JPS63131101U - - Google Patents
Info
- Publication number
- JPS63131101U JPS63131101U JP2137887U JP2137887U JPS63131101U JP S63131101 U JPS63131101 U JP S63131101U JP 2137887 U JP2137887 U JP 2137887U JP 2137887 U JP2137887 U JP 2137887U JP S63131101 U JPS63131101 U JP S63131101U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- metal
- temperature sensor
- coating resin
- 0kcal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
第１図は本考案の実施例の断面図。第２図は従
来構造の温度センサの断面図。第３図は本考案に
よる温度センサと従来構造の温度センサの熱応答
特性図の比較図である。
１……サーミスタ素子、２……電極、３……リ
ード線、４……コート用樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention. FIG. 2 is a sectional view of a temperature sensor with a conventional structure. FIG. 3 is a comparison diagram of thermal response characteristic diagrams of a temperature sensor according to the present invention and a temperature sensor having a conventional structure. 1... Thermistor element, 2... Electrode, 3... Lead wire, 4... Coating resin.
Claims (1)
線として熱伝導率が１００ｋｃａｌ／ｍｈ°Ｃ以
下の金属を使用すると共に、サーミスタ素子およ
び、電気的接続部以外のリード線を熱伝導率が１
．０ｋｃａｌ／ｍｈ°Ｃ以下のコート用樹脂で、
モールドしたことを特徴とする温度センサ。 Use a metal with a thermal conductivity of 100 kcal/mh°C or less as lead wires for the electrodes at both ends of the chip-shaped thermistor element, and use metal with a thermal conductivity of 1
．． Coating resin below 0kcal/mh°C,
A temperature sensor characterized by being molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2137887U JPS63131101U (en) | 1987-02-18 | 1987-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2137887U JPS63131101U (en) | 1987-02-18 | 1987-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131101U true JPS63131101U (en) | 1988-08-26 |
Family
ID=30817768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2137887U Pending JPS63131101U (en) | 1987-02-18 | 1987-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131101U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63108701A (en) * | 1986-10-27 | 1988-05-13 | 松下電工株式会社 | Semiconductor temperature-sensitive device |
-
1987
- 1987-02-18 JP JP2137887U patent/JPS63131101U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63108701A (en) * | 1986-10-27 | 1988-05-13 | 松下電工株式会社 | Semiconductor temperature-sensitive device |