JPS63128953A - Manufacture of recording head - Google Patents
Manufacture of recording headInfo
- Publication number
- JPS63128953A JPS63128953A JP27596086A JP27596086A JPS63128953A JP S63128953 A JPS63128953 A JP S63128953A JP 27596086 A JP27596086 A JP 27596086A JP 27596086 A JP27596086 A JP 27596086A JP S63128953 A JPS63128953 A JP S63128953A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electrode
- die
- punch
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 3
- 238000003754 machining Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 description 9
- 238000005553 drilling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/385—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material
- B41J2/41—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material for electrostatic printing
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Dot-Matrix Printers And Others (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ファクシミリ・プリンター等の書き込み用ヘ
ッドとして用いる記録用ヘッドの製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a recording head used as a writing head in a facsimile printer or the like.
従来の技術
イオンフロー記録用ヘッド１は第６図に示すように絶縁
板２の一面に共通電極３を形成し、絶縁板２の他面に制
御電極４を形成し、これら共通電極３、絶縁板２及び制
御電極４にφ０．１〜φ０．３閣程度の貫通穴５を形成
している。而してイオン源６でイオンを発生させ、イオ
ン７０−記録用ヘッド１の共通電極３と制御電極４にか
かる電圧により貫通穴５をブロック状態にしてイオンの
流れを制御し、ドラム７上の誘電体層８に潜像を形成す
ることができる。A conventional ion flow recording head 1 has a common electrode 3 formed on one side of an insulating plate 2 and a control electrode 4 formed on the other side of the insulating plate 2, as shown in FIG. A through hole 5 having a diameter of about 0.1 to 0.3 mm is formed in the plate 2 and the control electrode 4. Then, the ion source 6 generates ions, and the through-hole 5 is blocked by the voltage applied to the ion 70 and the common electrode 3 and control electrode 4 of the recording head 1 to control the flow of ions, and the flow of ions on the drum 7 is controlled. A latent image can be formed on the dielectric layer 8.
従来、上記イオン７０−記録用ヘッドｌの貫通穴５は、
ドリルにより形成している。Conventionally, the through hole 5 of the ion 70-recording head l is
It is formed by a drill.
発明が解決しようとする問題点
しかし、上記従来のようにφ０．１〜φ０．３調の貫通
穴５をドリル加工すると、第５図に示すようにドリル入
口側、すなわち制御電極４側にバリ１０が生じるばかり
でなく、ドリルの出口側、すなわち共通電極３側にバリ
１１が生じ、特にバリ１１は大きいので、パリ仕上げの
後加工を必要とし、またこのパリ仕上げの際に電極表面
の金メッキを剥離してしまう。またバリ１１が残ると、
断線や短絡の原因となる。またドリル加工の場合、工具
が回転しているため、制御電極４にドリル先端が当たる
とき、微妙に位置ずれが生じ、貫通穴５のピッチ精度を
高精度に加工するのに一定の限界がある。 さらにバリ
発生をなるべく少なくしようとすると、加工速度をあま
り高速にすることができず、工具寿命も短い等の問題が
あった。Problems to be Solved by the Invention However, when drilling a through hole 5 with a diameter of φ0.1 to φ0.3 as in the conventional method, a burr is formed on the drill entrance side, that is, on the control electrode 4 side, as shown in FIG. Not only is a burr 10 generated, but also a burr 11 is generated on the exit side of the drill, that is, on the common electrode 3 side.The burr 11 is particularly large, so post-processing is required for burr finishing, and during this burr finishing, the gold plating on the electrode surface is It peels off. Also, if burr 11 remains,
This may cause disconnection or short circuit. In addition, in the case of drilling, since the tool is rotating, when the tip of the drill hits the control electrode 4, a slight positional shift occurs, and there is a certain limit to machining the pitch accuracy of the through hole 5 with high precision. . Furthermore, when attempting to reduce the occurrence of burrs as much as possible, there were problems such as the machining speed not being able to be made very high and the tool life being shortened.
