JPS63130767A - Production of thin ta amorphous alloy film - Google Patents

Production of thin ta amorphous alloy film

Info

Publication number
JPS63130767A
JPS63130767A JP61277150A JP27715086A JPS63130767A JP S63130767 A JPS63130767 A JP S63130767A JP 61277150 A JP61277150 A JP 61277150A JP 27715086 A JP27715086 A JP 27715086A JP S63130767 A JPS63130767 A JP S63130767A
Authority
JP
Japan
Prior art keywords
thin
thin film
substrate
amorphous
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61277150A
Other languages
Japanese (ja)
Inventor
Tsutomu Yoshitake
務 吉武
Yoshimi Kubo
佳実 久保
Hitoshi Igarashi
五十嵐 等
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61277150A priority Critical patent/JPS63130767A/en
Publication of JPS63130767A publication Critical patent/JPS63130767A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a thin Ta amorphous alloy film having a high crystallization temp. and excellent mechanical characteristics, corrosion resistance, etc., by bombarding ions to a target material consisting of a Ta alloy contg. Si at a specific ratio and forming a thin film of the target material in a gaseous state on a substrate. CONSTITUTION:After the inside of a vacuum chamber 3 is evacuated 4 to order of 10<-7>Torr, gaseous Ar is introduced 7 therein until order of 10<-3>Torr is attained. Sputtering of the target 1 is then started by turning on a high-frequency power supply 8. The target 1 consists of the Ta alloy contg. Ta in a 60-90at% compsn. range and is kept cooled by a cooling water introducing pipe 10. The substrate 2 is kept cooled down to a room temp. or below by introduced 11 liquid nitrogen N2 12. The structure of the thin Ta-Si alloy film formed on the substrate 2 is evaluated by an X-ray diffraction method. As a result, sharp diffraction peaks by crystals are not observed in the compsn. range of 60-90at% Ta in the compsn. of the thin film. Since a broad halo pattern is obtd., it is verified that the thin amorphous film is obtd.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は高い結晶化温度を有する非晶質合金の製造方法
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for producing an amorphous alloy having a high crystallization temperature.

(従来の技術) 近年、各種の非晶質材料が開発され、金属材料の分野に
おいて、多くの注目を集めている。これらの合金は、従
来の結晶合金とは異なり、結晶構造を持たない合金であ
り、その性質も従来の金属材料にはみられないものが多
く、機械的性質、耐摩耗性、耐食性、軟磁性、電気的性
質などに優れているため、結晶質金属に代わりうる材料
として、各種の用途開発が行われ、さらに、その用途に
適した材料開発も行われている。これらの合金は、従来
、一般に、単ロール法等の液体急冷法によって作製され
ている。
(Prior Art) In recent years, various amorphous materials have been developed and are attracting a lot of attention in the field of metal materials. Unlike conventional crystalline alloys, these alloys do not have a crystalline structure, and many of their properties are not found in conventional metal materials, such as mechanical properties, wear resistance, corrosion resistance, and soft magnetism. Due to its excellent electrical properties, various uses are being developed as a material that can replace crystalline metals, and materials suitable for these uses are also being developed. These alloys have conventionally been generally produced by a liquid quenching method such as a single roll method.

(発明が解決しようとする問題点) 非晶質合金の最大の問題点は、熱的に不安定な点にある
。これは非晶質状態が熱力学的に非平衡な準安定状態で
あるということに由来するもので、非晶質合金の宿命と
もいえることである。即ち、非晶質合金は、一般に、そ
れぞれ特有の結晶化温度を有し、その温度を越えるとよ
り熱的に安定な結晶合金に変化してしまい、非晶質状態
のときにみられた優れた薄着性が全て失われてしまうの
である。この、結晶化温度は、材料によって異なるが、
一般に、絶対温度で測定した融点の0.4〜0.6倍程
度の値をとることが知られている。従って、結晶化温度
の高い合金を得るためには、融点の高い合金を非晶質化
しなければならない。
(Problems to be Solved by the Invention) The biggest problem with amorphous alloys is that they are thermally unstable. This is due to the fact that the amorphous state is a thermodynamically non-equilibrium metastable state, and can be said to be the fate of amorphous alloys. In other words, each amorphous alloy generally has its own specific crystallization temperature, and when that temperature is exceeded, it changes to a more thermally stable crystalline alloy, and the superiority seen in the amorphous state is lost. This results in the loss of all the thin adhesion properties. This crystallization temperature varies depending on the material, but
Generally, it is known that the value is about 0.4 to 0.6 times the melting point measured in absolute temperature. Therefore, in order to obtain an alloy with a high crystallization temperature, an alloy with a high melting point must be made amorphous.

