JPS63128736U - - Google Patents
Info
- Publication number
- JPS63128736U JPS63128736U JP2123787U JP2123787U JPS63128736U JP S63128736 U JPS63128736 U JP S63128736U JP 2123787 U JP2123787 U JP 2123787U JP 2123787 U JP2123787 U JP 2123787U JP S63128736 U JPS63128736 U JP S63128736U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- heat
- electronic components
- electronic component
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2123787U JPH0353510Y2 (enrdf_load_stackoverflow) | 1987-02-16 | 1987-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2123787U JPH0353510Y2 (enrdf_load_stackoverflow) | 1987-02-16 | 1987-02-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128736U true JPS63128736U (enrdf_load_stackoverflow) | 1988-08-23 |
| JPH0353510Y2 JPH0353510Y2 (enrdf_load_stackoverflow) | 1991-11-22 |
Family
ID=30817495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2123787U Expired JPH0353510Y2 (enrdf_load_stackoverflow) | 1987-02-16 | 1987-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353510Y2 (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591699B2 (ja) * | 2005-10-19 | 2010-12-01 | 信越化学工業株式会社 | 発熱性電子部品用カバー及びカバーの装着方法 |
-
1987
- 1987-02-16 JP JP2123787U patent/JPH0353510Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353510Y2 (enrdf_load_stackoverflow) | 1991-11-22 |