そこで、本発明は、上記従来例の問題点を解決するもの
で、パリを少なくしてパリ仕上げを不要にすることがで
き、また貫通穴のピッチ精度を高精度にして形成するこ
とができ、また加工速度を向上することができ、さらに
は工具寿命の延長化を図ることができるようにした記録
用ヘッドの製造方法を提供しようとするものである。Therefore, the present invention solves the problems of the above-mentioned conventional example, and can reduce the number of burrs and eliminate the need for burr finishing, and can form through holes with high pitch accuracy. Another object of the present invention is to provide a method for manufacturing a recording head that can increase processing speed and extend tool life.
問題点を解決するための手段
そして、上記問題点を解決するための本発明の技術的な
手段は、直径の加工精度がプラス、マイナス２μｍ以下
のポンチとダイスの穴を対向させ、そのクリアランスが
１０μｍ以下になるように配置し、絶縁板の一面に第１
電極を形成し、他面に第１電極と対応する第２電極を形
成したヘッド材を上記ダイス上に置き、上記ヘッド材に
おける穴明は箇所の周囲を上記ダイスに押し寸けて固定
し、固定後、ポンチとダイスによシ貫通穴を明けるよう
にしたものである。Means for Solving the Problems The technical means of the present invention for solving the above problems is to make the holes of a punch and die face each other and have a diameter machining accuracy of plus or minus 2 μm or less, and the clearance between them is The first layer is placed on one side of the insulating plate so that the thickness is 10 μm or less
A head material on which an electrode is formed and a second electrode corresponding to the first electrode formed on the other side is placed on the die, and the hole in the head material is fixed by pressing the periphery of the hole to the die, After fixing, a through hole is made using a punch and die.
作用 上記技術的手段による作用は次のようになる。action The effects of the above technical means are as follows.
すなわち、高精度に加工されたポンチとダイスを用い、
しかもポンチとダイスのクリアランスを１０μｍ以下に
し、孔明は時にその周囲を押し付けて固定するので、パ
リの発生が少なくなり、パリ仕上げ加工が不要となる。In other words, using punches and dies processed with high precision,
Moreover, the clearance between the punch and the die is set to 10 μm or less, and the periphery of the hole is sometimes pressed to fix it, so that the occurrence of burr is reduced and burr finishing is not required.
またポンチとダイスのクリアランスが少ないため、貫通
穴のピッチ精度が高くなる。またドリル加工に比べ、加
ニスピードを早めることができ、さらには工具寿命も、
小径ドリルに比べ長くなる。Additionally, since there is less clearance between the punch and die, the pitch accuracy of the through holes is increased. In addition, compared to drilling, machining speed can be increased, and tool life can be shortened.
It is longer than a small diameter drill.
実施例
以下、本発明の実施例について図面を参照しながら説明
する。第１図乃至第４図は本発明の一実施例を示し、第
１図はポンチとダイスを示す断面図、第２図はポンチに
よる孔明は前の状態を示す断面図、第３図はポンチによ
る孔明は時：の状態を示す断面図、第４図は貫通穴を形
成した状態の拡大断面−である。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings. 1 to 4 show an embodiment of the present invention, FIG. 1 is a cross-sectional view showing a punch and die, FIG. 2 is a cross-sectional view showing the state before drilling with the punch, and FIG. FIG. 4 is an enlarged cross-sectional view of the state in which the through hole is formed.