Ta −Si合金は、融点が約2300°C以上ときわ
めて高い。このため液体急冷法によって作製されたTa
−8i系非晶質合金は、その結晶化温度が800°C〜
960°Cと非常に高く、非晶質合金の問題点を大幅に
改善することが可能となった(特願昭61−01238
5号)。さらに、このTa −Si系非晶質合金は、一
般の非晶質合金に特有の高強度、高硬度などの優れた機
械的性質を有しているために、例えば、耐摩耗性材料、
および、温度上昇を伴う電極用材料などへの応用が考え
られる。
The Ta--Si alloy has an extremely high melting point of about 2300°C or higher. For this reason, Ta
-8i amorphous alloy has a crystallization temperature of 800°C ~
The temperature was extremely high at 960°C, making it possible to significantly improve the problems of amorphous alloys (Patent Application No. 61-01238
No. 5). Furthermore, this Ta-Si amorphous alloy has excellent mechanical properties such as high strength and high hardness that are characteristic of general amorphous alloys, so it can be used as a wear-resistant material, for example.
In addition, applications such as materials for electrodes that involve temperature rises are possible.

しかしながら、液体急冷法によって作製されるTa −
Si系非晶質合金は、その形状が幅数mm〜数cmのリ
ボン状であるために、広い面積を有する非晶質合金を得
ることができないという問題点があった。さらに、ある
物質の上に、前記非晶質合金を薄膜状で形成することも
、従来の液体急冷法ではできなかった。
However, Ta-
Since the Si-based amorphous alloy has a ribbon-like shape with a width of several mm to several cm, there is a problem in that it is impossible to obtain an amorphous alloy with a wide area. Furthermore, it has not been possible to form the amorphous alloy in the form of a thin film on a certain substance using conventional liquid quenching methods.

本発明は、このような従来技術の問題点を解決して、高
い結晶化温度を有し、かつ、機械的特性、耐食性等にす
ぐれたTa系非晶質合金薄膜の製造方法を提供すること
を目的とする。
The present invention solves the problems of the prior art and provides a method for producing a Ta-based amorphous alloy thin film that has a high crystallization temperature and has excellent mechanical properties, corrosion resistance, etc. With the goal.

(問題点を解決するための手段) 本発明は、Ta1−、SiXなる式で表され、x=0.
1−0.4である合金を、ターゲット物質にイオンを衝
突させ、前記ターゲット物質をガス状態で飛び出させる
ことにより、基板上に薄膜を形成することによって、非
晶質化することを特徴とするTa系非晶質合金薄膜の製
造方法である。
(Means for solving the problems) The present invention is expressed by the formula Ta1-, SiX, where x=0.
1-0.4 is made amorphous by bombarding the target material with ions and ejecting the target material in a gaseous state to form a thin film on the substrate. This is a method for producing a Ta-based amorphous alloy thin film.

(作用) Ta −Si系合金では、後に実施例で示すように、T
aが60at%〜90at%の組成範囲で、非晶質合金
ができることを本発明者は見いだした。この組成範囲を
はずれると非晶質構造がほとんどみられなくなり、非晶
質合金に特徴的な優れた特性がすべて消失してしまう。
(Function) In Ta-Si alloys, as shown in Examples later, T
The present inventor has discovered that an amorphous alloy can be formed in a composition range in which a is 60 at% to 90 at%. When the composition is outside this range, almost no amorphous structure is observed, and all the excellent properties characteristic of amorphous alloys are lost.

これらの非晶質合金の結晶化温度は、その融点の高さに
対応して、いずれも800°C以上という高い値である
。また、これらの非晶質合金の機械的特性は、非晶質合
金に一般にみられるように、高強度かつ高硬度である。
The crystallization temperatures of these amorphous alloys are as high as 800° C. or higher, corresponding to their high melting points. In addition, the mechanical properties of these amorphous alloys are high strength and high hardness, as is generally seen in amorphous alloys.

また、耐食性においても、Taのすぐれた耐食性に匹敵
するほどの耐食性を有している。
Also, in terms of corrosion resistance, it has corrosion resistance comparable to that of Ta.

