JPS6312839U - - Google Patents
Info
- Publication number
- JPS6312839U JPS6312839U JP1986074854U JP7485486U JPS6312839U JP S6312839 U JPS6312839 U JP S6312839U JP 1986074854 U JP1986074854 U JP 1986074854U JP 7485486 U JP7485486 U JP 7485486U JP S6312839 U JPS6312839 U JP S6312839U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit boards
- frame
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 2
- 238000010396 two-hybrid screening Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例の枠体の平面図、第３図は従来例を示
す断面図である。
１，２……混成集積回路基板、３……外部リー
ド、４……枠体、５……仕切板、６……樹脂層、
７……回路素子、８……基板ストツパー、９……
側体部。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of the frame of this embodiment, and FIG. 3 is a sectional view showing a conventional example. 1, 2...Mixed integrated circuit board, 3...External lead, 4...Frame body, 5...Partition plate, 6...Resin layer,
7... Circuit element, 8... Board stopper, 9...
Lateral body part.
Claims (1)
と、該二枚の混成集積回路基板の少なくとも一周
辺から導出された外部リードと、該外部リードが
対向する様に前記二枚の混成集積回路基板を離間
して固定する枠体と、該枠体と前記二枚の混成集
積回路基板の周辺とで形成された空間部に注入さ
れて設けられた樹脂層とを備えた混成集積回路に
おいて、前記外部リードが存在する空間部内で且
つ前記二枚の混成集積回路基板の略中央部に仕切
板を形成し、前記樹脂層を二分割することを特徴
とする混成集積回路。 two hybrid integrated circuit boards to which circuit elements are fixed; external leads led out from at least one periphery of the two hybrid integrated circuit boards; and two hybrid integrated circuit boards with the external leads facing each other. A hybrid integrated circuit comprising a frame for fixing a substrate at a distance, and a resin layer injected into a space formed by the frame and the periphery of the two hybrid integrated circuit boards, A hybrid integrated circuit characterized in that a partition plate is formed in the space where the external lead exists and approximately at the center of the two hybrid integrated circuit boards to divide the resin layer into two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074854U JPH0436122Y2 (en) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074854U JPH0436122Y2 (en) | 1986-05-19 | 1986-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6312839U true JPS6312839U (en) | 1988-01-27 |
| JPH0436122Y2 JPH0436122Y2 (en) | 1992-08-26 |
Family
ID=30920458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986074854U Expired JPH0436122Y2 (en) | 1986-05-19 | 1986-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436122Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072831U (en) * | 1993-06-14 | 1995-01-17 | 株式会社グランディ | Water filter cleaner |
-
1986
- 1986-05-19 JP JP1986074854U patent/JPH0436122Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072831U (en) * | 1993-06-14 | 1995-01-17 | 株式会社グランディ | Water filter cleaner |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436122Y2 (en) | 1992-08-26 |
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