ｇ？Ｊ１図に示すようにポンチ１２とダイス１３を上下
に対向して配置する。ポンチ１２の直径ａは３００μｍ
以下で、貫通穴５を形成するのに必要な直径寸法に対し
、プラス、マイナス２μｍ以内に製作する。ダイス１３
はその穴１４がポンチ１２より離隔するに従い次第に拡
開し、ポンチ１２と同様に必要な直径寸法に対し、プラ
ス、マイナス２μｍ以内となるように製作する。そして
ポンチ１２とダイス１３の穴１４のクリアランス（隙間
）ｂが均一に、しかも１０μｍ以下にな右ように心合わ
せする。次に第２図に示すように、□予め絶縁板２の一
方の面に制御電極である第１の電極４を形成し、他方の
面に第１の電極４に対応して共通電極である第２電極３
を形成したヘッド材１５を第１の電極４が上向きとなる
ようにダイス１３上に置き、このヘッド材１５における
穴明は箇所の周囲をブロック１６によりダイス１３に押
し付けて固定する。次に第３図に示□すようにポンチ′
１２を下降させ、第１の電極４、絶縁板２及び耐２の電
極３に貫通穴５を形成する。このプレス加工による貫通
穴邑は第４図に示すようにポンチ１２例のバリ１７は絶
縁板２側に発生するので、問題はなく。G? As shown in Figure J1, the punch 12 and die 13 are arranged vertically facing each other. The diameter a of the punch 12 is 300 μm
In the following, the diameter dimension required for forming the through hole 5 is manufactured within plus or minus 2 μm. Dice 13
The hole 14 gradually widens as the distance from the punch 12 increases, and like the punch 12, the hole 14 is manufactured so that it is within plus or minus 2 μm of the required diameter. Then, the punch 12 and the die 13 are aligned so that the clearance (gap) b between the holes 14 is uniform and less than 10 μm. Next, as shown in FIG. 2, a first electrode 4 which is a control electrode is formed in advance on one surface of the insulating plate 2, and a common electrode corresponding to the first electrode 4 is formed on the other surface. Second electrode 3
The head material 15 in which the head material 15 is formed is placed on the die 13 with the first electrode 4 facing upward, and the periphery of the hole in the head material 15 is pressed against the die 13 by a block 16 and fixed. Next, punch ' as shown in Figure 3.
12 is lowered, and a through hole 5 is formed in the first electrode 4, the insulating plate 2, and the electrode 3 of the resistor 2. As shown in FIG. 4, the burr 17 of the punch 12 is generated on the insulating plate 2 side of the through hole formed by this press working, so there is no problem.
またダイス１３側のバリ１８は外側へ突出してもその大
きさは、仕上げが不要な程度であった。Further, even if the burr 18 on the die 13 side protruded outward, its size was such that finishing was not necessary.
なお、上記実施例ではポンチ１２を一個のみ示している
が、貫通穴５は一個ずつ形成してもよく、また多数のポ
ンチ１２を用いて一度に多数個形成してもよい。Although only one punch 12 is shown in the above embodiment, the through holes 5 may be formed one by one, or may be formed in large numbers at once using a large number of punches 12.
発明の効果
以上述べたように本発明によれば、直径の加工精度がプ
ラス、マイナス２μｍ以下のポンチとダイスの穴を対向
させ、そのクリアランスが１０μｍ以下になるように配
置し、ヘッド材をダイス上に置き、ヘッド材における穴
明は箇所の周囲をダイスに押し吋けて固定し、ポンチと
ダイスにより貫通穴を形成するようにしている。従って
パリの発生が少なくなり、パリ仕上げ加工が不要となる
。またポンチとダイスのクリアランスが少ないため、貫
通穴のピッチ精度が高くなる。またドリル加工に比べ、
加ニスピードを早めることができ、さらには工具寿命も
、小径ドリルに比べ長くなる。Effects of the Invention As described above, according to the present invention, the holes of the punch and die, which have a diameter machining accuracy of plus or minus 2 μm or less, are arranged to face each other, and the clearance between them is 10 μm or less, and the head material is placed in the die. Place the hole on top of the head material and press and fix the periphery of the head material to a die, and use the punch and die to form a through hole. Therefore, the occurrence of burr is reduced, and burr finishing is not required. Additionally, since there is less clearance between the punch and die, the pitch accuracy of the through holes is increased. Also, compared to drilling,
The cutting speed can be increased, and the tool life is also longer than that of a small diameter drill.