本発明による製造方法は、アルゴンガス等の気体原子ま
たは分子を高電界または高周波電界中でイオン化し、さ
らに電界によって加速することにより、ターゲット表面
に衝突させて、ターゲット物質をターゲット表面からた
たき出して、基板上にターゲット物質の薄膜を形成する
ため、大面積で、かつ、均質な合金薄膜を形成すること
が出来る。
The manufacturing method according to the present invention involves ionizing gas atoms or molecules such as argon gas in a high electric field or high-frequency electric field, and further accelerating them by the electric field to cause them to collide with the target surface and knock out the target material from the target surface. Since a thin film of the target material is formed on the substrate, it is possible to form a homogeneous alloy thin film over a large area.

また、ターゲット物質としては、目的組成のTa −S
i合金、あるいは、TaとSiを適当な面積比で組み合
わせた複合物質を利用する。このため、えられる合金薄
膜の組成は、ターゲット合金の組成を変化させることに
より、また、複合物質の面積比を適当に変化させること
により、容易に変化させることか出来るため、目的とす
る組成の非晶質夕 (実施例) 以下、本発明の一実施例を図により詳細に説明する。第
1図に、本発明のTa系非晶質合金薄膜を作製する装置
の一例を示す。第1図に示す装置は高周波二極マグネト
ロンスパッタ装置であり、図において、1はターゲット
、2は基板である。ターゲット1は本実施例においては
、複合ターゲラFを用いた。即ち、直径100mm、厚
さ5mmのTaターゲットの上に、−辺10mmの正方
形で厚さ1mmのSiの板を適当な枚数だけおいた。T
a上において、Si板は、なるべく均一に分布するよう
に設定した。Siの枚数を変化させることにより、得ら
れる合金薄膜の組成を変化させた。基板2には、長さ5
0mm、幅25mmで厚さ0.2mmのガラスを用いた
In addition, the target material is Ta-S with the target composition.
An i-alloy or a composite material in which Ta and Si are combined in an appropriate area ratio is used. Therefore, the composition of the obtained alloy thin film can be easily changed by changing the composition of the target alloy or by appropriately changing the area ratio of the composite material, so that the desired composition can be changed. Amorphous Material (Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an example of an apparatus for producing the Ta-based amorphous alloy thin film of the present invention. The apparatus shown in FIG. 1 is a high-frequency dipole magnetron sputtering apparatus, and in the figure, 1 is a target and 2 is a substrate. As target 1, composite Targetera F was used in this example. That is, an appropriate number of Si plates each having a square side of 10 mm and a thickness of 1 mm were placed on a Ta target having a diameter of 100 mm and a thickness of 5 mm. T
On a, the Si plates were set to be distributed as uniformly as possible. By changing the number of Si sheets, the composition of the resulting alloy thin film was changed. Board 2 has a length of 5
Glass with a diameter of 0 mm, a width of 25 mm, and a thickness of 0.2 mm was used.

薄膜作製に際しては、最初に、バルブ5を開いて、真空
チャンバー3を真空ポンプ4によって、1O−7Tor
r台の真空まで排気する。この後、バリアプルリークバ
ルブ6を開いて、アルゴンガス導入管7よりアルゴンガ
スを1O−3Torr台になるまで導入する。この状態
で高周波電源8の電源を入れることにより、スパッタを
開始させる。投入電力は500Wとした。このとき、タ
ーゲット1は、冷却水導入管10によって水冷されてい
る。また、基板2は、液体窒素導入管11によって導入
された液体窒素12によって、室温以下に冷却されてい
る。これは、Ta系合金薄膜を非晶質化するためには、
水、液体窒素等の冷媒で基板を冷却する必要があるため
である。基板温度を熱電対14を通して、温度計15に
よって測定すると、−180°Cまで冷却されているこ
とがわかった。スパッタの最初の1時間は、シャッター
9を閉じて、プレスパツタを行った。本スパッタ装置は
、ターゲットの裏側に、永久磁石13が取り付けられて
おり、これがターゲット表面に作る磁場によって、高速
スパッタが行なえるようになっている。プレスパツタ終
了後、シャッター9を開いて、基板上に薄膜を作製した
。薄膜作製は、1時間行った。得られた薄膜の厚さは、
511m程度であった。
When producing a thin film, first, open the valve 5 and heat the vacuum chamber 3 to 1O-7 Torr using the vacuum pump 4.
Evacuate to r level of vacuum. Thereafter, the barrier pull leak valve 6 is opened and argon gas is introduced from the argon gas introduction pipe 7 until the pressure reaches 10-3 Torr. In this state, the high frequency power source 8 is turned on to start sputtering. The input power was 500W. At this time, the target 1 is water-cooled by the cooling water introduction pipe 10. Further, the substrate 2 is cooled to below room temperature by the liquid nitrogen 12 introduced by the liquid nitrogen introduction pipe 11. This means that in order to make the Ta-based alloy thin film amorphous,
This is because the substrate needs to be cooled with a coolant such as water or liquid nitrogen. When the substrate temperature was measured by the thermometer 15 through the thermocouple 14, it was found that the substrate was cooled down to -180°C. For the first hour of sputtering, the shutter 9 was closed and press sputtering was performed. In this sputtering apparatus, a permanent magnet 13 is attached to the back side of the target, and high-speed sputtering can be performed by the magnetic field created by this on the target surface. After the press sputtering was completed, the shutter 9 was opened to form a thin film on the substrate. Thin film preparation was performed for 1 hour. The thickness of the obtained thin film is
It was about 511m.

