JPS63131138U - - Google Patents
Info
- Publication number
- JPS63131138U JPS63131138U JP2300587U JP2300587U JPS63131138U JP S63131138 U JPS63131138 U JP S63131138U JP 2300587 U JP2300587 U JP 2300587U JP 2300587 U JP2300587 U JP 2300587U JP S63131138 U JPS63131138 U JP S63131138U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- exposed
- sealing
- semiconductor device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300587U JPS63131138U (sv) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300587U JPS63131138U (sv) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131138U true JPS63131138U (sv) | 1988-08-26 |
Family
ID=30820926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300587U Pending JPS63131138U (sv) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131138U (sv) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853152B2 (ja) * | 1980-12-17 | 1983-11-28 | 株式会社 長谷川工務店 | プレハブ工法における接合方法 |
-
1987
- 1987-02-19 JP JP2300587U patent/JPS63131138U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853152B2 (ja) * | 1980-12-17 | 1983-11-28 | 株式会社 長谷川工務店 | プレハブ工法における接合方法 |