第１図乃至第４図は本発明の一実施例における記録用ヘ
ッドの製造方法を示し、第１図はポンチとダイスを示す
断面図、第２図はポンチによる孔明は前の状態を示す断
面図、第３図はポンチによる孔明は時の状態を示す断面
図、第４図は貫通穴を形成した状態の拡大断面図、第５
図は従来のドリル加工により貫通穴を形成した状態の拡
大断面図、第６図はイオンフロー記録用ヘッドによるイ
オンフロー記録の原理説明図である。
１・・・記録ヘッド、２・・・絶縁板、３・・・第２の
電極（共通電極）、４・・・第１の電極（制御電極）、
５・・・貫通穴、１２・・・ポンチ、１３・・・ダイス
、１５ ・・・ヘッド材、１６・・・ブロック。
第 １ 図
Ｎ ２ 図
第 ３ 図
第 ５ 図
箪６図1 to 4 show a method of manufacturing a recording head according to an embodiment of the present invention, FIG. 1 is a cross-sectional view showing a punch and die, and FIG. 2 is a cross-sectional view showing a state before drilling with a punch. Figure 3 is a cross-sectional view showing the state when the hole has been punched, Figure 4 is an enlarged cross-sectional view of the state where the through hole has been formed, and Figure 5
The figure is an enlarged sectional view of a through hole formed by conventional drilling, and FIG. 6 is an explanatory diagram of the principle of ion flow recording using an ion flow recording head. DESCRIPTION OF SYMBOLS 1... Recording head, 2... Insulating plate, 3... Second electrode (common electrode), 4... First electrode (control electrode),
5...Through hole, 12...Punch, 13...Dice, 15...Head material, 16...Block. Fig. 1 Fig. N 2 Fig. 3 Fig. 5 Fig. 6
Claims (1)
とダイスの穴を対向させ、そのクリアランスが１０μｍ
以下になるように配置し、絶縁板の一面に第１電極を形
成し、他面に第１電極と対応する第２電極を形成したヘ
ッド材を上記ダイス上に置き、上記ヘッド材における穴
明け箇所の周囲を上記ダイスに押し付けて固定し、固定
後、ポンチとダイスにより貫通穴を明けることを特徴と
する記録用ヘッドの製造方法。Punch and die holes with a diameter machining accuracy of plus or minus 2 μm or less are placed opposite each other, and the clearance between them is 10 μm.
A head material arranged as shown below, with a first electrode formed on one side of the insulating plate and a second electrode corresponding to the first electrode formed on the other side, is placed on the die, and a hole is made in the head material. A method for manufacturing a recording head, characterized in that the periphery of the location is pressed against the die and fixed, and after fixation, a through hole is punched using a punch and a die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27596086A JPS63128953A (en) | 1986-11-19 | 1986-11-19 | Manufacture of recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27596086A JPS63128953A (en) | 1986-11-19 | 1986-11-19 | Manufacture of recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128953A true JPS63128953A (en) | 1988-06-01 |
Family
ID=17562820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27596086A Pending JPS63128953A (en) | 1986-11-19 | 1986-11-19 | Manufacture of recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128953A (en) |
-
1986
- 1986-11-19 JP JP27596086A patent/JPS63128953A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19853703A1 (en) | Chip production, especially for a chip card, comprises applying metallization onto a thinned finished chip wafer, bonded to a handling wafer, for connection by vias to the chip metallization and/or circuit structure | |
| EP0278288A1 (en) | Drilling tool for working materials producing long chips | |
| US4048835A (en) | Method of punching a small hole in a precision mechanics workpiece | |
| JPS63128953A (en) | Manufacture of recording head | |
| JPS6336932A (en) | Working method for countersunk screw hole | |
| KR20190009889A (en) | Blanking dies and the manufacturing method of this | |
| JPH06179088A (en) | Method for working metal sheet and manufacture of lead frame | |
| KR0147652B1 (en) | Manufacture method of lead frame | |
| JP2717001B2 (en) | Printed wiring board | |
| JP2843645B2 (en) | Metal plate processing method | |
| JP3136522B2 (en) | Cathode ray tube electron gun electrode | |
| JPS61224489A (en) | Manufacture of head for ion flow recording | |
| JPS62117759A (en) | Preparation of head for ion flow recording | |
| EP1002337A1 (en) | Semiconductor chip packaging and method for the production thereof | |
| JPH02150044A (en) | Film carrier | |
| CN113099613A (en) | Secondary drilling explosion-proof method for circuit board | |
| JP2784352B2 (en) | Lead frame manufacturing method | |
| JPS61177790A (en) | Printed wiring board and manufacture thereof | |
| JPH07136861A (en) | Manufacture of pin plate for metal mold | |
| JPH0335910A (en) | Counterbore machining method for printed board | |
| JPS61224487A (en) | Manufacture of head for ion flow recording | |
| JPH05190718A (en) | Manufacture of lead frame | |
| JPH08181411A (en) | Outer shape processing method of printed wiring board | |
| JPS58213498A (en) | Method of producing printed board | |
| JPH05302181A (en) | Method for etching metallic thin sheet |