得られたTa −Si合金薄膜の構造をX線回折法に6
0at%〜90at%の組成範囲ではいずれの薄膜も結
晶による鋭い回折ピークはみられず、ブロードなハロー
パターンが得られたことから、非晶質合金薄膜が得られ
たことが確認された。第1表に、示差熱分析で測定した
これらの試料の結晶化温度を示す。いずれも800°C
以上の高い結晶化温度を示している。また、これらの試
料の機械的特性は、ビッカース硬度が800〜1500
の範囲であるという優れた性質を示した。さらに、これ
らの試料は濃塩酸、濃硝酸、濃硫酸、濃王水の中に一日
放置しても何等腐食された様子は見られず、重量変化も
認められなかった。
The structure of the obtained Ta-Si alloy thin film was analyzed using X-ray diffraction method.
In the composition range of 0 at % to 90 at %, no sharp diffraction peak due to crystals was observed in any of the thin films, and a broad halo pattern was obtained, confirming that an amorphous alloy thin film was obtained. Table 1 shows the crystallization temperatures of these samples determined by differential thermal analysis. Both are 800°C
This shows a high crystallization temperature. In addition, the mechanical properties of these samples include Vickers hardness of 800 to 1500.
It showed excellent properties in that it was within the range of . Furthermore, even when these samples were left in concentrated hydrochloric acid, concentrated nitric acid, concentrated sulfuric acid, and concentrated aqua regia for one day, no signs of corrosion were observed, and no change in weight was observed.

なお、本実施例では、高周波二極マグネトロンスパッタ
装置によるTa系非晶質合金薄膜の製造方法を紹介した
が、非晶質薄膜を作製する際に、他のスパッタ方法、即
ち、通常の直流二極スパッタ法、高周波二極スパッタ法
、三極あるいは四極スパッタ法、バイアススパッタ法、
イオンビームス第1表 バッタ法、反応性スパッタ法等を利用してもさしつかえ
ない。
In this example, a method for producing a Ta-based amorphous alloy thin film using a high-frequency bipolar magnetron sputtering device was introduced. However, when producing an amorphous thin film, other sputtering methods, such as ordinary DC Polar sputtering method, high frequency bipolar sputtering method, triode or quadrupole sputtering method, bias sputtering method,
It is also possible to use the ion beam irradiation method, reactive sputtering method, etc.

(発明の効果) 以上詳細に説明したように、本発明によるTa系非晶質
合金薄膜の製造方法は高い結晶化温度を有し、かつ、機
械的特性、耐食性等にすぐれた非晶質合金薄膜が容易に
得られ、その効果は大きい。
(Effects of the Invention) As explained in detail above, the method for producing a Ta-based amorphous alloy thin film according to the present invention is an amorphous alloy that has a high crystallization temperature and has excellent mechanical properties, corrosion resistance, etc. A thin film can be easily obtained and the effect is great.

