JPS63131556A - 回路基板の冷却装置 - Google Patents

回路基板の冷却装置

Info

Publication number
JPS63131556A
JPS63131556A JP61276746A JP27674686A JPS63131556A JP S63131556 A JPS63131556 A JP S63131556A JP 61276746 A JP61276746 A JP 61276746A JP 27674686 A JP27674686 A JP 27674686A JP S63131556 A JPS63131556 A JP S63131556A
Authority
JP
Japan
Prior art keywords
cooling
refrigerant
circuit board
flow path
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61276746A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573267B2 (enExample
Inventor
Kazuo Maruyama
丸山　一男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61276746A priority Critical patent/JPS63131556A/ja
Priority to FR8716094A priority patent/FR2607349B1/fr
Publication of JPS63131556A publication Critical patent/JPS63131556A/ja
Publication of JPH0573267B2 publication Critical patent/JPH0573267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP61276746A 1986-11-21 1986-11-21 回路基板の冷却装置 Granted JPS63131556A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61276746A JPS63131556A (ja) 1986-11-21 1986-11-21 回路基板の冷却装置
FR8716094A FR2607349B1 (fr) 1986-11-21 1987-11-20 Structure de refroidissement pour substrats

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61276746A JPS63131556A (ja) 1986-11-21 1986-11-21 回路基板の冷却装置

Publications (2)

Publication Number Publication Date
JPS63131556A true JPS63131556A (ja) 1988-06-03
JPH0573267B2 JPH0573267B2 (enExample) 1993-10-14

Family

ID=17573762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61276746A Granted JPS63131556A (ja) 1986-11-21 1986-11-21 回路基板の冷却装置

Country Status (2)

Country Link
JP (1) JPS63131556A (enExample)
FR (1) FR2607349B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
FR2860947B1 (fr) * 2003-10-10 2005-12-23 Thales Sa Dispositif de refroidissement de circuits imprimes electronique et mode realisation.
DE102004008461A1 (de) * 2004-02-17 2005-10-06 Rittal Gmbh & Co. Kg Gehäuseanordnung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD104895A1 (enExample) * 1973-02-19 1974-03-20
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution

Also Published As

Publication number Publication date
FR2607349B1 (fr) 1995-07-07
FR2607349A1 (fr) 1988-05-27
JPH0573267B2 (enExample) 1993-10-14

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