite side; and at least four lines. detecting means for detecting the intersection positions of the line and the first opposite side and the second opposite side; and calculate the intersection of a straight line connecting the midpoints of the two lines formed by the first line forming means and a straight line connecting the midpoints of the two lines formed by the second line forming means. A calculation means for determining the center position of the chip component and further determining a rotation angle of the chip component based on the intersection position; and calculating the center position and the rotation angle of the chip component by the calculation means. A chip component mounting inspection device comprising: a determining means for determining the mounting status of the chip component by comparing it with a predetermined center position and rotation angle.