【図面の簡単な説明】 第1図は、本発明のTa系非晶質合金薄膜を作製する装
置の一例を示す図である。図において、1はターゲット
、2は基板、3はチャンバー、4は真空ポンプ、5は真
空バルブ、6はバリアプルリークバルブ、7はアルゴン
ガス導入管、8は高周波電源、9はシャッター、10は
ターゲット用冷却水導入管、11は基板冷却用液体窒素
導入管、12は液体窒素、13は永久磁石、14は熱電
対、15は温度計である。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing an example of an apparatus for producing a Ta-based amorphous alloy thin film of the present invention. In the figure, 1 is a target, 2 is a substrate, 3 is a chamber, 4 is a vacuum pump, 5 is a vacuum valve, 6 is a barrier pull leak valve, 7 is an argon gas introduction tube, 8 is a high frequency power supply, 9 is a shutter, and 10 is a 11 is a liquid nitrogen introduction pipe for cooling the substrate; 12 is liquid nitrogen; 13 is a permanent magnet; 14 is a thermocouple; and 15 is a thermometer.

Claims (1)

【特許請求の範囲】[Claims] Ta_1−_xSi_xなる式で表され、x=0.1〜
0.4である組成の合金を、ターゲット物質にイオンを
衝突させ、前記ターゲット物質をガス状態で飛び出させ
ることにより、基板上に薄膜を形成するスパッタ装置を
用いて、非晶質化させることを特徴とするTa系非晶質
合金薄膜の製造方法。
It is expressed by the formula Ta_1−_xSi_x, where x=0.1~
An alloy having a composition of 0.4 is made amorphous using a sputtering device that forms a thin film on a substrate by bombarding a target material with ions and ejecting the target material in a gaseous state. A method for producing a Ta-based amorphous alloy thin film.
JP61277150A 1986-11-19 1986-11-19 Production of thin ta amorphous alloy film Pending JPS63130767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61277150A JPS63130767A (en) 1986-11-19 1986-11-19 Production of thin ta amorphous alloy film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61277150A JPS63130767A (en) 1986-11-19 1986-11-19 Production of thin ta amorphous alloy film

Publications (1)

Publication Number Publication Date
JPS63130767A true JPS63130767A (en) 1988-06-02

Family

ID=17579496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61277150A Pending JPS63130767A (en) 1986-11-19 1986-11-19 Production of thin ta amorphous alloy film

Country Status (1)

Country Link
JP (1) JPS63130767A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499035A (en) * 1972-12-26 1979-08-04 Allied Chem Noncrystalline metal wire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499035A (en) * 1972-12-26 1979-08-04 Allied Chem Noncrystalline metal wire

Similar Documents

Publication Publication Date Title
KR100499173B1 (en) Method of making low magnetic permeability cobalt sputter targets
JP4296256B2 (en) Manufacturing method of superconducting material
JP2742631B2 (en) Manufacturing method of amorphous magnetic film
JPH0569892B2 (en)
JP2001523767A (en) Method for manufacturing Ni-Si magnetron sputtering target and target manufactured by the method
JPS63125663A (en) Production of thin amorphous ta-w alloy film
JPS63125665A (en) Production of thin amorphous ta-w alloy film
JPS63130767A (en) Production of thin ta amorphous alloy film
JPS63125664A (en) Production of thin amorphous ta alloy film
Qing-Ming et al. Amorphization of binary alloys by magnetron cosputtering
JPS63125662A (en) Production of thin amorphous ta alloy film
JPS63125670A (en) Production of thin amorphous ta-w alloy film
An et al. Preparation and influencing factors of molybdenum targets and magnetron-sputter-deposited molybdenum thin films
CN111304622A (en) Method for controllably preparing superlattice Sb-Te/Bi-Sb-Te thin film by ion-assisted deposition
Valderrama et al. High-RRR thin-films of NB produced using energetic condensation from a coaxial, rotating vacuum ARC plasma (CEDTM)
US3475309A (en) Method of making paramagnetic nickel ferrite thin films
JPS63140509A (en) Manufacture of magnetically soft film
US3437577A (en) Method of fabricating uniform rare earth iron garnet thin films by sputtering
JPS63130766A (en) Production of thin ta amorphous alloy film
Zhang et al. Nonequilibrium crystalline and amorphous Ti–Pd alloys produced by vapor quenching
JPS63125666A (en) Production of thin amorphous ta alloy film
JPS6350470A (en) Sputtering device
JPS63125669A (en) Production of thin amorphous ta-w alloy film
JPS63125667A (en) Production of thin amorphous ta-w alloy film
Iwatsubo et al. Magnetic characteristics of Fe–N films prepared by reactive ion beam sputtering with a nitrogen bombardment process