JPS63131137U - - Google Patents

Info

Publication number
JPS63131137U
JPS63131137U JP1987023884U JP2388487U JPS63131137U JP S63131137 U JPS63131137 U JP S63131137U JP 1987023884 U JP1987023884 U JP 1987023884U JP 2388487 U JP2388487 U JP 2388487U JP S63131137 U JPS63131137 U JP S63131137U
Authority
JP
Japan
Prior art keywords
insulating substrate
groove
hole
electrode pads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987023884U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987023884U priority Critical patent/JPS63131137U/ja
Publication of JPS63131137U publication Critical patent/JPS63131137U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Die Bonding (AREA)
JP1987023884U 1987-02-19 1987-02-19 Pending JPS63131137U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987023884U JPS63131137U (cg-RX-API-DMAC10.html) 1987-02-19 1987-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987023884U JPS63131137U (cg-RX-API-DMAC10.html) 1987-02-19 1987-02-19

Publications (1)

Publication Number Publication Date
JPS63131137U true JPS63131137U (cg-RX-API-DMAC10.html) 1988-08-26

Family

ID=30822601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987023884U Pending JPS63131137U (cg-RX-API-DMAC10.html) 1987-02-19 1987-02-19

Country Status (1)

Country Link
JP (1) JPS63131137U (cg-RX-API-DMAC10.html)

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